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1.发明申请公开(公告)号：US20140022740A1
公开(公告)日：2014-01-23
申请号：US13596083
申请日：2012-08-28
Applicant: Yu-Han Tsai , Chun-Wang Lin , Ching-Wei Ku , Chia-Hsing Yu , Yao-Te Tsai , Chia-Hung Tsai
Inventor： Yu-Han Tsai , Chun-Wang Lin , Ching-Wei Ku , Chia-Hsing Yu , Yao-Te Tsai , Chia-Hung Tsai
IPC: H05K7/00
CPC classification number: G06F1/187 , G11B33/124
Abstract: A portable electronic device includes an electronic module and an electronic module fixing structure. The electronic module fixing structure includes a main body, a sliding component, a rod and an elastic component connected between the main body and the sliding component. The main body has a track with a positioning portion. The sliding component is slidably disposed on the main body. The rod is rotatably connected with the sliding component. An end of the rod is adapted to move along the track. When the end is located at the positioning portion, the end and the positioning portion are interfered with each other to position the sliding component. When the electronic module pushes the sliding component, the rod is rotated to drive the end to move away from the positioning portion, and the sliding component pushes the electronic module away from the main body through elastic force of the elastic component.
Abstract translation: 便携式电子设备包括电子模块和电子模块固定结构。 电子模块固定结构包括连接在主体和滑动部件之间的主体，滑动部件，杆和弹性部件。 主体具有具有定位部分的轨道。 滑动部件可滑动地设置在主体上。 杆与滑动部件可旋转地连接。 杆的端部适于沿着轨道移动。 当端部位于定位部分时，端部和定位部分相互干涉以定位滑动部件。 当电子模块推动滑动部件时，杆被旋转以驱动端部移动远离定位部分，并且滑动部件通过弹性部件的弹力将电子模块推离主体。
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公开(公告)号：US20130341799A1
公开(公告)日：2013-12-26
申请号：US13528867
申请日：2012-06-21
Applicant: Hsin-Yu Chen , Home-Been Cheng , Yu-Han Tsai , Ching-Li Yang
Inventor： Hsin-Yu Chen , Home-Been Cheng , Yu-Han Tsai , Ching-Li Yang
IPC: H01L21/768 , H01L23/48
CPC classification number: H01L23/481 , H01L21/7684 , H01L21/76898 , H01L23/522 , H01L2924/0002 , H01L2924/00
Abstract: A method of fabricating a through silicon via (TSV) structure is provided, in which, a first dielectric layer is formed on the substrate, the first dielectric layer is patterned to have at least one first opening, a via hole is formed in the first dielectric layer and the substrate, a second dielectric layer is conformally formed on the first dielectric layer, the second dielectric layer has at least one second opening corresponding to the at least one first opening, and the second dielectric layer covers a sidewall of the via hole. A conductive material layer is formed to fill the via hole and the second opening. The conductive material layer is planarized to form a TSV within the via hole. A TSV structure is also provided, in which, the second dielectric layer is disposed within the first opening and on the sidewall of the via hole.
Abstract translation: 提供了一种通过硅通孔（TSV）结构制造方法，其中在基片上形成第一介电层，将第一介电层图案化成具有至少一个第一开口，在第一介电层中形成通孔 电介质层和衬底，第二电介质层共形地形成在第一电介质层上，第二电介质层具有至少一个对应于至少一个第一开口的第二开口，并且第二电介质层覆盖通孔的侧壁 。 形成导电材料层以填充通孔和第二开口。 导电材料层被平坦化以在通孔内形成TSV。 还提供了一种TSV结构，其中第二电介质层设置在通孔的第一开口和侧壁内。
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公开(公告)号：US08339793B2
公开(公告)日：2012-12-25
申请号：US12578698
申请日：2009-10-14
Applicant: Yu-Han Tsai , Chun-Wang Lin , Yu-Hsien Huang , Chi-Jen Lo , Feng-Hsiung Wu
Inventor： Yu-Han Tsai , Chun-Wang Lin , Yu-Hsien Huang , Chi-Jen Lo , Feng-Hsiung Wu
CPC classification number: H05K5/061
Abstract: An electronic device includes: first and second housing bodies cooperating to form an inner receiving space; a motherboard disposed in the inner receiving space, partitioned by a partition line into a port zone having at least one input/output connector, and a non-port zone; first and second waterproof strips disposed respectively between the first housing body and the motherboard and between the second housing body and the motherboard, and disposed at the partition line, the second waterproof strip having opposite ends formed with respective extension parts extending perpendicularly toward the first waterproof strip and disposed at the peripheral edge of the motherboard; and a third waterproof strip connected to the first waterproof strip to form a closed seal ring therewith, disposed between the first and second housing bodies, and disposed at an outer side of a peripheral edge of the non-port zone.
