摘要:
Included are embodiments for installation and removal of computing components. More specifically, at least one embodiment of an apparatus includes at least one removable support platform configured to define a computing device bay and at least one removable switch divider configured to further define the computing device bay, the computing device bay configured to receive a double-high component.
摘要:
A blade device enclosure has a chassis configured to selectively house a plurality of configurations of full-high and half-high blade devices, an administrator module, and at least one input/output device. The blade device enclosure also has a printed circuit board including a passive high-speed midplane configured to electronically couple the blade devices to the administrator module and the at least one input/output device.
摘要:
A blade device enclosure has a chassis configured to selectively house a plurality of configurations of full-high and half-high blade devices, an administrator module, and at least one input/output device. The blade device enclosure also has a printed circuit board including a passive high-speed midplane configured to electronically couple the blade devices to the administrator module and the at least one input/output device.
摘要:
An apparatus for distributing power to computing modules in a multi module enclosure. The apparatus includes at least one power input module, a plurality of power input cables, a plurality of power conversion modules, and a plurality of computing modules. The at least one power input module is modularly arranged within the multi module enclosure. The plurality of power input cables are electrically connected to and provide power input to the at least one power input module. The plurality of power conversion modules are electrically connected to power outputs of the at least one power input module and are modularly arranged within the multi module enclosure. The plurality of computing modules are electrically connected to power outputs of the power conversion modules and are arranged within the multi module enclosure.
摘要:
A system comprises a primary backplane and a secondary backplane. The primary backplane has a surface region substantially devoid of components and a plurality of connectors to which electronic devices can be mated. The secondary backplane is removably mated to the primary backplane within the region. The secondary backplane has at least two connectors adapted to mate to at least two of the electronic devices. At least two electronic devices communicatively interconnect through the primary and secondary backplanes.
摘要:
A system comprises a primary backplane and a secondary backplane. The primary backplane has a surface region substantially devoid of components and a plurality of connectors to which electronic devices can be mated. The secondary backplane is removably mated to the primary backplane within the region. The secondary backplane has at least two connectors adapted to mate to at least two of the electronic devices. At least two electronic devices communicatively interconnect through the primary and secondary backplanes.
摘要:
Embodiments of the present technique are directed to a backplane infrastructure. The backplane infrastructure may include a passive power backplane configured to distribute power and comprising a first set of alignment holes, a signal backplane configured to route interface signals and comprising a second set of alignment holes and a set of common alignment pins, each alignment pin having an axis, wherein the set of common alignment pins are inserted into the first set of alignment holes and the second set of alignment holes to align the passive power backplane and the signal backplane about the axis.
摘要:
Embodiments of the present technique are directed to a backplane infrastructure. The backplane infrastructure may include a passive power backplane configured to distribute power and comprising a first set of alignment holes, a signal backplane configured to route interface signals and comprising a second set of alignment holes and a set of common alignment pins, each alignment pin having an axis, wherein the set of common alignment pins are inserted into the first set of alignment holes and the second set of alignment holes to align the passive power backplane and the signal backplane about the axis.
摘要:
A modular connector infrastructure includes device connector modules having optical connectors to optically connect to respective subsets of electronic devices in a system. The device connector modules are removably connected to the electronic devices.
摘要:
Enclosures and systems that can control airflow and signal connectivity in a blade enclosure are provided. Some examples include a front section including a number of blade server modules, a rear section including a number of switch modules; and a middle section having a number of openings and a number of connectors, wherein the middle section controls airflow between the front section and the rear section in the blade enclosure with the number of openings and the middle section controls signal connectivity between a number of blades in the number of blade server modules and a number of switches in the number of switch modules with the number of connectors.