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    Substituted pyrrolo[3,2-d]pyrimidine derivatives
    1.
    发明授权
    Substituted pyrrolo[3,2-d]pyrimidine derivatives 失效
    取代的吡咯并[3,2-d]嘧啶衍生物

    公开(公告)号：US07557113B2

    公开(公告)日：2009-07-07

    申请号：US10928969

    申请日：2004-08-26

    申请人： Takaharu Tsutsumi ,  Satoshi Sugiura ,  Masahiro Koga ,  Yoshiyuki Matsumoto ,  Toshihiro Ishii ,  Akira Nakano ,  Gen Unoki ,  Yuri Sakai ,  Reiko Takarada ,  Hiroko Ogawa

    发明人： Takaharu Tsutsumi ,  Satoshi Sugiura ,  Masahiro Koga ,  Yoshiyuki Matsumoto ,  Toshihiro Ishii ,  Akira Nakano ,  Gen Unoki ,  Yuri Sakai ,  Reiko Takarada ,  Hiroko Ogawa

    IPC分类号： C07D487/04 ,  A61K31/519 ,  A61P35/04 ,  A61P25/18

    CPC分类号： C07D487/04

    摘要： A compound having GSK-3 inhibitory activity. A1 and A3 are a single bond, an aliphatic hydrocarbon group; A2 and A4 are a single bond, CO, COO, CONR, O, OCO, NR, NRCO, NRCOO, etc.; G1 is a single bond, an aliphatic hydrocarbon, aromatic hydrocarbon, heterocyclic; G2 is H, an aliphatic hydrocarbon, an alicyclic hydrocarbon, an aromatic hydrocarbon, heterocyclic; A5 is a single bond, NR; R2 is H, halogen, an aliphatic hydrocarbon, alicyclic hydrocarbon, aromatic hydrocarbon, heterocyclic; A6 is a single bond, NR, CO, NRCO, NRCONR, CONR, COO, O, etc.; R3 is H, halogen, nitro, saturated aliphatic hydrocarbon, alicyclic hydrocarbon, aromatic hydrocarbon, heterocyclic; and R3 may be a trimethylsilyl, formyl, acyl, carboxyl, alkoxylcarbonyl, carbamoyl, alkylcarbamoyl, or cyano group when A6 is CR═CR or C≡C, wherein R is H or an lower aliphatic hydrocarbon group.

    摘要翻译： 具有GSK-3抑制活性的化合物。 A1和A3是单键，脂族烃基; A2和A4是单键，CO，COO，CONR，O，OCO，NR，NRCO，NRCOO等; G1是单键，脂族烃，芳烃，杂环; G 2是H，脂族烃，脂环烃，芳烃，杂环; A5是单键，NR; R2是H，卤素，脂族烃，脂环族烃，芳烃，杂环; A6是单键，NR，CO，NRCO，NRCONR，CONR，COO，O等; R3是H，卤素，硝基，饱和脂肪烃，脂环族烃，芳烃，杂环; 当A6是CR-CR或C≡C时，R3可以是三甲基甲硅烷基，甲酰基，酰基，羧基，烷氧基羰基，氨基甲酰基，烷基氨基甲酰基或氰基，其中R是H或低级脂族烃基。

    Pyrrolopyrimidinone derivatives
    2.
    发明申请
    Pyrrolopyrimidinone derivatives 失效
    吡咯并嘧啶酮衍生物

    公开(公告)号：US20060160831A1

    公开(公告)日：2006-07-20

    申请号：US10928969

    申请日：2004-08-26

    申请人： Takaharu Tsutsumi ,  Satoshi Sugiura ,  Masahiro Koga ,  Yoshiyuki Matsumoto ,  Toshihiro Ishii ,  Akira Nakano ,  Gen Unoki ,  Yuri Sakai ,  Reiko Takarada ,  Hiroko Ogawa