Abstract translation: 电子设备包括：第一和第二壳体，配合形成内接收空间; 设置在内部接收空间中的主板，由分隔线分隔成具有至少一个输入/输出连接器的端口区域和非端口区域; 第一和第二防水条分别设置在第一壳体和母板之间以及第二壳体和母板之间，并且设置在分隔线处，第二防水带具有相对的端部，其形成有相应的延伸部分，其垂直于第一防水 剥离并设置在母板的周边边缘; 以及第三防水条，其连接到所述第一防水条以与其形成封闭的密封环，设置在所述第一和第二壳体之间，并且设置在所述非端口区的外围边缘的外侧。
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4.发明授权公开(公告)号：US08218298B2
公开(公告)日：2012-07-10
申请号：US12828250
申请日：2010-06-30
Applicant: Yu-Han Tsai , Chun-Wang Lin , Yu-Hsien Huang , Yi-Chen Li , Chi-Jen Lo , Feng-Hsiung Wu
Inventor： Yu-Han Tsai , Chun-Wang Lin , Yu-Hsien Huang , Yi-Chen Li , Chi-Jen Lo , Feng-Hsiung Wu
CPC classification number: E05C3/10 , E05B15/101 , E05C3/048 , G06F1/1656
Abstract: A door mechanism includes a main body whereon an opening is formed. The main body is for shielding a slot on a casing of an electronic device. The door mechanism further includes a first resilient component. One end of the first resilient component is fixed inside the main body. The door mechanism further includes a shaft including a pivoting portion pivoted to the casing of the electronic device so that the main body is capable of rotating relative to the casing. The shaft further includes an extending portion. One end of the extending portion is connected to the pivoting portion, and the other end of the extending portion passes through the opening and is connected to the other end of the first resilient component. The main body is capable of moving relative to the pivoting portion due to deformation of the first resilient component.
Abstract translation: 门机构包括形成开口的主体。 主体用于屏蔽电子设备外壳上的槽。 门机构还包括第一弹性部件。 第一弹性部件的一端固定在主体内。 门机构还包括轴，其包括枢转到电子设备的壳体的枢转部分，使得主体能够相对于壳体旋转。 轴还包括延伸部分。 延伸部分的一端连接到枢转部分，并且延伸部分的另一端穿过开口并连接到第一弹性部件的另一端。 由于第一弹性部件的变形，主体能够相对于枢转部移动。
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5.发明申请公开(公告)号：US20110141669A1
公开(公告)日：2011-06-16
申请号：US12828250
申请日：2010-06-30
Applicant: Yu-Han Tsai , Chun-Wang Lin , Yu-Hsien Huang , Yi-Chen Li , Chi-Jen Lo , Feng-Hsiung Wu
Inventor： Yu-Han Tsai , Chun-Wang Lin , Yu-Hsien Huang , Yi-Chen Li , Chi-Jen Lo , Feng-Hsiung Wu
CPC classification number: E05C3/10 , E05B15/101 , E05C3/048 , G06F1/1656
Abstract: A door mechanism includes a main body whereon an opening is formed. The main body is for shielding a slot on a casing of an electronic device. The door mechanism further includes a first resilient component. One end of the first resilient component is fixed inside the main body. The door mechanism further includes a shaft including a pivoting portion pivoted to the casing of the electronic device so that the main body is capable of rotating relative to the casing. The shaft further includes an extending portion. One end of the extending portion is connected to the pivoting portion, and the other end of the extending portion passes through the opening and is connected to the other end of the first resilient component. The main body is capable of moving relative to the pivoting portion due to deformation of the first resilient component.
