公开(公告)号：US20130010145A1

公开(公告)日：2013-01-10

申请号：US13530746

申请日：2012-06-22

申请人： Hiroki Hagiwara ,  Keiji Sasano ,  Hiroaki Tanaka ,  Yuki Tuji ,  Tsuyoshi Watanabe ,  Koji Tsuchiya ,  Kenzo Tanaka ,  Takaya Wada ,  Noboru Kawabata ,  Hirokazu Yoshida ,  Hironori Yokoyama

发明人： Hiroki Hagiwara ,  Keiji Sasano ,  Hiroaki Tanaka ,  Yuki Tuji ,  Tsuyoshi Watanabe ,  Koji Tsuchiya ,  Kenzo Tanaka ,  Takaya Wada ,  Noboru Kawabata ,  Hirokazu Yoshida ,  Hironori Yokoyama

IPC分类号： H04N5/225

CPC分类号： H01L27/14634 ,  H01L27/14618 ,  H01L27/14636 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H04N5/2253 ,  H04N5/369 ,  H05K1/0206 ,  H05K1/0207 ,  H05K2201/10121 ,  H01L2924/00014 ,  H01L2924/00

摘要： A solid-state image sensing apparatus includes a solid-state image sensing device, signal processing circuit device, and a multi-layer wiring package. The solid-state image sensing device has a pixel in an image sensing area thereof. The pixel receives incident light and generate a signal electric charge. The signal processing circuit device is arranged to face the image sensing area and applies signal processing to a signal output from the solid-state image sensing device. The multi-layer wiring package has wiring layers, the solid-state image sensing device, and the signal processing circuit device. Each of the wiring layers is laminated via an insulator. The multi-layer wiring package is formed such that a first wiring layer provided between the solid-state image sensing device and the signal processing circuit device has a greater thickness than second wiring layers and has heat conductivity higher than or equal to heat conductivity of the second wiring layers.

公开(公告)号：US06313525B1

公开(公告)日：2001-11-06

申请号：US09112229

申请日：1998-07-09

申请人： Keiji Sasano

发明人： Keiji Sasano

IPC分类号： H01L2312

CPC分类号： H01L27/14618 ,  H01L2224/48091 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/16195 ,  H01L2924/00014

摘要： A hollow package includes a package body composed of an epoxy resin having a low thermal coefficient of linear expansion, wherein the package body includes a recess for receiving an electronic component, and leads, for extracting electrodes of the electronic component, extending from the inner surface of the recess, via the upper surface of the package body, to the peripheral surface, and a transparent sealing plate bonded onto the upper surface of the package body with an ultraviolet-curable resin.

摘要翻译： 空心包装体包括由具有低热线性膨胀系数的环氧树脂构成的包装体，其中包装体包括用于容纳电子部件的凹部，并且引出用于从电子部件的内表面延伸的电极 的凹部经由封装体的上表面延伸到周面，以及透明密封板，其与紫外线固化树脂结合到封装主体的上表面。

公开(公告)号：US08711280B2

公开(公告)日：2014-04-29

申请号：US13530746

申请日：2012-06-22

申请人： Hiroki Hagiwara ,  Keiji Sasano ,  Hiroaki Tanaka ,  Yuki Tuji ,  Tsuyoshi Watanabe ,  Koji Tsuchiya ,  Kenzo Tanaka ,  Takaya Wada ,  Noboru Kawabata ,  Hirokazu Yoshida ,  Hironori Yokoyama

发明人： Hiroki Hagiwara ,  Keiji Sasano ,  Hiroaki Tanaka ,  Yuki Tuji ,  Tsuyoshi Watanabe ,  Koji Tsuchiya ,  Kenzo Tanaka ,  Takaya Wada ,  Noboru Kawabata ,  Hirokazu Yoshida ,  Hironori Yokoyama

IPC分类号： H04N5/225 ,  H01L21/00

CPC分类号： H01L27/14634 ,  H01L27/14618 ,  H01L27/14636 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H04N5/2253 ,  H04N5/369 ,  H05K1/0206 ,  H05K1/0207 ,  H05K2201/10121 ,  H01L2924/00014 ,  H01L2924/00

摘要： A solid-state image sensing apparatus includes a solid-state image sensing device, signal processing circuit device, and a multi-layer wiring package. The solid-state image sensing device has a pixel in an image sensing area thereof. The pixel receives incident light and generate a signal electric charge. The signal processing circuit device is arranged to face the image sensing area and applies signal processing to a signal output from the solid-state image sensing device. The multi-layer wiring package has wiring layers, the solid-state image sensing device, and the signal processing circuit device. Each of the wiring layers is laminated via an insulator. The multi-layer wiring package is formed such that a first wiring layer provided between the solid-state image sensing device and the signal processing circuit device has a greater thickness than second wiring layers and has heat conductivity higher than or equal to heat conductivity of the second wiring layers.

