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公开(公告)号：US20250043159A1
公开(公告)日：2025-02-06
申请号：US18714865
申请日：2022-12-12
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Junbeom Shin , Jeongwan Choi , Jong-Pil Kim
Abstract: The disclosure relates to an electrically conductive bonding tape and an electronic device including the same. Specifically, according to an embodiment of the disclosure, there is provided an electrically conductive bonding tape, including an electrically conductive first adhesive layer including opposing first and second major surfaces and electrically conductive along at least a thickness direction, the first adhesive layer having an average thickness t and including a substantially electrically insulative first adhesive material and pluralities of electrically conductive first and second particles dispersed in the first adhesive material, the first and second particles having respective average thickness t1 and t2, t1/t being 0.7-0.95 inclusive, t2/t being 0.2-0.7 inclusive.
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公开(公告)号：US20240296985A1
公开(公告)日：2024-09-05
申请号：US18578425
申请日：2022-07-19
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Jinwook Kim , Seong-Woo Woo , Sang-Jun Mo , Dongeun Lee , Jong-Pil Kim
CPC classification number: H01F10/10 , H01F27/2847 , H01F27/2871 , H02J50/005 , H02J50/10 , H01F2027/2857
Abstract: The disclosure relates to a coil and an electrical system including the same. Specifically, according to an embodiment of the disclosure, there is provided a coil including: main coil surfaces which are opposite each other and are substantially planar; and a multilayer film which is wound to form a plurality of loops which are substantially concentric, wherein the plurality of loops include an innermost loop including a first longitudinal direction end of the coil, and an outermost loop including a second longitudinal direction end of the coil, wherein the multilayer film includes a plurality of first electro-conductive layers which alternate with each other, and one or more second electrical insulation layers, wherein the first electro-conductive layer and the second electrical insulation layer have a width and a length which are substantially coextensive therebetween, such that the main coil surfaces, which are substantially planar, include corresponding end surfaces of the first electro-conductive layer and the second electrical insulation layer, respectively, wherein at least two first electro-conductive layers have different average thicknesses to reduce an alternating current resistance of the coil by 5%-11.3% inclusive in a frequency of at least about 148 KHz.
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公开(公告)号：US20240414845A1
公开(公告)日：2024-12-12
申请号：US18698113
申请日：2022-10-05
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Jeongwan Choi , Jong-Pil Kim , Jinbae Kim , Jeffrey W. McCutcheon
Abstract: The disclosure relates to an integral electronic stack and a multi-layer stack. Specifically, according to an embodiment of the disclosure, there is provided an integral electronic stack for grounding an electrically conductive component in which passive intermodulation (PIM) is reduced, wherein the integral electronic stack includes a first integral stack and a second integral stack, the first integral stack being bonded to the second integral stack, wherein the first integral stack includes: a first board which is substantially rigid; a first electrically conductive layer which is disposed on at least part of a first main surface of the first board; a first electrically conductive adhesive layer and a second electrically conductive adhesive layer; and a first electrically conductive film which is disposed between the first electrically conductive adhesive layer and the second electrically conductive adhesive layer, and is bonded to the first electrically conductive adhesive layer and the second electrically conductive adhesive layer, respectively, the first electrically conductive adhesive layer and the second electrically conductive adhesive layer including a plurality of electrically conductive elements substantially distributed in an electrically insulative material, wherein the first electrically conductive adhesive layer bonds the first electrically conductive film to the one or more first electrically conductive layer.
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公开(公告)号：US20240084176A1
公开(公告)日：2024-03-14
申请号：US18239887
申请日：2023-08-30
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Junbeom Shin , Jeongwan Choi , Jong-Pil Kim
CPC classification number: C09J9/02 , C09J5/00 , C09J7/21 , H01B5/00 , H05K3/20 , C09J2203/326 , C09J2301/1242 , C09J2301/408 , C09J2400/166
Abstract: An electrically conductive bonding tape includes a conductive first film between, and bonded to, conductive first and second adhesive layers. The first film and the first and second adhesive layers are conductive at least along a thickness direction of the bonding tape. Each of the first and second adhesive layers includes conductive particles dispersed substantially as a single layer in a substantially insulative adhesive material. The plurality of conductive particles in each of the first and second adhesive layers has an average particle size Pav and a standard of deviation Psd, such that Psd/Pav is less than about 0.2. Each of the first and second adhesive layers has an average thickness of no more than about 15% greater than the average particle size of the particles in the adhesive layer. An average surface roughness of opposing major first and second surfaces of the first film is less than 10 microns.
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