摘要:
A memory comprising: a plurality of memory cells arranged in a plurality of rows and a plurality of columns. A column of the plurality of columns including a first power supply node configured to provide a first voltage, a second power supply node configured to provide a second voltage, a plurality of internal supply nodes electrically coupled together and configured to receive the first voltage or the second voltage for a plurality of memory cells in the column and a plurality of internal ground nodes. The internal ground nodes electrically coupled together and configured to provide at least two current paths for the plurality of memory cells in the column.
摘要:
A high voltage generation circuit for a semiconductor memory device comprising a high voltage detector for detecting a high voltage, a ring oscillator for generating a pulse signal in response to an output signal from the high voltage detector when a power-up signal is made active, a high voltage pump circuit for performing a charge pumping operation to generate the high voltage and transfer the generated high voltage to a high voltage output terminal, and a pump controller for controlling the charge pumping operation of the high voltage pump circuit in response to the pulse signal from the ring oscillator. The high voltage generation circuit further comprises an operating voltage detector for detecting whether an external voltage from an external voltage source has an operating voltage level, a burn-in test voltage detector for detecting whether the external voltage from the external voltage source has a level higher than the operating voltage level, a switching circuit for transferring the external voltage from the external voltage source to the high voltage output terminal, and a driver for selectively driving the high voltage detector and the switching circuit in response to output signals from the operating voltage detector and burn-in test voltage detector.
摘要:
Methods, systems, and apparatus for reducing power consumption or signal distortions in a semiconductor device package. The semiconductor device package includes a semiconductor device, a first electric path, a second electric path, and an isolation element in the first electric path. The second electric path is electrically connected to the first electric path and a functional unit of the device. The isolation element separates an isolated portion in the first electric path from the second electric path, where the isolation element is configured to reduce current in the isolated portion when a signal is passing through the second electric path.
摘要:
A memory array comprises a plurality of memory cells arranged in a plurality of rows and a plurality of columns. A column of the plurality of columns includes a first power supply node configured to provide a first voltage, a second power supply node configured to provide a second voltage, and a plurality of internal supply nodes electrically coupled together and configured to receive the first voltage or the second voltage for a plurality of memory cells in the column and a plurality of internal ground nodes. The internal ground nodes are electrically coupled together and configured to provide at least two current paths for the plurality of memory cells in the column.
摘要:
A memory device having a plurality of pipelatch circuits storing data from memory cells via global input/output lines, a pipelatch input control circuit to selectively couple the pipelatch circuit to the global input/output lines in response to a pipelatch control signal, and a pipe count signal generator to control a data path between the pipelatch circuits and an output driver, wherein the pipelatch input control circuit includes: a first control signal generator receiving a first control signal and global input/output line signals and producing a pass gate control signal; a second control signal generator receiving the first control signal and the pass gate control signal and producing a plurality of second control signals; a third control signal generator receiving the pass gate control signal and producing a third control signal by combining the pass gate control signal and a delay signal of the pass gate control signal; and a fourth control signal generator receiving the first control signal, the plurality of second control signals and the third control signal and producing the pipelatch control signal.
摘要:
A wafer burn-in test circuit of a semiconductor memory device which can provide a burn-in stress voltage by only using a prior word line driver without additional devices or circuits. The wafer burn-in test circuit of the present invention comprises a row address pre-decoding circuit for selecting and driving a predetermined word line by a combination composed of row address signals, a word line driving control circuit for outputting a first signal to selectively drive the word line when at least one signal among address signals pre-decoded by the row address pre-decoding circuit is enabled, and outputting a second signal to enable the all word lines with no relation to a logic status of the address signals when a wafer burn-in signal is inputted, and a row decoder circuit for receiving output signals provided from the row address pre-decoding circuit and the word line driving control circuit therein, and for selectively driving the word line by the address signal in a normal mode of operation and simultaneously driving a plurality of word lines in a wafer burn-in mode of operation.
摘要:
A wafer burn-in circuit for a semiconductor memory device which can detect defected cells in an early stage and increase a yield by applying a stress to bit lines in a wafer state to detect the defected cells and repair the same according to the present invention, is disclosed. To this end, a wafer burn-in circuit for a semiconductor memory device according to the invention includes an equalizing means for bit line for equalizing said bit lines at a standby operation stage, wherein the equalizing means for bit line is controlled by a first precharge signal for bit line. A stress inputting means for bit line is provided to input a stress voltage to the bit lines at a wafer burn-in operation stage, wherein the stress inputting means for bit line is controlled by a second precharge signal for bit line. A stress transferring means for bit line is also provided to make its output to be in a floating state at an normal operation stage, whereas it outputs a stress voltage to the stress inputting means for bit lines at the wafer burn-in operation stage.
摘要:
A self-refresh period adjustment circuit for a semiconductor memory device. The self-refresh period adjustment circuit comprises a ring oscillator for generating a pulse signal with a fixed period for a self-refresh operation of the semiconductor memory device, a leakage current detector for detecting the amount of leakage current produced as charges stored in memory cells in the semiconductor memory device are discharged, and at least two temperature detectors for detecting a temperature variation of the semiconductor memory device, each of the at least two temperature detectors including a voltage divider and a comparator. The voltage divider divides a supply voltage and supplies the divided result as a reference signal to the comparator. The comparator compares an output signal from the leakage current detector with the reference signal from the voltage divider. The self-refresh period adjustment circuit further comprises at least two frequency dividers, each of the at least two frequency dividers dividing a frequency of an output signal from the ring oscillator at a desired ratio in response to an output signal from a corresponding one of the at least two temperature detectors to adjust a self-refresh period of the semiconductor memory device.