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    Computer chassis with integrated cooling features
    3.
    发明授权
    Computer chassis with integrated cooling features 有权
    具有集成散热功能的电脑机箱

    公开(公告)号：US6058011A

    公开(公告)日：2000-05-02

    申请号：US249039

    申请日：1999-02-12

    申请人： Thomas T. Hardt ,  Wade D. Vinson ,  Kurt A. Manweiler ,  Joseph R. Allen

    发明人： Thomas T. Hardt ,  Wade D. Vinson ,  Kurt A. Manweiler ,  Joseph R. Allen

    IPC分类号： G06F1/18 ,  G06F1/20 ,  H05K7/20

    CPC分类号： G06F1/185 ,  G06F1/183 ,  G06F1/184 ,  G06F1/186 ,  G06F1/20 ,  H05K7/20727

    摘要： A computer system that includes a chassis and a removable module configured to be housed inside the chassis. The chassis includes an interface plate incorporated therewith. The interface plate is perforated to allow air to flow through the interface plate and along peripheral cards attached to the interface plate. The air that flows along the peripheral cards then flows through perforations in a cover that is used to secure the peripheral cards into their associated card slots. The cover then directs the air into a primary air passage used to exhaust air pulled through the chassis.

    摘要翻译： 一种包括机架和可移动模块的计算机系统，其被配置为容纳在机架内。 底盘包括与其结合的接口板。 接口板穿孔以允许空气流过界面板并且沿着连接到界面板的外围卡片流动。 沿着外围卡流动的空气然后流过用于将外围卡固定到其相关卡槽中的盖子中的穿孔。 盖子然后将空气引导到用于排出通过底盘拉出的空气的主空气通道中。

    Toolless Configuration Of A Computer Enclosure
    5.
    发明申请
    Toolless Configuration Of A Computer Enclosure 有权
    计算机外壳的无工具配置

    公开(公告)号：US20080310123A1

    公开(公告)日：2008-12-18

    申请号：US12121350

    申请日：2008-05-15

    申请人： David W. Sherrod ,  Michael E. Taylor ,  Joseph R. Allen ,  John P. Franz

    发明人： David W. Sherrod ,  Michael E. Taylor ,  Joseph R. Allen ,  John P. Franz

    IPC分类号： H05K7/18

    CPC分类号： H05K7/1488

    摘要： Included are embodiments for toolless configuration of a computer enclosure. At least one embodiment of an apparatus includes a computer enclosure configured to support a plurality of components, the computer enclosure including a plurality of dividing walls, the dividing walls including a first opening and a second opening. Some embodiments include a divider configured for insertion into the computer enclosure and between the dividing walls, the divider including a first tab for coupling with the first opening, the divider including a second tab for coupling with the second opening, the divider further including a locking tab for locking the divider in place within the computer enclosure.

    摘要翻译： 包括用于计算机机箱的无工具配置的实施例。 装置的至少一个实施例包括被配置为支撑多个部件的计算机机壳，所述计算机机壳包括多个分隔壁，所述分隔壁包括第一开口和第二开口。 一些实施例包括分配器，其被配置用于插入到计算机外壳中并且在分隔壁之间，分隔器包括用于与第一开口联接的第一突出部，该分隔器包括用于与第二开口联接的第二突出部，分隔器还包括锁定 将分配器锁定在计算机外壳内的适当位置。

    Toolless configuration of a computer enclosure
    7.
    发明授权
    Toolless configuration of a computer enclosure 有权
    计算机机箱的无工具配置

    公开(公告)号：US08982565B2

    公开(公告)日：2015-03-17

    申请号：US12121350

    申请日：2008-05-15

    申请人： David W. Sherrod ,  Michael E. Taylor ,  Joseph R. Allen ,  John P. Franz

    发明人： David W. Sherrod ,  Michael E. Taylor ,  Joseph R. Allen ,  John P. Franz

    IPC分类号： H05K5/00 ,  H05K7/00 ,  A45D19/04 ,  G11B33/02 ,  H05K7/14

    CPC分类号： H05K7/1488

    摘要： Included are embodiments for toolless configuration of a computer enclosure. At least one embodiment of an apparatus includes a computer enclosure configured to support a plurality of components, the computer enclosure including a plurality of dividing walls, the dividing walls including a first opening and a second opening. Some embodiments include a divider configured for insertion into the computer enclosure and between the dividing walls, the divider including a first tab for coupling with the first opening, the divider including a second tab for coupling with the second opening, the divider further including a locking tab for locking the divider in place within the computer enclosure.

    摘要翻译： 包括用于计算机机箱的无工具配置的实施例。 装置的至少一个实施例包括被配置为支撑多个部件的计算机机壳，所述计算机机壳包括多个分隔壁，所述分隔壁包括第一开口和第二开口。 一些实施例包括分配器，其被配置用于插入到计算机外壳中并且在分隔壁之间，分隔器包括用于与第一开口联接的第一突出部，该分隔器包括用于与第二开口联接的第二突出部，分隔器还包括锁定 将分配器锁定在计算机外壳内的适当位置。

    Cooling fan module
    9.
    发明授权
    Cooling fan module 有权
    冷却风扇模块

    公开(公告)号：US07719836B2

    公开(公告)日：2010-05-18

    申请号：US12472764

    申请日：2009-05-27

    申请人： John P. Franz ,  Troy A. Della Fiora ,  Joseph R. Allen ,  Wade D. Vinson

    发明人： John P. Franz ,  Troy A. Della Fiora ,  Joseph R. Allen ,  Wade D. Vinson

    IPC分类号： H05K7/20

    CPC分类号： F04D29/646 ,  F04D29/664 ,  G06F1/20 ,  H05K7/20172 ,  H05K7/20581

    摘要： A cooling fan module is disclosed. The cooling fan module includes a module housing, a fan assembly, a fan control circuit board, and an electrical connector. The fan assembly is disposed within the module housing and includes a fan housing, a motor disposed within the fan housing, and a blade assembly coupled to the motor. The fan control circuit board is disposed between the module housing and the fan housing, and is coupled to the motor. The electrical connector is coupled to the fan control circuit board and projects outside of the module housing.

    摘要翻译： 公开了一种冷却风扇模块。 冷却风扇模块包括模块壳体，风扇组件，风扇控制电路板和电连接器。 风扇组件设置在模块壳体内，并且包括风扇壳体，设置在风扇壳体内的电动机和联接到电动机的叶片组件。 风扇控制电路板设置在模块壳体和风扇壳体之间，并且联接到电动机。 电连接器连接到风扇控制电路板并且突出到模块壳体外部。