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    Surface mount package with ceramic sidewalls
    1.
    发明申请
    Surface mount package with ceramic sidewalls 有权
    带陶瓷侧壁的表面贴装封装

    公开(公告)号：US20100270669A1

    公开(公告)日：2010-10-28

    申请号：US12803518

    申请日：2010-06-29

    申请人： Manuel Medeiros, III

    发明人： Manuel Medeiros, III

    IPC分类号： H01L23/043

    CPC分类号： H01L23/055 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/00

    摘要： A package for use in encapsulating an electronic device is disclosed. The package includes a dielectric frame having first and second sides with a pair of apertures extending through the dielectric frame. These apertures are separated by a raised shelf span extending inwardly from an internal perimeter of the dielectric frame. The raised shelf span defines a first thickness of the dielectric frame and a raised sidewall extending outwardly from the second side along an external perimeter of said dielectric frame defines a second thickness of said frame, with the second thickness being greater than the first thickness. Also provided is a metallic component having a flange and a pedestal that extends perpendicularly from the flange. The flange is bonded to the first side of the dielectric frame and extends across one of the pair of apertures with the pedestal extending into that aperture. A gap between the pedestal and the dielectric frame having a width of at least 0.015 inch. This prevents debris from being trapped in the gap and minimizes a risk of particle impact noise detection (PIND) failure.

    摘要翻译： 公开了一种用于封装电子设备的封装。 所述封装包括具有第一和第二侧面的电介质框架，所述第一和第二侧面具有延伸穿过所述电介质框架的一对孔。 这些孔通过从电介质框架的内周向内延伸的凸起的搁架间隔开。 升高的货架跨度限定了电介质框架的第一厚度，并且沿着所述介电框架的外周边从第二侧向外延伸的升高的侧壁限定了所述框架的第二厚度，第二厚度大于第一厚度。 还提供了具有凸缘和从凸缘垂直延伸的基座的金属部件。 凸缘结合到电介质框架的第一侧并延伸穿过一对孔中的一个，基座延伸到该孔中。 基座和电介质框架之间的间隙具有至少0.015英寸的宽度。 这样就可以防止碎屑被捕获在间隙中，并最大限度地降低了颗粒撞击噪声检测（PIND）故障的风险。

    Surface mount package with ceramic sidewalls
    3.
    发明授权
    Surface mount package with ceramic sidewalls 有权
    带陶瓷侧壁的表面贴装封装

    公开(公告)号：US08143717B2

    公开(公告)日：2012-03-27

    申请号：US12803518

    申请日：2010-06-29

    申请人： Manuel Medeiros, III

    发明人： Manuel Medeiros, III

    IPC分类号： H01L23/34 ,  H01L23/10

    CPC分类号： H01L23/055 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/00

    摘要： A package for use in encapsulating an electronic device is disclosed. The package includes a dielectric frame having first and second sides with a pair of apertures extending through the dielectric frame. These apertures are separated by a raised shelf span extending inwardly from an internal perimeter of the dielectric frame. The raised shelf span defines a first thickness of the dielectric frame and a raised sidewall extending outwardly from the second side along an external perimeter of said dielectric frame defines a second thickness of said frame, with the second thickness being greater than the first thickness. Also provided is a metallic component having a flange and a pedestal that extends perpendicularly from the flange. The flange is bonded to the first side of the dielectric frame and extends across one of the pair of apertures with the pedestal extending into that aperture. A gap between the pedestal and the dielectric frame having a width of at least 0.015 inch. This prevents debris from being trapped in the gap and minimizes a risk of particle impact noise detection (PIND) failure.

    摘要翻译： 公开了一种用于封装电子设备的封装。 所述封装包括具有第一和第二侧面的电介质框架，所述电介质框架具有延伸穿过所述电介质框架的一对 这些孔通过从电介质框架的内周向内延伸的凸起的搁架间隔开。 升高的货架跨度限定了电介质框架的第一厚度，并且沿着所述介电框架的外周边从第二侧向外延伸的升高的侧壁限定了所述框架的第二厚度，第二厚度大于第一厚度。 还提供了具有凸缘和从凸缘垂直延伸的基座的金属部件。 凸缘结合到电介质框架的第一侧并延伸穿过一对孔中的一个，基座延伸到该孔中。 基座和电介质框架之间的间隙具有至少0.015英寸的宽度。 这样就可以防止碎屑被捕获在间隙中，并最大限度地降低了颗粒撞击噪声检测（PIND）故障的风险。

    Surface mount package with high thermal conductivity
    5.
    发明申请
    Surface mount package with high thermal conductivity 失效
    具有高导热性的表面贴装封装

