公开(公告)号：US06672503B2

公开(公告)日：2004-01-06

申请号：US09960042

申请日：2001-09-21

申请人： Siu Wing Or ,  Honghai Zhu ,  Yam Mo Wong ,  Honyu Ng

发明人： Siu Wing Or ,  Honghai Zhu ,  Yam Mo Wong ,  Honyu Ng

IPC分类号： B23K3102

CPC分类号： H01L24/78 ,  B23K20/10 ,  H01L24/85 ,  H01L2224/78301 ,  H01L2224/85 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/12042 ,  H01L2924/3011 ,  H01L2224/48 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00

摘要： A method of bonding wires between a semiconductor die and a substrate on which the die is mounted includes providing an ultrasonic transducer (1). The transducer (1) includes an ultrasonic energy generation device (2), an ultrasonic vibration amplifying device (3) coupled at one end (10) to the ultrasonic energy generation device (2), a bonding tool (5) coupled to the opposite end (12) of the ultrasonic vibration amplifying device (3), and a mounting structure (4) located between the ends (10, 12) of the ultrasonic vibration amplifying device (3). The method also includes performing a first wire bond by operating the ultrasonic transducer (1) at a first ultrasonic frequency and performing a second wire bond by operating the ultrasonic transducer (1) at a second ultrasonic frequency, the second ultrasonic frequency being different from the first ultrasonic frequency.

摘要翻译： 在半导体管芯和安装有管芯的基板之间接合引线的方法包括提供超声波换能器（1）。 换能器（1）包括超声波能量产生装置（2），超声波振动放大装置（3），其在一端（10）耦合到超声能量产生装置（2），接合工具（5） 超声波振动放大装置（3）的端部（12）和位于超声波振动放大装置（3）的端部（10,12）之间的安装结构（4）。 该方法还包括通过以第一超声波频率操作超声波换能器（1）来执行第一引线接合，并且以超声波频率超声波振荡器（1）进行第二引线接合，第二超声波频率不同于 第一超声波频率。