Hybrid chip process
    1.
    发明授权
    Hybrid chip process 失效
    混合芯片工艺

    公开(公告)号:US06360043B1

    公开(公告)日:2002-03-19

    申请号:US09341229

    申请日:1999-10-18

    IPC分类号: G02B630

    摘要: The present case concerns the manufacture of hybrid electrooptical chips. A substrate is treated so that it can both provide locations for electrooptical components and be etched so as to generate grooves in which optical fibers can be mounted. During the etching of the grooves any electrooptical component already mounted on the substrate is protected from damage by the etchant by a protective coating. A feature is that optical fibers can be mounted with their cores above the surface of the wafer.

    摘要翻译: 本案涉及制造混合电光芯片。 处理基板使得其可以提供电光学部件的位置并且被蚀刻以便产生可以安装光纤的凹槽。 在蚀刻凹槽期间,已经安装在基板上的任何电光学部件都被保护层免受蚀刻剂的损伤。 其特征在于,光纤可以以其芯在芯片的表面上方安装。