ELECTRONIC ASSEMBLY, ELECTRONIC APPARATUS INCLUDING THE SAME AND METHOD FOR FABRICATING ELECTRONIC ASSEMBLY

    公开(公告)号:US20220262740A1

    公开(公告)日:2022-08-18

    申请号:US17737285

    申请日:2022-05-05

    IPC分类号: H01L23/552 H05K9/00

    摘要: An electronic assembly according to an embodiment includes: a circuit board including a first edge surface and a trace having an electrical conductivity; an electronic element including a lateral edge spatially spaced apart from the first edge surface, and mounted on the circuit board and electrically connected to the trace; a protection layer including a second edge surface and disposed on the electronic element to substantially cover the electronic element; a magnetic field shielding film including a third edge surface and disposed on the protection layer; and a first metal layer. The first edge surface connects a main top surface of the circuit board and a main bottom surface of the circuit board, the second edge surface connects a main top surface of the protection layer and a main bottom surface of the protection layer, and the third edge surface connects a main top surface of the magnetic field shielding film and a main bottom surface of the magnetic field shielding film, and the first edge surface, the second edge surface, and the third edge surface are substantially aligned with one another to form a coupling edge surface which is substantially planar. In addition, the first metal layer is disposed on the magnetic field shielding film, and covers the main top surface of the magnetic field shielding film and the coupling edge surface.

    Electronic assembly, electronic apparatus including the same and method for fabricating electronic assembly

    公开(公告)号:US10985111B2

    公开(公告)日:2021-04-20

    申请号:US16822145

    申请日:2020-03-18

    IPC分类号: H01L23/552 H05K9/00

    摘要: An electronic assembly according to an embodiment includes: a circuit board including a first edge surface and a trace having an electrical conductivity; an electronic element including a lateral edge spatially spaced apart from the first edge surface, and mounted on the circuit board and electrically connected to the trace; a protection layer including a second edge surface and disposed on the electronic element to substantially cover the electronic element; a magnetic field shielding film including a third edge surface and disposed on the protection layer; and a first metal layer. The first edge surface connects a main top surface of the circuit board and a main bottom surface of the circuit board, the second edge surface connects a main top surface of the protection layer and a main bottom surface of the protection layer, and the third edge surface connects a main top surface of the magnetic field shielding film and a main bottom surface of the magnetic field shielding film, and the first edge surface, the second edge surface, and the third edge surface are substantially aligned with one another to form a coupling edge surface which is substantially planar. In addition, the first metal layer is disposed on the magnetic field shielding film, and covers the main top surface of the magnetic field shielding film and the coupling edge surface.

    MAGNETIC FILM
    4.
    发明申请

    公开(公告)号:US20210005371A1

    公开(公告)日:2021-01-07

    申请号:US16904997

    申请日:2020-06-18

    IPC分类号: H01F10/08

    摘要: A magnetic film includes one or more magnetically conductive layers. Each magnetically conductive layer is cracked to form a plurality of first through-cracks defining a plurality of magnetically conductive segments. The first through-cracks extend along a first direction and form a first regular pattern along an orthogonal second direction at a first pitch P1, such that a Fourier transform of the first regular pattern has a first peak along the second direction at a first spatial frequency corresponding to the first pitch P1. The first through-cracks have an average length L1 along the first direction. L1/P1 is greater than or equal to 5.

    ELECTRONIC ASSEMBLY, ELECTRONIC APPARATUS INCLUDING THE SAME AND METHOD FOR FABRICATING ELECTRONIC ASSEMBLY

    公开(公告)号:US20200303320A1

    公开(公告)日:2020-09-24

    申请号:US16822145

    申请日:2020-03-18

    IPC分类号: H01L23/552

    摘要: An electronic assembly according to an embodiment includes: a circuit board including a first edge surface and a trace having an electrical conductivity; an electronic element including a lateral edge spatially spaced apart from the first edge surface, and mounted on the circuit board and electrically connected to the trace; a protection layer including a second edge surface and disposed on the electronic element to substantially cover the electronic element; a magnetic field shielding film including a third edge surface and disposed on the protection layer; and a first metal layer. The first edge surface connects a main top surface of the circuit board and a main bottom surface of the circuit board, the second edge surface connects a main top surface of the protection layer and a main bottom surface of the protection layer, and the third edge surface connects a main top surface of the magnetic field shielding film and a main bottom surface of the magnetic field shielding film, and the first edge surface, the second edge surface, and the third edge surface are substantially aligned with one another to form a coupling edge surface which is substantially planar. In addition, the first metal layer is disposed on the magnetic field shielding film, and covers the main top surface of the magnetic field shielding film and the coupling edge surface.

    ANTENNA FOR TRANSFER OF INFORMATION OR ENERGY

    公开(公告)号:US20230077474A1

    公开(公告)日:2023-03-16

    申请号:US17800384

    申请日:2021-02-24

    摘要: An antenna for transfer of information or energy is described. The antenna includes an electrically conductive first layer having a width in a thickness direction of the antenna and extending longitudinally along a length of the first layer between first and second longitudinal ends of the first layer, and an electrically insulative thermally conductive second layer bonded to the first layer along the length of the first layer. The first and second layers are wound to form a plurality of substantially concentric loops. A width and a length of the second layer are substantially co-extensive with the respective width and length of the first layer so as to expose opposing longitudinal edge surfaces of the first layer along the length of the first layer. Coils and assemblies useful for making coils are also described.

    SHIELDING TAPE FOR ELECTROMAGNETIC WAVE

    公开(公告)号:US20210076547A1

    公开(公告)日:2021-03-11

    申请号:US15733782

    申请日:2019-05-07

    摘要: A shielding tape according to an embodiment of the present disclosure includes a plurality of shielding members discrete from one another on a same plane, and, when the shielding tape is stretched in a first direction which is perpendicular to a thickness direction of the shielding tape, a distance between at least a portion of the shielding members increases, and a distance between the other portion of the shielding members is reduced.