公开(公告)号：US20100009490A1

公开(公告)日：2010-01-14

申请号：US12555664

申请日：2009-09-08

申请人： Noboru Kawabata

发明人： Noboru Kawabata

IPC分类号： H01L21/56

CPC分类号： H01L27/14618 ,  H01L27/14601 ,  H01L27/14625 ,  H01L27/14683 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/8592 ,  H01L2924/16195 ,  H01L2924/3025 ,  H01L2924/00

摘要： A method for manufacturing a solid-state imaging device. A solid-state image sensor is mounted on the semiconductor package support and electrically connected to first terminals and second terminals by bonding wires. The second terminals to which the bonding wires are connected are sealed with a sealing member. The optically-transparent member is thereafter disposed on the support member and the sealing member. The sealing member is cured to fix the optically transparent member.

摘要翻译： 一种固态成像装置的制造方法。 固态图像传感器安装在半导体封装支架上，并通过接合线与第一端子和第二端子电连接。 接合线连接的第二端子用密封构件密封。 此后，光学透明构件设置在支撑构件和密封构件上。 固化密封构件以固定光学透明构件。

公开(公告)号：US09070610B2

公开(公告)日：2015-06-30

申请号：US13162060

申请日：2011-06-16

申请人： Keiji Sasano ,  Hiroaki Tanaka ,  Hiroki Hagiwara ,  Yuki Tsuji ,  Tsuyoshi Watanabe ,  Koji Tsuchiya ,  Kenzo Tanaka ,  Takaya Wada ,  Hirokazu Yoshida ,  Noboru Kawabata ,  Hironori Yokoyama

发明人： Keiji Sasano ,  Hiroaki Tanaka ,  Hiroki Hagiwara ,  Yuki Tsuji ,  Tsuyoshi Watanabe ,  Koji Tsuchiya ,  Kenzo Tanaka ,  Takaya Wada ,  Hirokazu Yoshida ,  Noboru Kawabata ,  Hironori Yokoyama

IPC分类号： H04N5/335 ,  H01L27/146

CPC分类号： H01L27/14618 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/16195 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

摘要： A solid-state imaging device includes an image sensor chip and a signal processing chip, which are electrically connected. A low thermal conductivity region is positioned between the image sensor chip and the signal processing chip. The low thermal conductivity region is configured to insulate the image sensor chip from heat, which may be generated by the signal processing chip.

摘要翻译： 固态成像装置包括电连接的图像传感器芯片和信号处理芯片。 低导热率区域位于图像传感器芯片和信号处理芯片之间。 低热导率区域被配置为使图像传感器芯片与由信号处理芯片产生的热量隔离。

公开(公告)号：US08952412B2

公开(公告)日：2015-02-10

申请号：US12555664

申请日：2009-09-08

申请人： Noboru Kawabata

发明人： Noboru Kawabata

IPC分类号： H01L33/00 ,  H01L31/0203 ,  H01L27/146

CPC分类号： H01L27/14618 ,  H01L27/14601 ,  H01L27/14625 ,  H01L27/14683 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/8592 ,  H01L2924/16195 ,  H01L2924/3025 ,  H01L2924/00

摘要： A method for manufacturing a solid-state imaging device. A solid-state image sensor is mounted on the semiconductor package support and electrically connected to first terminals and second terminals by bonding wires. The second terminals to which the bonding wires are connected are sealed with a sealing member. The optically-transparent member is thereafter disposed on the support member and the sealing member. The sealing member is cured to fix the optically transparent member.

摘要翻译： 一种固态成像装置的制造方法。 固态图像传感器安装在半导体封装支架上，并通过接合线与第一端子和第二端子电连接。 接合线连接的第二端子用密封构件密封。 此后，光学透明构件设置在支撑构件和密封构件上。 固化密封构件以固定光学透明构件。

公开(公告)号：US20130010145A1

公开(公告)日：2013-01-10

申请号：US13530746

申请日：2012-06-22

申请人： Hiroki Hagiwara ,  Keiji Sasano ,  Hiroaki Tanaka ,  Yuki Tuji ,  Tsuyoshi Watanabe ,  Koji Tsuchiya ,  Kenzo Tanaka ,  Takaya Wada ,  Noboru Kawabata ,  Hirokazu Yoshida ,  Hironori Yokoyama

发明人： Hiroki Hagiwara ,  Keiji Sasano ,  Hiroaki Tanaka ,  Yuki Tuji ,  Tsuyoshi Watanabe ,  Koji Tsuchiya ,  Kenzo Tanaka ,  Takaya Wada ,  Noboru Kawabata ,  Hirokazu Yoshida ,  Hironori Yokoyama

IPC分类号： H04N5/225

CPC分类号： H01L27/14634 ,  H01L27/14618 ,  H01L27/14636 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H04N5/2253 ,  H04N5/369 ,  H05K1/0206 ,  H05K1/0207 ,  H05K2201/10121 ,  H01L2924/00014 ,  H01L2924/00

摘要： A solid-state image sensing apparatus includes a solid-state image sensing device, signal processing circuit device, and a multi-layer wiring package. The solid-state image sensing device has a pixel in an image sensing area thereof. The pixel receives incident light and generate a signal electric charge. The signal processing circuit device is arranged to face the image sensing area and applies signal processing to a signal output from the solid-state image sensing device. The multi-layer wiring package has wiring layers, the solid-state image sensing device, and the signal processing circuit device. Each of the wiring layers is laminated via an insulator. The multi-layer wiring package is formed such that a first wiring layer provided between the solid-state image sensing device and the signal processing circuit device has a greater thickness than second wiring layers and has heat conductivity higher than or equal to heat conductivity of the second wiring layers.

