公开(公告)号：US20240071940A1

公开(公告)日：2024-02-29

申请号：US18505187

申请日：2023-11-09

Applicant: ADVANCED MICRO DEVICES, INC. ,  ATI TECHNOLOGIES ULC

Inventor： RAHUL AGARWAL ,  RAJA SWAMINATHAN ,  MICHAEL S. ALFANO ,  GABRIEL H. LOH ,  ALAN D. SMITH ,  GABRIEL WONG ,  MICHAEL MANTOR

IPC: H01L23/538 ,  H01L21/50 ,  H01L25/065 ,  H01L27/06

CPC classification number: H01L23/5384 ,  H01L21/50 ,  H01L23/5381 ,  H01L23/5385 ,  H01L25/0657 ,  H01L27/0688

Abstract: A semiconductor package includes a first die, a second die, and an interconnect die coupled to a first plurality of through-die vias in the first die and a second plurality of through-die vias in the second die. The interconnect die provides communications pathways the first die and the second die.

公开(公告)号：US20220206221A1

公开(公告)日：2022-06-30

申请号：US17134756

申请日：2020-12-28

Applicant: ADVANCED MICRO DEVICES, INC.

Inventor： SIDDHARTH RAVICHANDRAN ,  BRETT P. WILKERSON ,  RAHUL AGARWAL

IPC: G02B6/136

Abstract: Manufacturing a semiconductor chip package with optical fiber attach capability includes preparing a photonic integrated circuit by etching a v-groove in a front side fiber coupling region; assembling the photonic integrated circuit on an organic redistribution layer; etching the organic redistribution layer; and attaching an optical fiber to the front side fiber coupling region.

公开(公告)号：US20230207546A1

公开(公告)日：2023-06-29

申请号：US17564123

申请日：2021-12-28

Applicant: ADVANCED MICRO DEVICES, INC. ,  ATI TECHNOLOGIES ULC

Inventor： ARSALAN ALAM ,  FEI GUO ,  RAHUL AGARWAL

IPC: H01L25/18 ,  H01L25/065 ,  H01L25/00 ,  H01L21/56 ,  H01L25/10

CPC classification number: H01L25/18 ,  H01L21/56 ,  H01L25/50 ,  H01L25/105 ,  H01L25/0652 ,  H01L24/05

Abstract: A semiconductor device includes a power delivery device die stack including a plurality of vertically arranged power delivery device dies. The plurality of power delivery device dies including at least a first power delivery device die and a second power delivery device die electrically connected to the first power delivery device die. The semiconductor device includes at least one external interconnect for providing a power input to the power delivery device die stack and at least one external interconnect for supplying a power output from the power delivery device die stack.

公开(公告)号：US20220189897A1

公开(公告)日：2022-06-16

申请号：US17118126

申请日：2020-12-10

Applicant: ADVANCED MICRO DEVICES, INC.

Inventor： RAHUL AGARWAL

IPC: H01L23/00 ,  H01L23/528

Abstract: A semiconductor package for high-speed die connections using a conductive insert, the semiconductor package comprising: a die; a plurality of redistribution layers; a conductive insert housed in a perforation through the plurality of redistribution layers; and a conductive bump conductively coupled to an input/output (I/O) connection point of the die via the conductive insert.

公开(公告)号：US20230411331A1

公开(公告)日：2023-12-21

申请号：US18455960

申请日：2023-08-25

Applicant: ADVANCED MICRO DEVICES, INC.

Inventor： RAHUL AGARWAL

IPC: H01L23/00 ,  H01L23/528

CPC classification number: H01L24/13 ,  H01L24/05 ,  H01L2224/02331 ,  H01L23/5283 ,  H01L24/81

Abstract: A semiconductor package for high-speed die connections using a conductive insert, the semiconductor package comprising: a die; a plurality of redistribution layers; a conductive insert housed in a perforation through the plurality of redistribution layers; and a conductive bump conductively coupled to an input/output (I/O) connection point of the die via the conductive insert.