摘要翻译： 固体摄像装置包括固体摄像装置，信号处理电路装置以及多层布线包装体。 固态图像感测装置在其图像感测区域中具有像素。 像素接收入射光并产生信号电荷。 信号处理电路装置被配置为面对图像感测区域，并且对从固态图像感测装置输出的信号进行信号处理。 多层布线封装具有布线层，固态图像感测装置和信号处理电路装置。 每个布线层通过绝缘体层叠。 多层布线封装被形成为使得设置在固态图像感测装置和信号处理电路装置之间的第一布线层具有比第二布线层更大的厚度，并且导热率高于或等于 第二布线层。

公开(公告)号：US20120008025A1

公开(公告)日：2012-01-12

申请号：US13162060

申请日：2011-06-16

申请人： Keiji Sasano ,  Hiroaki Tanaka ,  Hiroki Hagiwara ,  Yuki Tsuji ,  Tsuyoshi Watanabe ,  Koji Tsuchiya ,  Kenzo Tanaka ,  Takaya Wada ,  Hirokazu Yoshida ,  Noboru Kawabata ,  Hironori Yokoyama

发明人： Keiji Sasano ,  Hiroaki Tanaka ,  Hiroki Hagiwara ,  Yuki Tsuji ,  Tsuyoshi Watanabe ,  Koji Tsuchiya ,  Kenzo Tanaka ,  Takaya Wada ,  Hirokazu Yoshida ,  Noboru Kawabata ,  Hironori Yokoyama

IPC分类号： H04N5/335

CPC分类号： H01L27/14618 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/16195 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

摘要： A solid-state imaging device includes an image sensor chip and a signal processing chip, which are electrically connected. A low thermal conductivity region is positioned between the image sensor chip and the signal processing chip. The low thermal conductivity region is configured to insulate the image sensor chip from heat, which may be generated by the signal processing chip.

摘要翻译： 固态成像装置包括电连接的图像传感器芯片和信号处理芯片。 低导热率区域位于图像传感器芯片和信号处理芯片之间。 低热导率区域被配置为使图像传感器芯片与由信号处理芯片产生的热量隔离。

公开(公告)号：US09070610B2

公开(公告)日：2015-06-30

申请号：US13162060

申请日：2011-06-16

申请人： Keiji Sasano ,  Hiroaki Tanaka ,  Hiroki Hagiwara ,  Yuki Tsuji ,  Tsuyoshi Watanabe ,  Koji Tsuchiya ,  Kenzo Tanaka ,  Takaya Wada ,  Hirokazu Yoshida ,  Noboru Kawabata ,  Hironori Yokoyama

发明人： Keiji Sasano ,  Hiroaki Tanaka ,  Hiroki Hagiwara ,  Yuki Tsuji ,  Tsuyoshi Watanabe ,  Koji Tsuchiya ,  Kenzo Tanaka ,  Takaya Wada ,  Hirokazu Yoshida ,  Noboru Kawabata ,  Hironori Yokoyama

IPC分类号： H04N5/335 ,  H01L27/146

CPC分类号： H01L27/14618 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/16195 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

摘要： A solid-state imaging device includes an image sensor chip and a signal processing chip, which are electrically connected. A low thermal conductivity region is positioned between the image sensor chip and the signal processing chip. The low thermal conductivity region is configured to insulate the image sensor chip from heat, which may be generated by the signal processing chip.

摘要翻译： 固态成像装置包括电连接的图像传感器芯片和信号处理芯片。 低导热率区域位于图像传感器芯片和信号处理芯片之间。 低热导率区域被配置为使图像传感器芯片与由信号处理芯片产生的热量隔离。

公开(公告)号：US06531334B2

公开(公告)日：2003-03-11

申请号：US09985392

申请日：2001-11-02

申请人： Keiji Sasano

发明人： Keiji Sasano

IPC分类号： H01L2100

CPC分类号： H01L27/14618 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15157 ,  H01L2924/1579 ,  H01L2924/16195 ,  Y10T29/49121 ,  Y10T29/4913 ,  Y10T29/49139 ,  H01L2924/00014

摘要： A hollow package includes a package body composed of an epoxy resin having a low thermal coefficient of linear expansion, wherein the package body includes a recess for receiving an electronic component, and leads, for extracting electrodes of the electronic component, extending from the inner surface of the recess, via the upper surface of the package body, to the peripheral surface, and a transparent sealing plate bonded onto the upper surface of the package body with an ultraviolet-curable resin.

摘要翻译： 空心包装体包括由具有低热线性膨胀系数的环氧树脂构成的包装体，其中包装体包括用于容纳电子部件的凹部，并且引出用于从电子部件的内表面延伸的电极 的凹部经由封装体的上表面延伸到周面，以及透明密封板，其与紫外线固化树脂结合到封装主体的上表面。