公开(公告)号：US08268394B2

公开(公告)日：2012-09-18

申请号：US10595323

申请日：2004-10-08

Applicant: Pier John Anthony Sazio ,  John Victor Badding ,  Dan William Hewak ,  Steven Melvyn Howdle

Inventor： Pier John Anthony Sazio ,  John Victor Badding ,  Dan William Hewak ,  Steven Melvyn Howdle

IPC: B05D5/00 ,  B05D5/06 ,  B05D7/22 ,  B05D3/02 ,  B05D3/06 ,  H01L21/36 ,  H01L21/00

CPC classification number: G02B6/02385 ,  C03B19/00 ,  C03B37/0122 ,  C03B2201/58 ,  C03B2203/42 ,  C03C13/04 ,  C03C25/104 ,  G02B1/007 ,  G02B6/0229 ,  G02B6/02352 ,  G02B6/02357 ,  G02B6/02371 ,  G02B6/0238

Abstract: A method of fabricating a metamaterial is provided, comprising providing a sample of engineered microstructured material that is transparent to electromagnetic radiation and comprises one or more voids, passing through the voids a high pressure fluid comprising a functional material carried in a carrier fluid, and causing the functional material to deposit or otherwise integrate into the engineered microstructured material to form the metamaterial. Many microstructured materials and functional materials can be used, together with various techniques for controlling the location of the integration of the functional material within the microstructured material, so that a wide range of different metamaterials can be produced.

Abstract translation: 提供了一种制造超材料的方法，包括提供对电磁辐射透明的工程化微结构材料的样品，并且包括一个或多个空隙，通过空隙将包含承载在载体流体中的功能材料的高压流体引入， 功能材料沉积或以其他方式整合到工程化微结构材料中以形成超材料。 可以使用许多微结构材料和功能材料，以及用于控制功能材料在微结构材料内的整合位置的各种技术，从而可以产生宽范围的不同的超材料。

公开(公告)号：US20080138571A1

公开(公告)日：2008-06-12

申请号：US10595321

申请日：2004-10-08

Applicant: Pier John Anthony Sazio ,  John Victor Badding ,  Dan William Hewak

Inventor： Pier John Anthony Sazio ,  John Victor Badding ,  Dan William Hewak

IPC: B32B3/24 ,  H01L21/20

CPC classification number: G02B6/02385 ,  C03B19/00 ,  C03B37/0122 ,  C03B2201/58 ,  C03B2203/42 ,  C03C13/04 ,  C03C25/104 ,  C23C4/123 ,  C23C16/045 ,  C23C16/45557 ,  G02B1/002 ,  G02B6/0229 ,  G02B6/02352 ,  G02B6/02357 ,  G02B6/02371 ,  G02B6/0238 ,  Y10T428/24273

Abstract: A method of fabricating a semiconductor metamaterial is provided, comprising providing a sample of engineered microstructured material that is transparent to electromagnetic radiation and comprises one or more elongate, high aspect ratio voids, passing through the voids a high pressure fluid comprising a semiconductor material carried in a carrier fluid, and causing the semiconductor material to deposit onto the surface of the one or more voids of the engineered microstructured material to form the metamaterial. Many microstructured materials and semiconductor materials can be used, together with various techniques for controlling the location, spatial extent, and thickness of the deposition of the semiconductor within the microstructured material, so that a wide range of different metamaterials can be produced.

Abstract translation: 提供一种制造半导体超材料的方法，其包括提供对电磁辐射透明的工程化微结构材料的样品，并且包括一个或多个细长的高纵横比空隙，穿过所述空隙，包含承载在其中的半导体材料的高压流体 载体流体，并且使半导体材料沉积到工程化微结构材料的一个或多个空隙的表面上以形成超材料。 可以使用许多微结构材料和半导体材料以及用于控制半导体在微结构化材料内的沉积的位置，空间范围和厚度的各种技术，从而可以产生宽范围的不同的超材料。

公开(公告)号：US07799663B2

公开(公告)日：2010-09-21

申请号：US10595321

申请日：2004-10-08

Applicant: Pier John Anthony Sazio ,  John Victor Badding ,  Dan William Hewak

Inventor： Pier John Anthony Sazio ,  John Victor Badding ,  Dan William Hewak

IPC: H01L21/36 ,  H01L21/00

CPC classification number: G02B6/02385 ,  C03B19/00 ,  C03B37/0122 ,  C03B2201/58 ,  C03B2203/42 ,  C03C13/04 ,  C03C25/104 ,  C23C4/123 ,  C23C16/045 ,  C23C16/45557 ,  G02B1/002 ,  G02B6/0229 ,  G02B6/02352 ,  G02B6/02357 ,  G02B6/02371 ,  G02B6/0238 ,  Y10T428/24273

Abstract: A method of fabricating a semiconductor metamaterial is provided, comprising providing a sample of engineered microstructured material that is transparent to electromagnetic radiation and comprises one or more elongate, high aspect ratio voids, passing through the voids a high pressure fluid comprising a semiconductor material carried in a carrier fluid, and causing the semiconductor material to deposit onto the surface of the one or more voids of the engineered microstructured material to form the metamaterial. Many microstructured materials and semiconductor materials can be used, together with various techniques for controlling the location, spatial extent, and thickness of the deposition of the semiconductor within the microstructured material, so that a wide range of different metamaterials can be produced.

Abstract translation: 提供一种制造半导体超材料的方法，其包括提供对电磁辐射透明的工程化微结构材料的样品，并且包括一个或多个细长的高纵横比空隙，通过空隙将高压流体包含在 载体流体，并且使半导体材料沉积到工程化微结构材料的一个或多个空隙的表面上以形成超材料。 可以使用许多微结构材料和半导体材料以及用于控制半导体在微结构化材料内的沉积的位置，空间范围和厚度的各种技术，从而可以产生宽范围的不同的超材料。