公开(公告)号：US20250076906A1

公开(公告)日：2025-03-06

申请号：US18803348

申请日：2024-08-13

Applicant: AP SYSTEMS INC.

Inventor： Sang Hyun JI ,  Dae Ryong LEE ,  Yong Soo MOON

IPC: G05D23/20 ,  H01L21/67

Abstract: The present disclosure relates to a power control device for temperature control capable of phase control compensation according to power fluctuations, a thermal processing system having the same, and a temperature control method for the thermal processing system. The power control device for temperature control includes a power control unit configured to control an amount of power supplied to a heating source by controlling a phase of AC power supplied from a power source and a power measurement unit connected to the power source and configured to measure the AC power, wherein the power control unit controls the phase of the AC power by compensating a phase angle according to a difference between a reference power value and the measured value measured by the power measurement unit.

公开(公告)号：US20220128484A1

公开(公告)日：2022-04-28

申请号：US17507797

申请日：2021-10-21

Applicant: AP SYSTEMS INC.

Inventor： Yong Soo MOON ,  Hahn Joo YOON ,  Chan Ho HONG ,  Seung Hwan LEE ,  Oh Seung KWON

IPC: G01N21/95 ,  G01N21/88

Abstract: Provided are an apparatus for processing a substrate and a method for measuring a temperature of the substrate. The apparatus for processing the substrate includes a temperature measurement part and a light-transmitting shield plate. The temperature measurement part includes a light source, a light receiving part configured to receive reflected light reflected by the substrate or the shield plate among the light irradiated from the light source, and a radiant light emitted from the substrate to measure a quantity of the reflected light and an intensity of the radiant light and a temperature calculation part configured to calculate the temperature of the substrate, to which a contamination level of the shield plate is reflected, by using the quantity of the reflected light and the intensity of the radiant light.

公开(公告)号：US20190103296A1

公开(公告)日：2019-04-04

申请号：US16132218

申请日：2018-09-14

Applicant: AP SYSTEMS INC.

Inventor： Sang Hyun JI ,  Yong Soo MOON ,  Gun Bum LEE

IPC: H01L21/67 ,  G01J5/00 ,  G01J5/02

Abstract: A substrate treatment method in accordance with an exemplary embodiment includes: heating a substrate, for a substrate treatment process, so that a temperature of the substrate reaches a target temperature; calculating the temperature of the substrate using a sensor located facing the substrate while heating the substrate; and controlling an operation of a heating part configured to heat the substrate according to the temperature calculated from the calculating the temperature, wherein the calculating the temperature comprises: measuring a total radiant energy (Et) radiated from the substrate using the sensor; calculating a corrected total emissivity (εt0) by applying a correction value for correcting the total emissivity (εt) which is the emissivity of the radiant energy (Et); and calculating the temperature (Ts) of the substrate using the total radiant energy (Et) and the corrected total emissivity (εt0).