公开(公告)号：US20150123262A1

公开(公告)日：2015-05-07

申请号：US14597642

申请日：2015-01-15

Applicant: ABB TECHNOLOGY AG

Inventor： Rolf SCHIFFERLI ,  Micha GILOMEN ,  Raeto STADLER

IPC: H01L25/11 ,  H02M7/00

CPC classification number: H01L25/117 ,  H01L24/72 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H02M7/003 ,  H01L2924/00

Abstract: An exemplary power semiconductor clamping stack includes a plurality of power semiconductor components that are arranged in a row along the stacking direction, and a first and second end plate. The row of power semiconductor components is arranged between the first and second end plate and a clamping force is applied to the first and second end plate in order to tension the row of power semiconductor components between the first and second end plate. A clamping force measuring device is arranged between the first end plate and the row of power semiconductor components in order to adjust the clamping force.

Abstract translation: 示例性功率半导体钳位堆叠包括沿堆叠方向排列成一排的多个功率半导体元件，以及第一和第二端板。 功率半导体部件行设置在第一和第二端板之间，并且夹紧力被施加到第一和第二端板，以便拉紧第一和第二端板之间的功率半导体部件行。 夹紧力测量装置设置在第一端板和一排功率半导体部件之间，以调节夹紧力。