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公开(公告)号：US20230069294A1
公开(公告)日：2023-03-02
申请号：US17563921
申请日：2021-12-28
Applicant: ADVANCED MICRO DEVICES, INC.
Inventor： RAHUL AGARWAL , RAJA SWAMINATHAN , JOHN WUU , MIHIR PANDYA , SAMUEL D. NAFFZIGER
IPC: H01L23/538 , H01L23/48 , H01L25/18 , H01L25/00
Abstract: A chip for multi-die communications couplings using a single bridge die, includes: a plurality of dies each including one or more functional circuit blocks; and a first bridge die directly communicatively coupling two or more pairs of dies of the plurality of dies.
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