    发明人： Takaharu Tsutsumi ,  Satoshi Sugiura ,  Masahiro Koga ,  Yoshiyuki Matsumoto ,  Toshihiro Ishii ,  Akira Nakano ,  Gen Unoki ,  Yuri Sakai ,  Reiko Takarada ,  Hiroko Ogawa

    IPC分类号： A61K31/519 ,  C07D487/02

    CPC分类号： C07D487/04

    摘要： A compound having GSK-3 inhibitory activity. A1 and A3 are a single bond, an aliphatic hydrocarbon group; A2 and A4 are a single bond, CO, COO, CONR, O, OCO, NR, NRCO, NRCOO, etc.; G1 is a single bond, an aliphatic hydrocarbon, aromatic hydrocarbon, heterocyclic; G2 is H, an aliphatic hydrocarbon, an alicyclic hydrocarbon, an aromatic hydrocarbon, heterocyclic; A5 is a single bond, NR; R2 is H, halogen, an aliphatic hydrocarbon, alicyclic hydrocarbon, aromatic hydrocarbon, heterocyclic; A6 is a single bond, NR, CO, NRCO, NRCONR, CONR, COO, O, etc.; R3 is H, halogen, nitro, saturated aliphatic hydrocarbon, alicyclic hydrocarbon, aromatic hydrocarbon, heterocyclic; and R3 may be a trimethylsilyl, formyl, acyl, carboxyl, alkoxylcarbonyl, carbamoyl, alkylcarbamoyl, or cyano group when A6 is CR═CR or C≡C, wherein R is H or an lower aliphatic hydrocarbon group.

    摘要翻译： 具有GSK-3抑制活性的化合物。 A 1和A 3是单键，脂族烃基; A <2>和A 4是单键，CO，COO，CONR，O，OCO，NR，NRCO，NRCOO等; G 1是单键，脂族烃，芳族烃，杂环基; G 2是H，脂族烃，脂环烃，芳族烃，杂环基; A <5>是单键NR; R 2是H，卤素，脂族烃，脂环烃，芳烃，杂环; NR 6 CO 2，NRCO，NRCONR，CONR，COO，O等单键。 R 3是H，卤素，硝基，饱和脂族烃，脂环烃，芳族烃，杂环; 当A 6是CR-CR或C≡C时，R 3可以是三甲基甲硅烷基，甲酰基，酰基，羧基，烷氧基羰基，氨基甲酰基，烷基氨基甲酰基或氰基，其中 R是H或低级脂族烃基。

    Thermoelectric module and a method of fabricating the same
    4.
    发明授权
    Thermoelectric module and a method of fabricating the same 失效
    热电模块及其制造方法

    公开(公告)号：US06391676B1

    公开(公告)日：2002-05-21

    申请号：US09200972

    申请日：1998-11-30

    申请人： Michimasa Tsuzaki ,  Nobuteru Maekawa ,  Narimasa Iwamoto ,  Junji Imai ,  Hiroaki Okada ,  Teruaki Komatsu ,  Shinya Murase ,  Hiroyuki Inoue ,  Masayuki Sagawa ,  Yuri Sakai

    发明人： Michimasa Tsuzaki ,  Nobuteru Maekawa ,  Narimasa Iwamoto ,  Junji Imai ,  Hiroaki Okada ,  Teruaki Komatsu ,  Shinya Murase ,  Hiroyuki Inoue ,  Masayuki Sagawa ,  Yuri Sakai

    IPC分类号： H01L2100

    CPC分类号： H01L35/325 ,  H01L35/32 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A thermoelectric module is capable of successfully reducing the heat stress for increased reliability. The module includes a plurality of thermoelectric chips of P-type and N-type arranged in a matrix between sets of first and second contacts to form a series electrical circuit. The chips are arranged to give at least three chip arrays each having a limited number of the chips. A first carrier is provided on one side of the chips to carry the first contacts and to include first bridges each integrally joining two adjacent first contacts to define first discrete couples for electrical connection of the chips in each chip array. The first carrier further includes at least two inter-array bridges which are solely responsible for electrical interconnection between the adjacent chip arrays. On the opposite side of the chips, there are formed a plurality of second bridges each integrally joining the two adjacent second contacts to give second discrete couples for electrical connection of the two adjacent chips in each of the chip arrays. Thus, the inter-array bridges are formed only on one side of the chips for interconnection of the first contacts between the adjacent chip arrays. Therefore, the heat stress applied to the end of the chip array where the two adjacent chip arrays are interconnected can be well relieved on the side of the second contacts in which the second discrete couples are kept totally isolated from each other.