公开(公告)号：US20070194439A1

公开(公告)日：2007-08-23

申请号：US11567959

申请日：2006-12-07

申请人： Noboru Kawabata

发明人： Noboru Kawabata

IPC分类号： H01L23/12

CPC分类号： H01L27/14618 ,  H01L27/14601 ,  H01L27/14625 ,  H01L27/14683 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/8592 ,  H01L2924/16195 ,  H01L2924/3025 ,  H01L2924/00

摘要： There is provided a solid-state imaging device including: a semiconductor package support mounting a solid-state image sensor; bonding wires electrically connecting first terminals formed on the solid-state image sensor and second terminals formed on the semiconductor package support; a sealing member sealing at least the second terminals to which the bonding wires are connected; and an optically-transparent member made of an optically-transparent material and disposed above the solid-state image sensor, in which the optically-transparent member is supported by different support members formed on the semiconductor package support at three or more positions not on a single straight line.

摘要翻译： 提供了一种固态成像装置，包括：安装固态图像传感器的半导体封装支架; 电连接形成在固态图像传感器上的第一端子和形成在半导体封装支架上的第二端子的接合线; 至少密封接合线所连接的第二端子的密封构件; 以及由光学透明材料制成并且设置在固态图像传感器上方的光学透明构件，其中光学透明构件由形成在半导体封装支撑件上的不同支撑构件支撑在三个或更多个不在 单直线。

公开(公告)号：US08711280B2

公开(公告)日：2014-04-29

申请号：US13530746

申请日：2012-06-22

申请人： Hiroki Hagiwara ,  Keiji Sasano ,  Hiroaki Tanaka ,  Yuki Tuji ,  Tsuyoshi Watanabe ,  Koji Tsuchiya ,  Kenzo Tanaka ,  Takaya Wada ,  Noboru Kawabata ,  Hirokazu Yoshida ,  Hironori Yokoyama

发明人： Hiroki Hagiwara ,  Keiji Sasano ,  Hiroaki Tanaka ,  Yuki Tuji ,  Tsuyoshi Watanabe ,  Koji Tsuchiya ,  Kenzo Tanaka ,  Takaya Wada ,  Noboru Kawabata ,  Hirokazu Yoshida ,  Hironori Yokoyama

IPC分类号： H04N5/225 ,  H01L21/00

CPC分类号： H01L27/14634 ,  H01L27/14618 ,  H01L27/14636 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H04N5/2253 ,  H04N5/369 ,  H05K1/0206 ,  H05K1/0207 ,  H05K2201/10121 ,  H01L2924/00014 ,  H01L2924/00

摘要： A solid-state image sensing apparatus includes a solid-state image sensing device, signal processing circuit device, and a multi-layer wiring package. The solid-state image sensing device has a pixel in an image sensing area thereof. The pixel receives incident light and generate a signal electric charge. The signal processing circuit device is arranged to face the image sensing area and applies signal processing to a signal output from the solid-state image sensing device. The multi-layer wiring package has wiring layers, the solid-state image sensing device, and the signal processing circuit device. Each of the wiring layers is laminated via an insulator. The multi-layer wiring package is formed such that a first wiring layer provided between the solid-state image sensing device and the signal processing circuit device has a greater thickness than second wiring layers and has heat conductivity higher than or equal to heat conductivity of the second wiring layers.

摘要翻译： 固体摄像装置包括固体摄像装置，信号处理电路装置以及多层布线包装体。 固态图像感测装置在其图像感测区域中具有像素。 像素接收入射光并产生信号电荷。 信号处理电路装置被配置为面对图像感测区域，并且对从固态图像感测装置输出的信号进行信号处理。 多层布线封装具有布线层，固态图像感测装置和信号处理电路装置。 每个布线层通过绝缘体层叠。 多层布线封装被形成为使得设置在固态图像感测装置和信号处理电路装置之间的第一布线层具有比第二布线层更大的厚度，并且导热率高于或等于 第二布线层。

公开(公告)号：US20120008025A1

公开(公告)日：2012-01-12

申请号：US13162060

申请日：2011-06-16

申请人： Keiji Sasano ,  Hiroaki Tanaka ,  Hiroki Hagiwara ,  Yuki Tsuji ,  Tsuyoshi Watanabe ,  Koji Tsuchiya ,  Kenzo Tanaka ,  Takaya Wada ,  Hirokazu Yoshida ,  Noboru Kawabata ,  Hironori Yokoyama

发明人： Keiji Sasano ,  Hiroaki Tanaka ,  Hiroki Hagiwara ,  Yuki Tsuji ,  Tsuyoshi Watanabe ,  Koji Tsuchiya ,  Kenzo Tanaka ,  Takaya Wada ,  Hirokazu Yoshida ,  Noboru Kawabata ,  Hironori Yokoyama

IPC分类号： H04N5/335

CPC分类号： H01L27/14618 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/16195 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

摘要： A solid-state imaging device includes an image sensor chip and a signal processing chip, which are electrically connected. A low thermal conductivity region is positioned between the image sensor chip and the signal processing chip. The low thermal conductivity region is configured to insulate the image sensor chip from heat, which may be generated by the signal processing chip.

摘要翻译： 固态成像装置包括电连接的图像传感器芯片和信号处理芯片。 低导热率区域位于图像传感器芯片和信号处理芯片之间。 低热导率区域被配置为使图像传感器芯片与由信号处理芯片产生的热量隔离。