Abstract translation: 门机构包括形成开口的主体。 主体用于屏蔽电子设备外壳上的槽。 门机构还包括第一弹性部件。 第一弹性部件的一端固定在主体内。 门机构还包括轴，其包括枢转到电子设备的壳体的枢转部分，使得主体能够相对于壳体旋转。 轴还包括延伸部分。 延伸部分的一端连接到枢转部分，并且延伸部分的另一端穿过开口并连接到第一弹性部件的另一端。 由于第一弹性部件的变形，主体能够相对于枢转部移动。
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Patent Agency Ranking
6.发明申请公开(公告)号：US20110032670A1
公开(公告)日：2011-02-10
申请号：US12725472
申请日：2010-03-17
Applicant: Yu-Han Tsai , Chun-Wang Lin , Feng-Hsiung Wu , Chi-Jen Lo
Inventor： Yu-Han Tsai , Chun-Wang Lin , Feng-Hsiung Wu , Chi-Jen Lo
CPC classification number: G06F1/187 , H05K5/0295
Abstract: A removable mechanism for drawing an object from a housing is disclosed. The removable mechanism includes a first rail disposed inside the housing and on a side of the object for guiding the object to move inside the housing. The removable mechanism further includes a driving rod installed on the first rail in a movable manner for driving the object to move in a first direction, and a pull rod pivoted to the driving rod for pulling the driving rod to drive the object to move in the first direction so as to eject from the housing when being rotated out of the housing and being pulled.
Abstract translation: 公开了一种用于从壳体中拉出物体的可移除机构。 可移动机构包括设置在壳体内部和物体侧面上的引导物体在壳体内移动的第一轨道。 可移除机构还包括以可移动的方式安装在第一轨道上的驱动杆，用于驱动物体沿第一方向移动;以及拉杆，其枢转到驱动杆，用于拉动驱动杆以驱动物体在 第一方向，以便在从壳体旋转出并被拉动时从壳体弹出。
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公开(公告)号：US20130270712A1
公开(公告)日：2013-10-17
申请号：US13447293
申请日：2012-04-16
Applicant: Hsin-Yu Chen , Yu-Han Tsai , Ching-Li Yang , Home-Been Cheng
Inventor： Hsin-Yu Chen , Yu-Han Tsai , Ching-Li Yang , Home-Been Cheng
IPC: H01L23/48 , H01L21/768
CPC classification number: H01L21/76802 , H01L21/76898 , H01L2924/0002
Abstract: A through silicon via structure and a method of fabricating the through silicon via structure are disclosed. After an interlayer dielectric is formed, a via hole is then formed to pass through the interlayer dielectric; thereafter, a dielectric liner is formed within the via hole and extends onto the interlayer dielectric; thereafter, the via hole is filled with a conductive material; and a chemical-mechanical polishing process is performed to planarize the conductive material, using the dielectric liner on the interlayer dielectric as a stop layer of the chemical-mechanical polishing process.
Abstract translation: 公开了一种通过硅通孔结构和制造通孔硅通孔结构的方法。 在形成层间电介质后，形成通孔，穿过层间电介质; 此后，在通孔内形成电介质衬垫并延伸到层间电介质上; 此后，通孔填充有导电材料; 并且使用层间电介质上的电介质衬垫作为化学机械抛光工艺的停止层，进行化学机械抛光工艺以使导电材料平坦化。
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8.发明授权公开(公告)号：US09042104B2
公开(公告)日：2015-05-26
申请号：US13596083
申请日：2012-08-28
Applicant: Yu-Han Tsai , Chun-Wang Lin , Ching-Wei Ku , Chia-Hsing Yu , Yao-Te Tsai , Chia-Hung Tsai
Inventor： Yu-Han Tsai , Chun-Wang Lin , Ching-Wei Ku , Chia-Hsing Yu , Yao-Te Tsai , Chia-Hung Tsai
CPC classification number: G06F1/187 , G11B33/124
Abstract: A portable electronic device includes an electronic module and an electronic module fixing structure. The electronic module fixing structure includes a main body, a sliding component, a rod and an elastic component connected between the main body and the sliding component. The main body has a track with a positioning portion. The sliding component is slidably disposed on the main body. The rod is rotatably connected with the sliding component. An end of the rod is adapted to move along the track. When the end is located at the positioning portion, the end and the positioning portion are interfered with each other to position the sliding component. When the electronic module pushes the sliding component, the rod is rotated to drive the end to move away from the positioning portion, and the sliding component pushes the electronic module away from the main body through elastic force of the elastic component.