公开(公告)号：US20230120305A1

公开(公告)日：2023-04-20

申请号：US17965888

申请日：2022-10-14

Applicant: ADVANCED MICRO DEVICES, INC.

Inventor： CHIA-HAO CHENG ,  RAHUL AGARWAL ,  CHINTAN BUCH ,  ARSALAN ALAM

IPC: H01L21/66 ,  H01L23/48 ,  H01L23/00 ,  H01L21/463 ,  H01L21/465 ,  H01L21/3205

Abstract: A method includes applying a temporary pad to a conductive pad of a semiconductor die. After testing the semiconductor die, the temporary pad is removed from the conductive pad.

公开(公告)号：US20230069294A1

公开(公告)日：2023-03-02

申请号：US17563921

申请日：2021-12-28

Applicant: ADVANCED MICRO DEVICES, INC.

Inventor： RAHUL AGARWAL ,  RAJA SWAMINATHAN ,  JOHN WUU ,  MIHIR PANDYA ,  SAMUEL D. NAFFZIGER

IPC: H01L23/538 ,  H01L23/48 ,  H01L25/18 ,  H01L25/00

Abstract: A chip for multi-die communications couplings using a single bridge die, includes: a plurality of dies each including one or more functional circuit blocks; and a first bridge die directly communicatively coupling two or more pairs of dies of the plurality of dies.

公开(公告)号：US20220415876A1

公开(公告)日：2022-12-29

申请号：US17360832

申请日：2021-06-28

Applicant: ADVANCED MICRO DEVICES, INC.

Inventor： ROBERT S. RUTH ,  RAHUL AGARWAL ,  GLADNEY ASADA

IPC: H01L27/02 ,  H01L23/488 ,  H01L23/00 ,  H01L23/50 ,  H01L23/528

Abstract: A chip for controlled electrostatic discharging to avoid loading on input/output pins, comprising: a die comprising: a first plurality of connector pins each conductively coupled to one or more signal paths, each of the first plurality of connector pins having a first height; and a second plurality of connector pins independent of any signal paths, each of the second plurality of connector pins having a second height greater than the first height.

公开(公告)号：US20210313269A1

公开(公告)日：2021-10-07

申请号：US17323454

申请日：2021-05-18

Applicant: ADVANCED MICRO DEVICES, INC.

Inventor： MILIND S. BHAGAVAT ,  RAHUL AGARWAL ,  CHIA-HAO CHENG

IPC: H01L23/528 ,  H01L23/31 ,  H01L23/522 ,  H01L23/00 ,  H01L21/56 ,  H01L25/065

Abstract: Various semiconductor chip devices and methods of making the same are disclosed. In one aspect, an apparatus is provided that includes a first redistribution layer (RDL) structure having a first plurality of conductor traces, a first molding layer on the first RDL structure, plural conductive pillars in the first molding layer, each of the conductive pillars including a first end and a second end, a second RDL structure on the first molding layer, the second RDL structure having a second plurality of conductor traces, and wherein some of the conductive pillars are electrically connected between some of the first plurality of conductor traces and some of the second plurality of conductor traces to provide a first inductor coil.

公开(公告)号：US20230387076A1

公开(公告)日：2023-11-30

申请号：US18324744

申请日：2023-05-26

Applicant: ADVANCED MICRO DEVICES, INC.

Inventor： LEI FU ,  BRETT P. WILKERSON ,  RAHUL AGARWAL

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/538

CPC classification number: H01L25/0655 ,  H01L24/13 ,  H01L23/5389 ,  H01L23/5381 ,  H01L2225/06541

Abstract: A chip for hybrid bonded interconnect bridging for chiplet integration, the chip comprising: a first chiplet; a second chiplet; an interconnecting die coupled to the first chiplet and the second chiplet through a hybrid bond.