    摘要翻译： 热电模块能够成功地降低热应力以提高可靠性。 该模块包括在第一和第二触点组之间以矩阵形式布置的多个P型和N型热电芯片，以形成串联电路。 芯片被布置成给出至少三个芯片阵列，每个芯片阵列具有有限数量的芯片。 第一载体设置在芯片的一侧以承载第一触点并且包括每个一体地连接两个相邻的第一触点的第一桥，以限定用于每个芯片阵列中的芯片的电连接的第一离散耦合。 第一载体还包括至少两个排列间桥，其单独负责相邻芯片阵列之间的电互连。 在芯片的相对侧，形成多个第二桥，每个第二桥整体地连接两个相邻的第二触点，以给出第二离散耦合，用于电连接每个芯片阵列中的两个相邻的芯片。 因此，阵列间桥仅形成在芯片的一侧，用于相邻芯片阵列之间的第一触点的互连。 因此，施加到两个相邻芯片阵列相互连接的芯片阵列的端部的热应力可以在第二接触件的一侧彼此完全隔离的第二触头侧得到很好的缓解。

    Method of fabricating a thermoelectric module
    5.
    发明授权
    Method of fabricating a thermoelectric module 失效
    制造热电模块的方法

    公开(公告)号：US5950067A

    公开(公告)日：1999-09-07

    申请号：US973095

    申请日：1998-03-19

    申请人： Nobuteru Maegawa ,  Hiroaki Okada ,  Michimasa Tsuzaki ,  Yuri Sakai ,  Katsuyoshi Shimoda ,  Teruaki Komatsu ,  Shinya Murase ,  Hiroyuki Inoue ,  Masayuki Sagawa

    发明人： Nobuteru Maegawa ,  Hiroaki Okada ,  Michimasa Tsuzaki ,  Yuri Sakai ,  Katsuyoshi Shimoda ,  Teruaki Komatsu ,  Shinya Murase ,  Hiroyuki Inoue ,  Masayuki Sagawa

    IPC分类号： H01L35/32 ,  H01L35/34 ,  H01L21/324

    CPC分类号： H01L35/32 ,  H01L35/325 ,  H01L35/34 ,  Y10S257/93

    摘要： A method of fabricating a thermoelectric module in which a plurality of thermoelectric chips are arranged in a matrix between first and second dielectric substrates and electrically connected in series so as to heat one of the substrates and cool the other substrate. Elongated thermoelectric bars of P-type and N-type to be cut into the chips are employed together with a first conductive plate having a plurality of first contacts arranged in a matrix pattern. Adjacent first contacts spaced along the row are interconnected by horizontal bridges. The method of the present invention comprises the steps of integrating the first conductive plate to the first substrate to support the first conductive plate thereby; placing a plurality of the bars of the P-type and N-type on the first contacts along the rows in such a manner that the P-type bars alternate with the N-type bars in a spaced relation along the column; bonding each bar on its one face to the first contacts; cutting each bar into the chips and cutting the horizontal bridges simultaneously to allocate the chips on the individual first contacts; placing a plurality of second contacts of a second substrate onto the chips to form a series electric circuit of the chips in combination with the first contacts, and bonding the second substrate supporting the second contacts to the first substrate.

