公开(公告)号：US20240047229A1

公开(公告)日：2024-02-08

申请号：US17879110

申请日：2022-08-02

Applicant: ADVANCED MICRO DEVICES, INC.

Inventor： SRI RANGA SAI BOYAPATI ,  RAJA SWAMINATHAN ,  DEEPAK VASANT KULKARNI

IPC: H01L21/48 ,  H01L23/498

CPC classification number: H01L21/486 ,  H01L23/49822 ,  H01L21/4857 ,  H01L23/49838 ,  H01L23/49894 ,  H01L21/6835

Abstract: A method for forming a core for a substrate that removes portions of a resist layer based on a pattern specifying widths of removed portions of the resist layer. The method forms a set of pillars by plating the remaining portions of the resist layer with a conductive material, so each pillar of the set has a perimeter plated with the conductive material. Additionally, each pillar of the set of pillars is encapsulated with a dielectric material. In some implementations, the dielectric material is an organic material.