摘要:
An apparatus for distributing power to computing modules in a multi module enclosure. The apparatus includes at least one power input module, a plurality of power input cables, a plurality of power conversion modules, and a plurality of computing modules. The at least one power input module is modularly arranged within the multi module enclosure. The plurality of power input cables are electrically connected to and provide power input to the at least one power input module. The plurality of power conversion modules are electrically connected to power outputs of the at least one power input module and are modularly arranged within the multi module enclosure. The plurality of computing modules are electrically connected to power outputs of the power conversion modules and are arranged within the multi module enclosure.
摘要:
Included are embodiments for installation and removal of computing components. More specifically, at least one embodiment of an apparatus includes at least one removable support platform configured to define a computing device bay and at least one removable switch divider configured to further define the computing device bay, the computing device bay configured to receive a double-high component.
摘要:
A blade device enclosure has a chassis configured to selectively house a plurality of configurations of full-high and half-high blade devices, an administrator module, and at least one input/output device. The blade device enclosure also has a printed circuit board including a passive high-speed midplane configured to electronically couple the blade devices to the administrator module and the at least one input/output device.
摘要:
A blade device enclosure has a chassis configured to selectively house a plurality of configurations of full-high and half-high blade devices, an administrator module, and at least one input/output device. The blade device enclosure also has a printed circuit board including a passive high-speed midplane configured to electronically couple the blade devices to the administrator module and the at least one input/output device.
摘要:
When a module is inserted into a bay of an electronic system, an electrical signal connector on the electronic system engages a mating signal connector on the module and an electrical power connector on the electronic system engages one of two mating power connectors on the module. The electrical power connector on the electronic system is on either a first side or a second side of the electrical signal connector. The mating power connectors are on the first and second sides of the mating signal connector on the module.
摘要:
When a module is inserted into a bay of an electronic system, an electrical signal connector on the electronic system engages a mating signal connector on the module and an electrical power connector on the electronic system engages one of two mating power connectors on the module. The electrical power connector on the electronic system is on either a first side or a second side of the electrical signal connector. The mating power connectors are on the first and second sides of the mating signal connector on the module.
摘要:
Embodiments of the present technique are directed to a backplane infrastructure. The backplane infrastructure may include a passive power backplane configured to distribute power and comprising a first set of alignment holes, a signal backplane configured to route interface signals and comprising a second set of alignment holes and a set of common alignment pins, each alignment pin having an axis, wherein the set of common alignment pins are inserted into the first set of alignment holes and the second set of alignment holes to align the passive power backplane and the signal backplane about the axis.
摘要:
Embodiments of the present technique are directed to a backplane infrastructure. The backplane infrastructure may include a passive power backplane configured to distribute power and comprising a first set of alignment holes, a signal backplane configured to route interface signals and comprising a second set of alignment holes and a set of common alignment pins, each alignment pin having an axis, wherein the set of common alignment pins are inserted into the first set of alignment holes and the second set of alignment holes to align the passive power backplane and the signal backplane about the axis.
摘要:
A device that may include a server chassis and a user interface module moveably coupled to the server chassis. In some embodiments, the user interface module is configured to move to a first position that allows access to a first server component and to a second position that allows access to a second server component that is different from the first server component.
摘要:
A device that may include a server chassis and a user interface module moveably coupled to the server chassis. In some embodiments, the user interface module is configured to move to a first position that allows access to a first server component and to a second position that allows access to a second server component that is different from the first server component.