公开(公告)号：US20180258534A1

公开(公告)日：2018-09-13

申请号：US15870756

申请日：2018-01-12

Applicant: AP SYSTEMS INC.

Inventor： Sang Hyun JI ,  Chang Kyo KIM

IPC: C23C16/52 ,  C23C16/455

CPC classification number: C23C16/52 ,  C23C16/402 ,  C23C16/45574

Abstract: A gas spraying apparatus according to the embodiment of the present invention includes a spray part disposed and aligned on one side outside a substrate in the width direction of the substrate, and having a plurality of nozzles for spraying gas toward the substrate, and a spray control unit for automatically controlling whether or not each of a plurality of nozzles sprays gas such that a gas density distribution type in the width direction of the substrate becomes a targeted gas density distribution type by the gas sprayed through the plurality of nozzles. Therefore, according to the embodiment of the present invention, it is easy to carry out the process with a plurality of types of process types or a plurality of types of gas density distribution types, and a time for adjusting the open or close operation of the plurality of nozzles can be shortened.

公开(公告)号：US20230366092A1

公开(公告)日：2023-11-16

申请号：US18029898

申请日：2021-09-16

Applicant: AP SYSTEMS INC.

Inventor： Pil Seong JEONG ,  Sang Hyun JI ,  Chang Kyo KIM ,  Dong Sik KIM

IPC: C23C16/50 ,  C23C16/52 ,  C23C16/455

CPC classification number: C23C16/50 ,  C23C16/52 ,  C23C16/45559

Abstract: Provided are an apparatus and method for forming a thin film. The apparatus for forming a thin film include a chamber configured to define a substrate processing space therein, a substrate support part connected to the chamber to support a substrate inside the chamber, a heat source part connected to the chamber to face the substrate support part, and a plasma generation part connected to the chamber to supply radicals between the substrate support part and the heat source part at at least two points.

公开(公告)号：US20140284316A1

公开(公告)日：2014-09-25

申请号：US14190084

申请日：2014-02-25

Applicant: AP SYSTEMS INC.

Inventor： Sang Hyun JI

IPC: G01J5/02

CPC classification number: G01J5/602 ,  G01J5/0007 ,  G01J2005/0048 ,  G01J2005/067

Abstract: Disclosed are an apparatus and method of detecting a temperature through a pyrometer in a non-contact manner, and an apparatus for processing a substrate using the apparatus, and more particularly, an apparatus and method of detecting a temperature, which precisely measures a temperature without any effect by humidity, and an apparatus for processing a substrate using the same. In an exemplary embodiment, an apparatus for detecting a temperature includes a humidity sensor configured to measure a humidity value, a temperature compensation database configured to store a temperature compensation value for each humidity value, and a pyrometer in which, assuming that a wavelength band including a transmittance limiting wavelength band as a wavelength band having a transmittance less than a first threshold value due to the humidity and a transmittance allowing wavelength band as a wavelength band having a transmittance more than a second threshold value due to the humidity is a wavelength band to be compensated, a non-contact temperature is calculated by adding a temperature compensation value corresponding to a humidity value detected by the humidity sensor to a temperature to be compensated calculated by measuring a wavelength intensity of the wavelength band to be compensated radiated from an object to be measured.

Abstract translation: 公开了以非接触方式通过高温计检测温度的装置和方法，以及使用该装置处理基板的装置，更具体地，涉及一种检测温度的装置和方法，其精确地测量温度而没有 湿度的任何影响，以及使用其的基板的处理装置。 在一个示例性实施例中，用于检测温度的装置包括被配置为测量湿度值的湿度传感器，配置成存储每个湿度值的温度补偿值的温度补偿数据库，以及高温计，其中， 作为具有由于湿度而导致的透射率小于第一阈值的波长带的透光率限制波长带和由于湿度导致的具有大于第二阈值的波长带的波长带的透射率为波长带宽 通过将对应于由湿度传感器检测到的湿度值的温度补偿值与通过测量从物体辐射的待补偿的波长带的波长强度计算得到的待补偿温度相加来计算非接触温度 被测量。

公开(公告)号：US20140219309A1

公开(公告)日：2014-08-07

申请号：US14173793

申请日：2014-02-05

Applicant: AP SYSTEMS INC.

