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    WAFER DIVIDING APPARATUS AND LASER PROCESSING APPARATUS
    1.
    发明申请
    WAFER DIVIDING APPARATUS AND LASER PROCESSING APPARATUS 有权
    波浪分割装置和激光加工装置

    公开(公告)号：US20110147349A1

    公开(公告)日：2011-06-23

    申请号：US12968733

    申请日：2010-12-15

    Applicant: Chikara Aikawa ,  Jun Abatake ,  Yasuyoshi Yubira ,  Hiroto Yoshida

    Inventor： Chikara Aikawa ,  Jun Abatake ,  Yasuyoshi Yubira ,  Hiroto Yoshida

    IPC: H01L21/463 ,  B28D5/00

    CPC classification number: B28D5/0011 ,  B23K26/0853 ,  B23K26/702

    Abstract: A wafer dividing apparatus for dividing a wafer along a plurality of crossing streets in the condition where the wafer is attached to the upper surface of a dicing tape supported to an annular frame and the strength of the wafer is reduced along the streets. The wafer dividing apparatus includes a frame holding unit for holding the annular frame, a wafer holding table having a holding surface for holding the wafer through the dicing tape supported to the annular frame held by the frame holding unit, a tape expanding unit for relatively moving the frame holding unit and the wafer holding table in a direction perpendicular to the holding surface of the wafer holding table to thereby expand the dicing tape, and a vibration generating unit for applying vibration to the holding surface of the wafer holding table.

    Abstract translation: 一种晶圆分割装置，用于在将晶片安装在支撑在环形框架上的切割带的上表面的状态下沿着多个交叉街道分割晶片，并且晶片的强度沿街道减小。 晶片分割装置包括用于保持环形框架的框架保持单元，具有用于保持晶片的保持表面的晶片保持台通过支撑在由框架保持单元保持的环形框架的切割带，用于相对移动的带扩展单元 框架保持单元和晶片保持台在垂直于晶片保持台的保持表面的方向上，从而扩大切割带;以及振动产生单元，用于向晶片保持台的保持表面施加振动。

    Polyamide fiber cords for rubber reinforcement
    3.
    发明授权
    Polyamide fiber cords for rubber reinforcement 失效
    用于橡胶增强的聚酰胺纤维帘线

    公开(公告)号：US5733654A

    公开(公告)日：1998-03-31

    申请号：US262383

    申请日：1994-06-20

    Applicant: Norio Inada ,  Hiroto Yoshida

    Inventor： Norio Inada ,  Hiroto Yoshida

    IPC: C08J5/06 ,  D06M15/693 ,  B32B27/34

    CPC classification number: C08J5/06 ,  D06M15/693 ,  C08J2321/00 ,  Y10T428/2913 ,  Y10T428/2933 ,  Y10T428/2935 ,  Y10T428/2969

    Abstract: Polyamide fiber cords for rubber reinforcement are produced by subjecting cords having a denier per filament of 1.5-10 to RFL adhesive solution having a swelling ratio in DMSO of 122-340% at an impregnated state in cord, embedding the thus treated cords in rubber and vulcanizing them, and have a cord strength in rubber of not less than 8.0 g/d. They provide excellent fatigue resistance under repetitive compressive strain without lowering strength in the dipping and vulcanization.

    Abstract translation: 用于橡胶增强的聚酰胺纤维帘线通过在帘线中浸渍的状态下将具有1.5-10旦尼尔旦尼尔的纤维的纤维缠绕在绳索中的在DMSO中的溶胀比为122-340％的RFL粘合剂溶液，将如此处理的帘线嵌入橡胶中， 硫化，橡胶帘线强度不小于8.0g / d。 它们在重复的压缩应变下提供优异的抗疲劳性，而不会降低浸渍和硫化中的强度。

    Pneumatic tire having tread including pairs of sipes
    5.
    发明授权
    Pneumatic tire having tread including pairs of sipes 有权
    具有胎面的气动轮胎包括一对刀槽花纹