Abstract translation: 便携式电子设备包括电子模块和电子模块固定结构。 电子模块固定结构包括连接在主体和滑动部件之间的主体，滑动部件，杆和弹性部件。 主体具有具有定位部分的轨道。 滑动部件可滑动地设置在主体上。 杆与滑动部件可旋转地连接。 杆的端部适于沿着轨道移动。 当端部位于定位部分时，端部和定位部分相互干涉以定位滑动部件。 当电子模块推动滑动部件时，杆被旋转以驱动端部移动远离定位部分，并且滑动部件通过弹性部件的弹力将电子模块推离主体。
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公开(公告)号：US08518823B2
公开(公告)日：2013-08-27
申请号：US13335948
申请日：2011-12-23
Applicant: Kuo-Hsiung Huang , Chun-Mao Chiou , Hsin-Yu Chen , Yu-Han Tsai , Ching-Li Yang , Home-Been Cheng
Inventor： Kuo-Hsiung Huang , Chun-Mao Chiou , Hsin-Yu Chen , Yu-Han Tsai , Ching-Li Yang , Home-Been Cheng
IPC: H01L23/522 , H01L21/768
CPC classification number: H01L21/76843 , H01L21/76898 , H01L23/481 , H01L23/525 , H01L2224/13 , H01L2924/1461 , H01L2924/00
Abstract: The present invention relates to a through silicon via (TSV). The TSV is disposed in a substrate including a via opening penetrating through a first surface and a second surface of the substrate. The TSV includes an insulation layer, a barrier layer, a buffer layer and a conductive electrode. The insulation layer is disposed on the surface of the via opening. The barrier layer is disposed on the surface of the insulation layer. The conductive electrode is disposed on the surface of the buffer layer and fills the via opening. The buffer layer further covers a surface of the conductive electrode at the side of the second surface. The present invention further discloses a method of forming the TSV.
Abstract translation: 本发明涉及一种硅通孔（TSV）。 TSV设置在包括穿过基板的第一表面和第二表面的通孔的基板中。 TSV包括绝缘层，阻挡层，缓冲层和导电电极。 绝缘层设置在通孔开口的表面上。 阻挡层设置在绝缘层的表面上。 导电电极设置在缓冲层的表面上并填充通孔。 缓冲层进一步覆盖在第二表面侧的导电电极的表面。 本发明还公开了一种形成TSV的方法。
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公开(公告)号：US20130161796A1
公开(公告)日：2013-06-27
申请号：US13335948
申请日：2011-12-23
Applicant: Kuo-Hsiung Huang , Chun-Mao Chiou , Hsin-Yu Chen , Yu-Han Tsai , Ching-Li Yang , Home-Been Cheng
Inventor： Kuo-Hsiung Huang , Chun-Mao Chiou , Hsin-Yu Chen , Yu-Han Tsai , Ching-Li Yang , Home-Been Cheng
IPC: H01L23/522 , H01L21/768
CPC classification number: H01L21/76843 , H01L21/76898 , H01L23/481 , H01L23/525 , H01L2224/13 , H01L2924/1461 , H01L2924/00
Abstract: The present invention relates to a through silicon via (TSV). The TSV is disposed in a substrate including a via opening penetrating through a first surface and a second surface of the substrate. The TSV includes an insulation layer, a barrier layer, a buffer layer and a conductive electrode. The insulation layer is disposed on the surface of the via opening. The barrier layer is disposed on the surface of the insulation layer. The conductive electrode is disposed on the surface of the buffer layer and fills the via opening. The buffer layer further covers a surface of the conductive electrode at the side of the second surface. The present invention further discloses a method of forming the TSV.
Abstract translation: 本发明涉及一种硅通孔（TSV）。 TSV设置在包括穿过基板的第一表面和第二表面的通孔的基板中。 TSV包括绝缘层，阻挡层，缓冲层和导电电极。 绝缘层设置在通孔开口的表面上。 阻挡层设置在绝缘层的表面上。 导电电极设置在缓冲层的表面上并填充通孔。 缓冲层进一步覆盖在第二表面侧的导电电极的表面。 本发明还公开了一种形成TSV的方法。
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