公开(公告)号：US20220059425A1

公开(公告)日：2022-02-24

申请号：US17516988

申请日：2021-11-02

Applicant: ADVANCED MICRO DEVICES, INC.

Inventor： JOHN WUU ,  SAMUEL NAFFZIGER ,  PATRICK J. SHYVERS ,  MILIND S. BHAGAVAT ,  KAUSHIK MYSORE ,  BRETT P. WILKERSON

IPC: H01L23/367 ,  H01L25/00 ,  H01L25/065 ,  H01L23/36

Abstract: Various semiconductor chip devices with stacked chips are disclosed. In one aspect, a semiconductor chip device is provided. The semiconductor chip device includes a first semiconductor chip that has a floor plan with a high heat producing area and a low heat producing area. At least one second semiconductor chip is stacked on the low heat producing area. The semiconductor chip device also includes means for transferring heat from the high heat producing area.