    摘要翻译： PCT No.PCT / JP97 / 01797 Sec。 371日期：1998年3月19日 102（e）1998年3月19日PCT PCT 1997年6月3日PCT公布。 公开号WO97 / 45882 日期1997年12月4日一种制造热电模块的方法，其中多个热电芯片以矩阵形式布置在第一和第二电介质基板之间并串联电连接以加热其中一个基板并冷却另一个基板。 将要切割成芯片的P型和N型的细长热电棒与具有以矩阵图案排列的多个第一触头的第一导电板一起使用。 沿着行间隔的相邻的第一接触件通过水平桥互连。 本发明的方法包括以下步骤：将第一导电板与第一基板集成，从而支撑第一导电板; 沿着行将P型和N型的多个条放置在第一触点上，使得P型条以与柱相隔的关系与N型条交替; 将其一个面上的每个条连接到第一触点; 将每个棒切割成芯片并同时切割水平桥，以将芯片分配在单独的第一触点上; 将第二基板的多个第二触点放置在芯片上以与第一触点组合形成芯片的串联电路，以及将支撑第二触点的第二基板接合到第一基板。

    Preventing Agent Against Drug-Resistant Bacterial Infection
    6.
    发明申请
    Preventing Agent Against Drug-Resistant Bacterial Infection 审中-公开
    防止药物抗药性细菌感染

    公开(公告)号：US20080206380A1

    公开(公告)日：2008-08-28

    申请号：US12048899

    申请日：2008-03-14

    申请人： Kazunari Ushida ,  Takamitsu Tsukahara ,  Yuri Sakai ,  Wakoto Bukawa ,  Noritaka Matsubara

    发明人： Kazunari Ushida ,  Takamitsu Tsukahara ,  Yuri Sakai ,  Wakoto Bukawa ,  Noritaka Matsubara

    IPC分类号： A61K35/74 ,  A61P31/04

    CPC分类号： A61K35/741 ,  A61K35/744 ,  A61K2300/00

    摘要： The present invention is to provide an agent for preventing and treating drug-resistant bacterial infection for livestock/fowls or fish and shellfish, using particular microbial agents as active components, without using synthetic antibacterial substances or antibiotics, and a method for preventing and treating its infection. By using lactic acid bacteria, their dead bacteria or treated substances thereof, or Mygasphaera elsdenii as active components, for an agent for preventing and treating drug-resistant bacterial infection for livestock/fowls or fish and shellfish carrying or being infected by drug-resistant bacteria such as Vancomycin, particularly by using Enterococcus faecalis, Enterococcus faecium as lactic acid bacteria, the above mentioned object was resolved.

    摘要翻译： 本发明提供一种用于预防和治疗家畜/家禽或鱼和贝类的耐药性细菌感染的试剂，使用特定的微生物剂作为活性成分，而不使用合成的抗菌物质或抗生素，以及用于预防和治疗其的方法 感染。 通过使用乳酸菌，其死菌或其处理物质或作为活性成分的Mygasphaera elsdenii，用于预防和治疗携带或被耐药细菌感染的家畜/家禽或鱼和贝类的耐药性细菌感染的试剂 如万古霉素，特别是通过使用粪肠球菌，屎肠球菌作为乳酸菌，解决了上述目的。

    Thermoelectric module with interarray bridges
    7.
    发明授权
    Thermoelectric module with interarray bridges 失效
    带电桥的热电模块

    公开(公告)号：US06400013B1

    公开(公告)日：2002-06-04

    申请号：US09709577

    申请日：2000-11-13

    申请人： Michimasa Tsuzaki ,  Nobuteru Maekawa ,  Narimasa Iwamoto ,  Junji Imai ,  Hiroaki Okada ,  Teruaki Komatsu ,  Shinya Murase ,  Hiroyuki Inoue ,  Masayuki Sagawa ,  Yuri Sakai

    发明人： Michimasa Tsuzaki ,  Nobuteru Maekawa ,  Narimasa Iwamoto ,  Junji Imai ,  Hiroaki Okada ,  Teruaki Komatsu ,  Shinya Murase ,  Hiroyuki Inoue ,  Masayuki Sagawa ,  Yuri Sakai

