公开(公告)号：US10674630B2

公开(公告)日：2020-06-02

申请号：US15089726

申请日：2016-04-04

Applicant: ABB Technology AG

Inventor： Francesco Agostini ,  Daniele Torresin ,  Bruno Agostini ,  Mathieu Habert ,  Francesco Moraschinelli ,  Antonello Antoniazzi

IPC: H05K7/20 ,  F28F9/02 ,  F28D1/053 ,  F28D15/02 ,  H01L23/40 ,  H01L23/473 ,  F28F1/02 ,  F28F1/32 ,  F28F3/12 ,  F28D21/00

Abstract: A heat exchange device may be based on a pulsating heat pipe and a cooling arrangement. The heat exchange device may include a plurality of pipes to provide fluid paths between a first fluid distribution element and a second fluid distribution element. Each pipe of the plurality of pipes may include a group of channels. Each of the first and second fluid distribution elements may include a plate of a first type. Each plate of the first type may include openings for providing alignment functionality for the plurality of pipes. The first fluid distribution element may include a plate of a second type that may include openings for providing fluid paths between the pipes. The plate of the second type may be positioned on a side of the plate of the first type of plates of the first fluid distribution element that is opposite to the second fluid distribution element.

公开(公告)号：US20130107455A1

公开(公告)日：2013-05-02

申请号：US13664878

申请日：2012-10-31

Applicant: ABB Technology AG

Inventor： Didier Cottet ,  Francesco Agostini ,  Thomas Grandinger ,  Andreas Vögeli

IPC: H05K7/20

CPC classification number: H05K7/20672 ,  F28D15/0266 ,  H02M7/003 ,  H02M2007/4835 ,  H05K7/20936

Abstract: A thermosiphon cooler arrangement is provided for the cooling of electric and/or electronic components, including a module of an electric and/or electronic system. The module includes a guiding structure and an inlet for receiving a stream of cooling air, and an outlet for releasing cooling air thereafter in an operating state of the module. The guiding structure is provided for guiding the cooling air entering through the inlet and leaving the module through the outlet in an operating state of the module. The module includes a thermosiphon cooler with an evaporator and a condenser for transferring a majority of a heat load to the cooling air in an operating state of the module. The evaporator is tilted with respect to the condenser wherein the condenser is arranged such that a major portion of the cooling air flows through the condenser.

Abstract translation: 提供了一种用于冷却包括电和/或电子系统的模块的电气和/或电子部件的热虹吸管冷却器装置。 模块包括导向结构和用于接收冷却空气流的入口，以及此后在模块的操作状态下释放冷却空气的出口。 引导结构用于引导通过入口进入的冷却空气，并在模块的操作状态下使模块通过出口。 模块包括具有蒸发器的热虹吸管冷却器和用于在模块的运行状态下将大部分热负荷转移到冷却空气的冷凝器。 蒸发器相对于冷凝器倾斜，其中冷凝器布置成使得大部分冷却空气流过冷凝器。

公开(公告)号：US20130104592A1

公开(公告)日：2013-05-02

申请号：US13664927

申请日：2012-10-31

Applicant: ABB Technology AG

Inventor： Didier COTTET ,  Francesco Agostini ,  Thomas Gradinger ,  Andreas Vögeli

IPC: F25D31/00 ,  F25B39/04 ,  F25B39/02 ,  F25D17/06 ,  F25D17/04

CPC classification number: H05K7/20672 ,  F28D15/0266 ,  F28F9/26 ,  H05K7/20936

Abstract: The present disclosure relates to the cooling of electric and/or electronic components, in particular to an electric and/or electronic system with a cabinet, which includes a cabinet housing including a first aperture for receiving a stream of cooling air. The cabinet housing includes a second aperture for releasing the cooling air thereafter in an operating state of the cabinet. At least two modules, which each include a guiding structure with an inlet and an outlet, are provided in the cabinet. The at least two modules are arranged in the cabinet housing such that a branch of the major portion of cooling air flowing through the first aperture of the cabinet housing is enabled to flow into each module via the inlet guided by the guiding structure through the dedicated module to the outlet and thereafter through the second aperture out of the cabinet housing.

Abstract translation: 本公开涉及电气和/或电子部件的冷却，特别是涉及具有机柜的电气和/或电子系统，其包括具有用于接收冷却空气流的第一孔的机壳外壳。 机柜壳体包括用于在机柜的操作状态之后释放冷却空气的第二孔。 在机柜中设置至少两个模块，每个模块包括具有入口和出口的引导结构。 至少两个模块布置在机柜壳体中，使得流过机柜壳体的第一孔的大部分冷却空气的分支能够经由引导结构通过专用模块引导的入口流入每个模块 到出口，然后通过第二孔从机柜外壳中取出。

公开(公告)号：US20160242320A1

公开(公告)日：2016-08-18

申请号：US15089726

申请日：2016-04-04

Applicant: ABB Technology AG

Inventor： Francesco Agostini ,  Daniele Torresin ,  Bruno Agostini ,  Mathieu Habert ,  Francesco Moraschinelli ,  Antonello Antoniazzi