    公开(公告)号：US20100013084A1

    公开(公告)日：2010-01-21

    申请号：US12456412

    申请日：2009-06-16

    申请人： Manuel Medeiros, III

    发明人： Manuel Medeiros, III

    IPC分类号： H01L23/045

    CPC分类号： H01L23/055 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/00

    摘要： A package for use in encapsulating an electronic device is disclosed. In some embodiments, the package includes the following: a dielectric frame having first and second sides, an aperture, a raised shelf portion defined along an internal perimeter of the dielectric frame and extending outwardly from the second side, the raised shelf portion defining a first thickness of the dielectric frame, and a raised sidewall extending outwardly from the second side along an external perimeter of the dielectric frame, the raised sidewall defining a second thickness of the frame, the second thickness being greater than the first thickness; a metallic component bonded to the dielectric frame and extending across the aperture; and a seam weldable, low-profile metallic seal ring bonded to the raised sidewall of the dielectric frame. In some embodiments, the package includes the following: a dielectric frame having first and second sides and an aperture, the dielectric frame having an aperture thickness bordering the aperture; a metallic insert positioned within the aperture, the metallic insert having first and second sides, the metallic insert being sized so as to be movable within the aperture and the metallic insert having an insert thickness that is greater than the aperture thickness of the dielectric frame; a first metallic component bonded to the first side of the metallic insert and extending across the aperture; and a second metallic component bonded to the second side of the metallic insert and extending across the aperture.

    摘要翻译： 公开了一种用于封装电子设备的封装。 在一些实施例中，包装包括以下：具有第一和第二侧面的电介质框架，孔，沿着电介质框架的内周边限定并从第二侧向外延伸的凸起搁架部分，凸起搁架部分限定第一 所述电介质框架的厚度以及从所述第二侧沿所述电介质框架的外周向外延伸的凸起侧壁，所述凸起侧壁限定所述框架的第二厚度，所述第二厚度大于所述第一厚度; 金属部件，其结合到所述电介质框架并延伸穿过所述孔; 以及可焊接的低轮廓金属密封环，其结合到电介质框架的凸起侧壁。 在一些实施例中，包装包括以下：具有第一和第二侧面和孔的电介质框架，所述电介质框架具有与所述孔边界接近的孔径厚度; 位于所述孔内的金属插入件，所述金属插入件具有第一和第二侧面，所述金属插入件的尺寸被设计成能够在所述孔内移动，并且所述金属插入件的插入物厚度大于所述电介质框架的孔径厚度; 结合到所述金属插入件的第一侧并延伸穿过所述孔的第一金属部件; 以及结合到所述金属插入件的第二侧并延伸穿过所述孔的第二金属部件。

    Surface mount package with high thermal conductivity
    7.
    发明授权
    Surface mount package with high thermal conductivity 失效
    具有高导热性的表面贴装封装

    公开(公告)号：US08080872B2

    公开(公告)日：2011-12-20

    申请号：US12456412

    申请日：2009-06-16

    申请人： Manuel Medeiros, III

    发明人： Manuel Medeiros, III

    IPC分类号： H01L23/34 ,  H01L23/10

    CPC分类号： H01L23/055 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/00

    摘要： A package for use in encapsulating an electronic device is disclosed. In some embodiments, the package includes the following: a dielectric frame having first and second sides, an aperture, a raised shelf portion defined along an internal perimeter of the dielectric frame and extending outwardly from the second side, the raised shelf portion defining a first thickness of the dielectric frame, and a raised sidewall extending outwardly from the second side along an external perimeter of the dielectric frame, the raised sidewall defining a second thickness of the frame, the second thickness being greater than the first thickness; a metallic component bonded to the dielectric frame and extending across the aperture; and a seam weldable, low-profile metallic seal ring bonded to the raised sidewall of the dielectric frame. In some embodiments, the package includes the following: a dielectric frame having first and second sides and an aperture, the dielectric frame having an aperture thickness bordering the aperture; a metallic insert positioned within the aperture, the metallic insert having first and second sides, the metallic insert being sized so as to be movable within the aperture and the metallic insert having an insert thickness that is greater than the aperture thickness of the dielectric frame; a first metallic component bonded to the first side of the metallic insert and extending across the aperture; and a second metallic component bonded to the second side of the metallic insert and extending across the aperture.

    摘要翻译： 公开了一种用于封装电子设备的封装。 在一些实施例中，包装包括以下：具有第一和第二侧面的电介质框架，孔，沿着电介质框架的内周边限定并从第二侧向外延伸的凸起搁架部分，凸起搁架部分限定第一 所述电介质框架的厚度以及从所述第二侧沿所述电介质框架的外周向外延伸的凸起侧壁，所述凸起侧壁限定所述框架的第二厚度，所述第二厚度大于所述第一厚度; 金属部件，其结合到所述电介质框架并延伸穿过所述孔; 以及可焊接的低轮廓金属密封环，其结合到电介质框架的凸起侧壁。 在一些实施例中，包装包括以下：具有第一和第二侧面和孔的电介质框架，所述电介质框架具有与所述孔边界接近的孔径厚度; 位于所述孔内的金属插入件，所述金属插入件具有第一和第二侧面，所述金属插入件的尺寸被设计成能够在所述孔内移动，并且所述金属插入件的插入物厚度大于所述电介质框架的孔径厚度; 结合到所述金属插入件的第一侧并延伸穿过所述孔的第一金属部件; 以及结合到所述金属插入件的第二侧并延伸穿过所述孔的第二金属部件。