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    ANTENNA FOR TRANSFER OF INFORMATION OR ENERGY
    2.
    发明申请
    ANTENNA FOR TRANSFER OF INFORMATION OR ENERGY 有权

    公开(公告)号：US20230077474A1

    公开(公告)日：2023-03-16

    申请号：US17800384

    申请日：2021-02-24

    Applicant: 3M INNOVATIVE PROPERTIES COMPANY

    Inventor： Seong-Woo Woo ,  Jinwook Kim ,  Jung Ju Suh ,  Jennifer J. Sokol ,  Charles L. Bruzzone

    IPC: H04B5/00 ,  H01F27/28 ,  H01F38/14 ,  H01F5/00

    Abstract: An antenna for transfer of information or energy is described. The antenna includes an electrically conductive first layer having a width in a thickness direction of the antenna and extending longitudinally along a length of the first layer between first and second longitudinal ends of the first layer, and an electrically insulative thermally conductive second layer bonded to the first layer along the length of the first layer. The first and second layers are wound to form a plurality of substantially concentric loops. A width and a length of the second layer are substantially co-extensive with the respective width and length of the first layer so as to expose opposing longitudinal edge surfaces of the first layer along the length of the first layer. Coils and assemblies useful for making coils are also described.

    SHIELDING TAPE FOR ELECTROMAGNETIC WAVE
    3.
    发明申请
    SHIELDING TAPE FOR ELECTROMAGNETIC WAVE 有权

    公开(公告)号：US20210076547A1

    公开(公告)日：2021-03-11

    申请号：US15733782

    申请日：2019-05-07

    Applicant: 3M INNOVATIVE PROPERTIES COMPANY

    Inventor： Seong-Woo Woo ,  Jung-Ju Suh

    IPC: H05K9/00 ,  C09J7/29 ,  B32B3/08 ,  B32B25/04

    Abstract: A shielding tape according to an embodiment of the present disclosure includes a plurality of shielding members discrete from one another on a same plane, and, when the shielding tape is stretched in a first direction which is perpendicular to a thickness direction of the shielding tape, a distance between at least a portion of the shielding members increases, and a distance between the other portion of the shielding members is reduced.

    Coil and Electrical System Including the Same
    6.
    发明公开
    Coil and Electrical System Including the Same 审中-公开

    公开(公告)号：US20230395306A1

    公开(公告)日：2023-12-07

    申请号：US18249420

    申请日：2021-10-18

    Applicant: 3M INNOVATIVE PROPERTIES COMPANY

    Inventor： Jinwook Kim ,  Seong-Woo Woo

    IPC: H01F27/29 ,  H02J50/10 ,  H02J50/00

    CPC classification number: H01F27/29 ,  H02J50/10 ,  H02J50/005

    Abstract: The present disclosure relates to a coil and an electrical system. According to an embodiment of the present disclosure, specifically, there is provided a coil including: main coil surfaces which face each other and are substantially planar; and a multilayer film which is wound to form a plurality of loops which are substantially concentric, wherein the plurality of loops include an innermost loop including a first longitudinal end of the multilayer film, a first intermediate loop, and an outermost loop including a second longitudinal end of the multilayer film, wherein the multilayer film includes a first electrical conduction layer, a second magnetic conduction layer, and a third adhesive layer, wherein the second magnetic conduction layer is coupled with the first electrical conduction layer by the third adhesive layer, wherein the first electrical conduction layer, the second magnetic conduction layer, and the third adhesive layer have widths and lengths which are substantially coextensive with one another, such that the main coil surfaces which are substantially planar include corresponding end surfaces of the first electrical conduction layer, the second magnetic conduction layer, and the third adhesive layer, respectively, wherein the first intermediate loop is disposed between the innermost loop and the outermost loop, wherein a first electro-conductive terminal is terminated on the first electrical conduction layer of the first intermediate loop.

    COIL, PLANAR COIL AND METHOD FOR MAKING COIL
    8.
    发明申请
    COIL, PLANAR COIL AND METHOD FOR MAKING COIL 有权

    公开(公告)号：US20230035952A1

    公开(公告)日：2023-02-02

    申请号：US17870217

    申请日：2022-07-21

    Applicant: 3M INNOVATIVE PROPERTIES COMPANY

    Inventor： Sang-jun Mo ,  Seong-Woo Woo ,  Jinwook Kim

    IPC: H01F27/32 ,  H01F1/34 ,  H01F41/063

    Abstract: The disclosure relates to a coil, a planar coil, and a method for making a coil. Specifically, according to an embodiment of the disclosure, a coil includes: main coil surfaces which are opposite each other and are substantially planar; and a multilayer film which is wound to form a plurality of loops which are substantially concentric, and the plurality of loops include an innermost loop including a first longitudinal direction end of the coil, and an outermost loop including a second longitudinal direction end of the coil, and the multilayer film includes a plurality of first electro-conductive layers which alternate with each other, and one or more second electrical insulation layer.

    ELECTRONIC ASSEMBLY, ELECTRONIC APPARATUS INCLUDING THE SAME AND METHOD FOR FABRICATING ELECTRONIC ASSEMBLY
    9.
    发明申请
    ELECTRONIC ASSEMBLY, ELECTRONIC APPARATUS INCLUDING THE SAME AND METHOD FOR FABRICATING ELECTRONIC ASSEMBLY 有权

    公开(公告)号：US20210202401A1

    公开(公告)日：2021-07-01

    申请号：US17249559

    申请日：2021-03-05

    Applicant: 3M INNOVATIVE PROPERTIES COMPANY

    Inventor： Jiwoong Kong ,  Jung Ju Suh ,  Seong-Woo Woo

    IPC: H01L23/552 ,  H05K9/00

    Abstract: An electronic assembly according to an embodiment includes: a circuit board including a first edge surface and a trace having an electrical conductivity; an electronic element including a lateral edge spatially spaced apart from the first edge surface, and mounted on the circuit board and electrically connected to the trace; a protection layer including a second edge surface and disposed on the electronic element to substantially cover the electronic element; a magnetic field shielding film including a third edge surface and disposed on the protection layer; and a first metal layer. The first edge surface connects a main top surface of the circuit board and a main bottom surface of the circuit board, the second edge surface connects a main top surface of the protection layer and a main bottom surface of the protection layer, and the third edge surface connects a main top surface of the magnetic field shielding film and a main bottom surface of the magnetic field shielding film, and the first edge surface, the second edge surface, and the third edge surface are substantially aligned with one another to form a coupling edge surface which is substantially planar. In addition, the first metal layer is disposed on the magnetic field shielding film, and covers the main top surface of the magnetic field shielding film and the coupling edge surface.

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