    IPC分类号： H01L2334

    CPC分类号： H01L35/325 ,  H01L35/32 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A thermoelectric module is capable of successfully reducing the heat stress for increased reliability. The module includes a plurality of thermoelectric chips of P-type and N-type arranged in a matrix between sets of first and second contacts to form a series electrical circuit. The chips are arranged to give at least three chip arrays each having a limited number of the chips. A first carrier is provided on one side of the chips to carry the first contacts and to include first bridges each integrally joining two adjacent first contacts to define first discrete couples for electrical connection of the chips in each chip array. The first carrier further includes at least two inter-array bridges which are solely responsible for electrical interconnection between the adjacent chip arrays. On the opposite side of the chips, there are formed a plurality of second bridges each integrally joining the two adjacent second contacts to give second discrete couples for electrical connection of the two adjacent chips in each of the chip arrays. Thus, the inter-array bridges are formed only on one side of the chips for interconnection of the first contacts between the adjacent chip arrays. Therefore, the heat stress applied to the end of the chip array where the two adjacent chip arrays are interconnected can be well relieved on the side of the second contacts in which the second discrete couples are kept totally isolated from each other.

    摘要翻译： 热电模块能够成功地降低热应力以提高可靠性。 该模块包括在第一和第二触点组之间以矩阵形式布置的多个P型和N型热电芯片，以形成串联电路。 芯片被布置成给出至少三个芯片阵列，每个芯片阵列具有有限数量的芯片。 第一载体设置在芯片的一侧以承载第一触点并且包括每个一体地连接两个相邻的第一触点的第一桥，以限定用于每个芯片阵列中的芯片的电连接的第一离散耦合。 第一载体还包括至少两个排列间桥，其单独负责相邻芯片阵列之间的电互连。 在芯片的相对侧，形成多个第二桥，每个第二桥整体地连接两个相邻的第二触点，以给出第二离散耦合，用于电连接每个芯片阵列中的两个相邻的芯片。 因此，阵列间桥仅形成在芯片的一侧，用于相邻芯片阵列之间的第一触点的互连。 因此，施加到两个相邻芯片阵列相互连接的芯片阵列的端部的热应力可以在第二接触件的一侧彼此完全隔离的第二触头侧得到很好的缓解。

    Preventing agent against drug-resistant bacterial infection
    9.
    发明申请
    Preventing agent against drug-resistant bacterial infection 审中-公开
    预防药物耐药性细菌感染

    公开(公告)号：US20060067923A1

    公开(公告)日：2006-03-30

    申请号：US11083513

    申请日：2005-03-18

    申请人： Kazunari Ushida ,  Takamitsu Tsukahara ,  Yuri Sakai ,  Wakoto Bukawa ,  Noritaka Matsubara

    发明人： Kazunari Ushida ,  Takamitsu Tsukahara ,  Yuri Sakai ,  Wakoto Bukawa ,  Noritaka Matsubara

    IPC分类号： A61K35/74 ,  A61K39/02

    CPC分类号： A61K35/741 ,  A61K35/744 ,  A61K2300/00

    摘要： The present invention is to provide an agent for preventing and treating drug-resistant bacterial infection for livestock/fowls or fish and shellfish, using particular microbial agents as active components, without using synthetic antibacterial substances or antibiotics, and a method for preventing and treating its infection. By using lactic acid bacteria, their dead bacteria or treated substances thereof, or Mygasphaera elsdenii as active components, for an agent for preventing and treating drug-resistant bacterial infection for livestock/fowls or fish and shellfish carrying or being infected by drug-resistant bacteria such as Vancomycin, particularly by using Enterococcus faecalis, Enterococcus faecium as lactic acid bacteria, the above mentioned object was resolved.

    摘要翻译： 本发明提供一种用于预防和治疗家畜/家禽或鱼和贝类的耐药性细菌感染的试剂，使用特定的微生物剂作为活性成分，而不使用合成的抗菌物质或抗生素，以及用于预防和治疗其的方法 感染。