    公开(公告)号：US06571844B1

    公开(公告)日：2003-06-03

    申请号：US09619499

    申请日：2000-07-19

    Applicant: Naoya Ochi ,  Masaharu Kimura ,  Makoto Kurokawa ,  Hiroshi Kawabe ,  Hiroto Yoshida

    Inventor： Naoya Ochi ,  Masaharu Kimura ,  Makoto Kurokawa ,  Hiroshi Kawabe ,  Hiroto Yoshida

    IPC: B60C1111

    CPC classification number: B60C11/11 ,  B60C11/12 ,  B60C11/1263 ,  B60C11/13 ,  B60C11/1315 ,  B60C2011/1213 ,  B60C2011/1245 ,  B60C2011/147 ,  Y10S152/03 ,  Y10S152/902

    Abstract: Sipes extending from one end of a block to the central area of the block and sipes extending from the other end of the block to the central area of the block (sipes 24, 28, 32 and 36) are inclined in directions opposite to each other. The sipes extending from one end of the block and the sipes extending from the other end of the block intersect a common line extending along the circumferential direction of the tire. Due to this structure, the number of portions of the sipes, which portions are located in the central area of the block, is made greater than that in the peripheral area of the block. The density of sipes is thus increased in the central area of a block where water tends to form when driving on ice, for improving braking and traction properties on ice.

    Abstract translation: 从块的一端延伸到块的中心区域的刀槽花纹和从块体的另一端延伸到块的中心区域（刀槽花纹24,28,32和36）的刀槽花纹在彼此相反的方向上倾斜 。 从块的一端延伸的刀槽花纹和从块的另一端延伸的刀槽花纹与沿着轮胎的圆周方向延伸的公共线相交。 由于这种结构，刀槽花纹的部分位于块的中心区域中的部分的数量大于块的周边区域中的部分的数量。 因此，当在冰上行驶时容易形成水的块的中心区域中，刀槽花纹的密度增加，以提高冰上的制动和牵引性能。

    Wafer dividing apparatus and laser processing apparatus
    6.
    发明授权
    Wafer dividing apparatus and laser processing apparatus 有权
    晶圆分割装置和激光加工装置

    公开(公告)号：US08642920B2

    公开(公告)日：2014-02-04

    申请号：US12968733

    申请日：2010-12-15

    Applicant: Chikara Aikawa ,  Jun Abatake ,  Yasuyoshi Yubira ,  Hiroto Yoshida

    Inventor： Chikara Aikawa ,  Jun Abatake ,  Yasuyoshi Yubira ,  Hiroto Yoshida

    IPC: B23K26/16 ,  H01L21/00

    CPC classification number: B28D5/0011 ,  B23K26/0853 ,  B23K26/702

    Abstract: A wafer dividing apparatus for dividing a wafer along a plurality of crossing streets in the condition where the wafer is attached to the upper surface of a dicing tape supported to an annular frame and the strength of the wafer is reduced along the streets. The wafer dividing apparatus includes a frame holding unit for holding the annular frame, a wafer holding table having a holding surface for holding the wafer through the dicing tape supported to the annular frame held by the frame holding unit, a tape expanding unit for relatively moving the frame holding unit and the wafer holding table in a direction perpendicular to the holding surface of the wafer holding table to thereby expand the dicing tape, and a vibration generating unit for applying vibration to the holding surface of the wafer holding table.

    Abstract translation: 一种晶圆分割装置，用于在将晶片安装在支撑在环形框架上的切割带的上表面的状态下沿着多个交叉街道分割晶片，并且晶片的强度沿街道减小。 晶片分割装置包括用于保持环形框架的框架保持单元，具有用于保持晶片的保持表面的晶片保持台通过支撑在由框架保持单元保持的环形框架的切割带，用于相对移动的带扩展单元 框架保持单元和晶片保持台在垂直于晶片保持台的保持表面的方向上，从而扩大切割带;以及振动产生单元，用于向晶片保持台的保持表面施加振动。

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