CABINET WITH MODULES HAVING A THERMOSIPHON COOLER ARRANGEMENT
    1.
    发明申请
    CABINET WITH MODULES HAVING A THERMOSIPHON COOLER ARRANGEMENT 有权
    具有热固冷却器装置的模块的柜

    公开(公告)号:US20130104592A1

    公开(公告)日:2013-05-02

    申请号:US13664927

    申请日:2012-10-31

    CPC classification number: H05K7/20672 F28D15/0266 F28F9/26 H05K7/20936

    Abstract: The present disclosure relates to the cooling of electric and/or electronic components, in particular to an electric and/or electronic system with a cabinet, which includes a cabinet housing including a first aperture for receiving a stream of cooling air. The cabinet housing includes a second aperture for releasing the cooling air thereafter in an operating state of the cabinet. At least two modules, which each include a guiding structure with an inlet and an outlet, are provided in the cabinet. The at least two modules are arranged in the cabinet housing such that a branch of the major portion of cooling air flowing through the first aperture of the cabinet housing is enabled to flow into each module via the inlet guided by the guiding structure through the dedicated module to the outlet and thereafter through the second aperture out of the cabinet housing.

    Abstract translation: 本公开涉及电气和/或电子部件的冷却,特别是涉及具有机柜的电气和/或电子系统,其包括具有用于接收冷却空气流的第一孔的机壳外壳。 机柜壳体包括用于在机柜的操作状态之后释放冷却空气的第二孔。 在机柜中设置至少两个模块,每个模块包括具有入口和出口的引导结构。 至少两个模块布置在机柜壳体中,使得流过机柜壳体的第一孔的大部分冷却空气的分支能够经由引导结构通过专用模块引导的入口流入每个模块 到出口,然后通过第二孔从机柜外壳中取出。

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