公开(公告)号：US20160007485A1

公开(公告)日：2016-01-07

申请号：US14790437

申请日：2015-07-02

Applicant: ABB TECHNOLOGY AG

Inventor： Samuel HARTMANN ,  David GUILLON ,  David HAJAS ,  Markus THUT

IPC: H05K5/00 ,  H01R43/20 ,  H05K3/30 ,  H01R43/02 ,  H05K1/11 ,  H05K1/18

CPC classification number: H05K5/0034 ,  B23K20/10 ,  H01L21/4853 ,  H01L23/047 ,  H01L23/3735 ,  H01L23/48 ,  H01L23/49861 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49097 ,  H01L2224/49111 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01R43/0207 ,  H01R43/205 ,  H05K1/111 ,  H05K1/181 ,  H05K3/301 ,  H05K2203/0285 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor module includes a base plate, a substrate on the base plate and carrying at least one semiconductor chip, a housing attached to the base plate and at least partially enclosing the substrate, and at least one terminal having one end which protrudes from the housing and another end which has a terminal foot attached on a terminal pad of the metallization by means of ultrasonic welding. The housing has a protective wall which encloses the terminal and divides an interior space of the housing into an unprotected region and a protected region. The protective wall is formed such that a gap is formed between the substrate and the protective wall. The gap is designed to carry a fluid flow such that particles produced during the ultrasonic welding of the terminal foot to the terminal pad are prevented from penetrating into the protected region from the unprotected region.

Abstract translation: 半导体模块包括基板，基板上的基板和至少一个半导体芯片，附接到基板并且至少部分地封装基板的壳体，以及至少一个端子，其一端从壳体突出 另一端通过超声波焊接具有连接在金属化的端子焊盘上的端子脚。 壳体具有保护壁，其围绕端子并将壳体的内部空间划分成未受保护的区域和受保护区域。 保护壁形成为使得在基板和保护壁之间形成间隙。 间隙被设计成承载流体流动，使得在端子脚的超声波焊接期间产生的颗粒被阻止从未受保护的区域渗透到受保护区域中。