Inventor： Sang Hyun JI

IPC: G01J5/52

CPC classification number: G01J5/522 ,  G01J5/0007 ,  G01J5/0887

Abstract: Disclosed is a calibrating apparatus which is adapted to remove a measurement deviation of a pyrometer, and more particularly, to an apparatus for calibrating a pyrometer, which calibrates a reference value so as to remove a deviation in a temperature measured in a pyrometer. The apparatus for calibrating a pyrometer includes a blackbody including a radiant space from which radiant energy is radiated, a body housing configured to receive the blackbody therein and including a light output wall having a light output port connected with the radiant space, a light output wall protecting cover configured to be coupled with the light output wall of the body housing so as to define a passage connecting the light output wall of the body housing and an outside environment, and a fixing member configured to fix the light output wall protecting cover to the light output wall of the body housing.

Abstract translation: 公开了一种校准装置，其适于去除高温计的测量偏差，更具体地，涉及用于校准高温计的装置，其校准参考值以消除在高温计中测量的温度的偏差。 用于校准高温计的装置包括黑体，其包括辐射能量辐射的辐射空间，被构造为在其中接收黑体的主体壳体，并且包括具有与辐射空间连接的光输出端口的光输出壁，光输出壁 保护盖，其构造成与所述主体壳体的所述光输出壁联接，以便限定连接所述主体壳体的光输出壁和外部环境的通​​道;以及固定构件，其将所述光输出壁保护盖固定到 光输出墙体的外壳。

公开(公告)号：US20250038016A1

公开(公告)日：2025-01-30

申请号：US18707165

申请日：2022-09-28

Applicant: AP SYSTEMS INC.

Inventor： Dae Ryong LEE ,  Sang Hyun JI ,  Chang Kyo KIM

IPC: H01L21/67 ,  H01L21/268 ,  H01L21/66

Abstract: The present inventive concept relates to a substrate processing apparatus and a substrate processing method, which can accurately measure temperature in even a low-temperature region, thus making it possible to efficiently manage heat. The substrate processing apparatus comprises: a chamber for providing a processing space in which a substrate is processed; a substrate support provided in the processing space of the chamber in order to support the substrate; a heater provided with a plurality of semiconductor laser modules that emit light toward a first surface of the substrate; and a pyrometer which is provided on the side of a second surface of the substrate facing the first surface and detects light emitted from the substrate to measure the temperature of the substrate. The main light-emitting wavelength of the plurality of semiconductor laser modules may be shorter than the measurement wavelength of the pyrometer.

公开(公告)号：US20160284562A1

公开(公告)日：2016-09-29

申请号：US15081836

申请日：2016-03-25

Applicant: AP SYSTEMS INC.

Inventor： Pil Seong JEONG ,  Sang Hyun JI ,  Sung Yong LEE ,  Yong Woo HAN

IPC: H01L21/324 ,  H01L21/477 ,  C30B29/06 ,  C23C16/56 ,  C23C16/24 ,  C30B28/08 ,  H01L21/67 ,  H01L29/66

CPC classification number: C30B29/06 ,  C23C16/24 ,  C23C16/46 ,  C23C16/56 ,  C30B28/08 ,  H01L21/67115 ,  H01L27/1285 ,  H01L29/6675 ,  H01L29/66757 ,  H01L29/66765

Abstract: The present disclosure controls the heat source unit such that a to-be-processed object in which a hydrogen-containing to-be-processed layer is formed is irradiated with light in two stages, and thus the electrical characteristics of a semiconductor device may be suppressed and prevented from being deteriorated due to hydrogen. That is, ultraviolet light (UV) which is firstly radiated may induce a chemical reaction for separating Si—H bonds in the to-be-processed layer, and infrared light (IR) which is secondly radiated may induce a thermal reaction for vaporizing the separated hydrogen from the Si—H bonds. As such, both a chemical reaction for separating bonds of hydrogen and other ions in the to-be-processed layer and a thermal reaction for vaporizing hydrogen are performed, and thus hydrogen may be more easily removed than a temperature at which hydrogen is vaporized from the to-be-processed layer by only a thermal reaction.

