公开(公告)号：US20210017392A1

公开(公告)日：2021-01-21

申请号：US17060138

申请日：2020-10-01

Applicant: ADMATECHS CO., LTD.

Inventor： Shinta HAGIMOTO ,  Nobutaka TOMITA ,  Masaru KURAKI

IPC: C09C1/40 ,  C01B39/20 ,  C01B39/36 ,  C09D11/037

Abstract: A filler for resinous composition is contained and used in resinous composition constituting electronic packaging material for electronic device, and includes: a filler ingredient including a crystalline siliceous material with a crystal structure made of at least one member selected from the group consisting of type FAU, type FER, type LTA, type MFI and type CHA, and/or type MWW, wherein: the filler ingredient is free of any activity when evaluated by an “NH3-TPD” method; and includes the crystalline siliceous material in an amount falling in a range allowing the filler ingredient to exhibit a negative thermal expansion coefficient. The filler ingredient may further be free of a surface in which silver, copper, zinc, mercury, tin, lead, bismuth, cadmium, chromium, cobalt and nickel are exposed.

公开(公告)号：US20230352435A1

公开(公告)日：2023-11-02

申请号：US18206789

申请日：2023-06-07

Applicant: ADMATECHS CO., LTD.

Inventor： Shinta HAGIMOTO ,  Nobutaka TOMITA ,  Susumu ABE

IPC: H01L23/00

CPC classification number: H01L24/27 ,  H01L24/29 ,  H01L2224/2711 ,  H01L2224/2919

Abstract: Provided is a method for producing an electronic material filler having excellent performance. The method includes a burning step of putting a particle raw material in flame obtained by burning combustible carbon-free gas containing no carbon to form a particle material to be contained in the electronic material filler. By adopting, as combustible gas, combustible gas containing no carbon, conductive particles formed of carbon are not generated in principle. Therefore, a step of removing the conductive particles formed of carbon by sieving or the like is not required. Particularly, carbon derived from hydrocarbon gas is adhered to and formed on, for example, the surface of the particle material or is formed in the particle material. Therefore, the carbon may not be completely removed by sieving or the like. However, the production method of the present invention prevents the carbon from being mixed in principle.

公开(公告)号：US20200332082A1

公开(公告)日：2020-10-22

申请号：US16921334

申请日：2020-07-06

Applicant: ADMATECHS CO., LTD.

Inventor： Shinta HAGIMOTO ,  Nobutaka TOMITA ,  Osamu NAKANO

IPC: C08K3/34 ,  C08K9/06 ,  C08K7/18 ,  C09C1/40

Abstract: A filler for resinous composition is contained and used in resinous composition, and includes: a crystalline siliceous particulate material with a crystal structure made of at least one member selected from the group consisting of type FAU, type FER, type LTA and type MFI, and/or type MWW; and a surface treatment agent including an organic silica compound reacted with or adhered to a surface of the crystalline siliceous particulate material; the filler including the surface treatment agent in an amount falling in a range allowing the filler to exhibit a negative thermal expansion coefficient.

公开(公告)号：US20200040162A1

公开(公告)日：2020-02-06

申请号：US16597110

申请日：2019-10-09

Applicant: ADMATECHS CO., LTD.

Inventor： Shinta HAGIMOTO ,  Nobutaka TOMITA ,  Osamu NAKANO

IPC: C08K9/06 ,  C08K3/36 ,  C08J3/205 ,  H01L23/29 ,  H05K1/03

Abstract: A filler for resinous composition is contained and used in resinous composition, and includes: a crystalline siliceous particulate material with a crystal structure made of at least one member selected from the group consisting of type FAU, type FER, type LTA and type MFI, and type MWW; and a surface treatment agent including an organic silica compound reacted with or adhered to a surface of the crystalline siliceous particulate material; the filler including the surface treatment agent in an amount falling in a range allowing the filler to exhibit a negative thermal expansion coefficient.