IPC: H05K7/20 ,  F28F1/32 ,  F28F3/12 ,  F28F1/02 ,  F28D15/02 ,  F28F9/02

Abstract: A heat exchange device may be based on a pulsating heat pipe and a cooling arrangement. The heat exchange device may include a plurality of pipes to provide fluid paths between a first fluid distribution element and a second fluid distribution element. Each pipe of the plurality of pipes may include a group of channels. Each of the first and second fluid distribution elements may include a plate of a first type. Each plate of the first type may include openings for providing alignment functionality for the plurality of pipes. The first fluid distribution element may include a plate of a second type that may include openings for providing fluid paths between the pipes. The plate of the second type may be positioned on a side of the plate of the first type of plates of the first fluid distribution element that is opposite to the second fluid distribution element.

Abstract translation: 热交换装置可以基于脉动热管和冷却装置。 热交换装置可以包括多个管以在第一流体分配元件和第二流体分配元件之间提供流体路径。 多个管道中的每个管道可以包括一组通道。 第一和第二流体分配元件中的每一个可以包括第一类型的板。 第一类型的每个板可以包括用于提供多个管道的对准功能的开口。 第一流体分配元件可以包括第二类型的板，其可以包括用于在管之间提供流体路径的开口。 第二类型的板可以位于与第二流体分配元件相对的第一流体分配元件的第一类型的板的板的侧面上。

公开(公告)号：US09113579B2

公开(公告)日：2015-08-18

申请号：US13664927

申请日：2012-10-31

Applicant: ABB Technology AG

Inventor： Didier Cottet ,  Francesco Agostini ,  Thomas Gradinger ,  Andreas Vögeli

IPC: H05K7/20 ,  H01L23/473

CPC classification number: H05K7/20672 ,  F28D15/0266 ,  F28F9/26 ,  H05K7/20936

Abstract: The present disclosure relates to the cooling of electric and/or electronic components, in particular to an electric and/or electronic system with a cabinet, which includes a cabinet housing including a first aperture for receiving a stream of cooling air. The cabinet housing includes a second aperture for releasing the cooling air thereafter in an operating state of the cabinet. At least two modules, which each include a guiding structure with an inlet and an outlet, are provided in the cabinet. The at least two modules are arranged in the cabinet housing such that a branch of the major portion of cooling air flowing through the first aperture of the cabinet housing is enabled to flow into each module via the inlet guided by the guiding structure through the dedicated module to the outlet and thereafter through the second aperture out of the cabinet housing.

Abstract translation: 本公开涉及电气和/或电子部件的冷却，特别是涉及具有机柜的电气和/或电子系统，其包括具有用于接收冷却空气流的第一孔的机壳外壳。 机柜壳体包括用于在机柜的操作状态之后释放冷却空气的第二孔。 在机柜中设置至少两个模块，每个模块包括具有入口和出口的引导结构。 至少两个模块布置在机柜壳体中，使得流过机柜壳体的第一孔的大部分冷却空气的分支能够经由引导结构通过专用模块引导的入口流入每个模块 到出口，然后通过第二孔从机柜外壳中取出。

公开(公告)号：US09113578B2

公开(公告)日：2015-08-18

申请号：US13664878

申请日：2012-10-31

Applicant: ABB Technology AG

Inventor： Didier Cottet ,  Francesco Agostini ,  Thomas Gradinger ,  Andreas Vögeli

IPC: H05K7/20 ,  H01L23/473 ,  H02M7/483 ,  H02M7/00

CPC classification number: H05K7/20672 ,  F28D15/0266 ,  H02M7/003 ,  H02M2007/4835 ,  H05K7/20936

Abstract: A thermosiphon cooler arrangement is provided for the cooling of electric and/or electronic components, including a module of an electric and/or electronic system. The module includes a guiding structure and an inlet for receiving a stream of cooling air, and an outlet for releasing cooling air thereafter in an operating state of the module. The guiding structure is provided for guiding the cooling air entering through the inlet and leaving the module through the outlet in an operating state of the module. The module includes a thermosiphon cooler with an evaporator and a condenser for transferring a majority of a heat load to the cooling air in an operating state of the module. The evaporator is tilted with respect to the condenser wherein the condenser is arranged such that a major portion of the cooling air flows through the condenser.

Abstract translation: 提供了一种用于冷却包括电和/或电子系统的模块的电气和/或电子部件的热虹吸管冷却器装置。 模块包括导向结构和用于接收冷却空气流的入口，以及此后在模块的操作状态下释放冷却空气的出口。 引导结构用于引导通过入口进入的冷却空气，并在模块的操作状态下使模块通过出口。 模块包括具有蒸发器的热虹吸管冷却器和用于在模块的运行状态下将大部分热负荷转移到冷却空气的冷凝器。 蒸发器相对于冷凝器倾斜，其中冷凝器布置成使得大部分冷却空气流过冷凝器。