Abstract translation: 本公开控制热源单元，使得其中形成有含氢待处理层的被处理物体被两次照射，因此半导体器件的电特性可以是 抑制和防止由于氢而劣化。 也就是说，首先辐射的紫外线（UV）可能引起用于分离被处理层中的Si-H键的化学反应，并且第二次辐射的红外光（IR）可能引起热反应， 从Si-H键分离出氢。 因此，进行用于分离待处理层中的氢和其它离子的键的化学反应和用于汽化氢的热反应，因此氢可以比从氢气蒸发的温度更容易地除去 待处理层仅通过热反应。

公开(公告)号：US20250076906A1

公开(公告)日：2025-03-06

申请号：US18803348

申请日：2024-08-13

Applicant: AP SYSTEMS INC.

Inventor： Sang Hyun JI ,  Dae Ryong LEE ,  Yong Soo MOON

IPC: G05D23/20 ,  H01L21/67

Abstract: The present disclosure relates to a power control device for temperature control capable of phase control compensation according to power fluctuations, a thermal processing system having the same, and a temperature control method for the thermal processing system. The power control device for temperature control includes a power control unit configured to control an amount of power supplied to a heating source by controlling a phase of AC power supplied from a power source and a power measurement unit connected to the power source and configured to measure the AC power, wherein the power control unit controls the phase of the AC power by compensating a phase angle according to a difference between a reference power value and the measured value measured by the power measurement unit.

公开(公告)号：US20190103296A1

公开(公告)日：2019-04-04

申请号：US16132218

申请日：2018-09-14

Applicant: AP SYSTEMS INC.

Inventor： Sang Hyun JI ,  Yong Soo MOON ,  Gun Bum LEE

IPC: H01L21/67 ,  G01J5/00 ,  G01J5/02

Abstract: A substrate treatment method in accordance with an exemplary embodiment includes: heating a substrate, for a substrate treatment process, so that a temperature of the substrate reaches a target temperature; calculating the temperature of the substrate using a sensor located facing the substrate while heating the substrate; and controlling an operation of a heating part configured to heat the substrate according to the temperature calculated from the calculating the temperature, wherein the calculating the temperature comprises: measuring a total radiant energy (Et) radiated from the substrate using the sensor; calculating a corrected total emissivity (εt0) by applying a correction value for correcting the total emissivity (εt) which is the emissivity of the radiant energy (Et); and calculating the temperature (Ts) of the substrate using the total radiant energy (Et) and the corrected total emissivity (εt0).

公开(公告)号：US20160284572A1

公开(公告)日：2016-09-29

申请号：US15051660

申请日：2016-02-23

Applicant: AP SYSTEMS INC.

Inventor： Pil Seong JEONG ,  Sang Hyun JI ,  Sung Yong LEE ,  Yong Woo HAN

IPC: H01L21/67 ,  H05B1/02

CPC classification number: H01L21/67115 ,  H05B1/0233

Abstract: Present disclosure relates to a heater block including a plurality of heating lamps mounted on one surface thereof facing an object to be processed, e.g., a substrate and a substrate processing apparatus including the same. The heating lamp includes a first lamp configured to irradiate ultraviolet (UV) rays to the object to be processed and a second lamp configured to irradiate infrared (IR) rays to the object to be processed. A relative ratio of the number of first lamp to the number of second lamp is different for each of a plurality of areas on the one surface. Provided are the heater block that may thermally compensate a temperature of an edge area of the substrate to increase temperature uniformity of the substrate and the substrate processing apparatus.

Abstract translation: 本公开涉及一种加热器块，其包括安装在其面对待处理物体的一个表面上的多个加热灯，例如基板和包括该加热器的基板处理设备。 加热灯包括被配置为向待处理物体照射紫外（UV）射线的第一灯和配置成向被处理物体照射红外（IR）射线的第二灯。 第一灯的数量与第二灯的数量的相对比对于一个表面上的多个区域中的每个区域是不同的。 提供了可以热补偿衬底的边缘区域的温度以增加衬底和衬底处理设备的温度均匀性的加热器块。