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公开(公告)号：US08670241B2
公开(公告)日：2014-03-11
申请号：US12121613
申请日：2008-05-15
申请人： David W. Sherrod , Kevin B. Leigh , Jonathan E. JamesOu , Kurt A. Manweiler , Joseph R. Allen , Tuan A. Pham
发明人： David W. Sherrod , Kevin B. Leigh , Jonathan E. JamesOu , Kurt A. Manweiler , Joseph R. Allen , Tuan A. Pham
IPC分类号： H05K7/20
CPC分类号： H05K7/1488 , H05K7/1492
摘要： A blade device enclosure has a chassis configured to selectively house a plurality of configurations of full-high and half-high blade devices, an administrator module, and at least one input/output device. The blade device enclosure also has a printed circuit board including a passive high-speed midplane configured to electronically couple the blade devices to the administrator module and the at least one input/output device.
摘要翻译： 刀片设备外壳具有被配置为选择性地容纳全高和半高刀片设备的多个配置的机箱，管理员模块和至少一个输入/输出设备。 刀片设备外壳还具有印刷电路板，其包括被配置为将刀片设备电子耦合到管理员模块和至少一个输入/输出设备的被动高速中间面板。
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公开(公告)号：US20080309208A1
公开(公告)日：2008-12-18
申请号：US12124679
申请日：2008-05-21
申请人： David W. Sherrod , Kurt A. Manweiler , Scott Stephenson , George D. Megason , Jonathan E. JamesOu
发明人： David W. Sherrod , Kurt A. Manweiler , Scott Stephenson , George D. Megason , Jonathan E. JamesOu
IPC分类号： A47B81/00
CPC分类号： H05K7/1425 , G06F1/183
摘要： Included are embodiments for installation and removal of computing components. More specifically, at least one embodiment of an apparatus includes at least one removable support platform configured to define a computing device bay and at least one removable switch divider configured to further define the computing device bay, the computing device bay configured to receive a double-high component.
摘要翻译： 包括用于安装和移除计算组件的实施例。 更具体地，设备的至少一个实施例包括至少一个可移除支撑平台，其被配置为定义计算设备托架和配置成进一步限定计算设备托架的至少一个可移除开关分隔器，该计算设备托架被配置为接收双 高分量。
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公开(公告)号：US20080310097A1
公开(公告)日：2008-12-18
申请号：US12121613
申请日：2008-05-15
申请人： David W. Sherrod , Kevin B. Leigh , Jonathan E. JamesOu , Kurt A. Manweiler , Joseph R. Allen , Tuan A. Pham
发明人： David W. Sherrod , Kevin B. Leigh , Jonathan E. JamesOu , Kurt A. Manweiler , Joseph R. Allen , Tuan A. Pham
CPC分类号： H05K7/1488 , H05K7/1492
摘要： A blade device enclosure has a chassis configured to selectively house a plurality of configurations of full-high and half-high blade devices, an administrator module, and at least one input/output device. The blade device enclosure also has a printed circuit board including a passive high-speed midplane configured to electronically couple the blade devices to the administrator module and the at least one input/output device.
摘要翻译： 刀片设备外壳具有被配置为选择性地容纳全高和半高刀片设备的多个配置的机箱，管理员模块和至少一个输入/输出设备。 刀片设备外壳还具有印刷电路板，其包括被配置为将刀片设备电子耦合到管理员模块和至少一个输入/输出设备的被动高速中间面板。
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公开(公告)号：US20080309160A1
公开(公告)日：2008-12-18
申请号：US12153742
申请日：2008-05-23
CPC分类号： H01R31/02 , H01R2201/06 , H05K7/1492 , Y10T307/25
摘要： An apparatus for distributing power to computing modules in a multi module enclosure. The apparatus includes at least one power input module, a plurality of power input cables, a plurality of power conversion modules, and a plurality of computing modules. The at least one power input module is modularly arranged within the multi module enclosure. The plurality of power input cables are electrically connected to and provide power input to the at least one power input module. The plurality of power conversion modules are electrically connected to power outputs of the at least one power input module and are modularly arranged within the multi module enclosure. The plurality of computing modules are electrically connected to power outputs of the power conversion modules and are arranged within the multi module enclosure.
摘要翻译： 一种用于向多模块外壳中的计算模块分配电力的装置。 该装置包括至少一个电源输入模块，多个电力输入电缆，多个电力转换模块和多个计算模块。 所述至少一个电源输入模块被模块化地布置在所述多模块外壳内。 所述多个电力输入电缆电连接到所述至少一个电力输入模块并向所述至少一个电力输入模块提供电力输入。 多个电力转换模块电连接到至少一个电力输入模块的电力输出，并且模块化地布置在多模块外壳内。 多个计算模块电连接到电力转换模块的电源输出端，并被布置在多模块外壳内。
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