公开(公告)号：US20170273180A1

公开(公告)日：2017-09-21

申请号：US15157314

申请日：2016-05-17

Applicant: APPLE INC.

Inventor： David J. Drennan ,  Bruce Berg ,  Joseph Nazari ,  Bonnie W. Tom ,  Kristina A. Babiarz ,  Anthony P. Grazian

IPC: H05K1/05 ,  H04R1/02 ,  H05K3/00 ,  H04R31/00 ,  H05K1/02 ,  H05K3/10

CPC classification number: H04R1/02 ,  B29C45/14311 ,  B29C45/14467 ,  B29C45/14639 ,  B29K2069/00 ,  B29K2715/006 ,  G06F1/1605 ,  G06F1/1626 ,  G06F1/1658 ,  G06F1/1688 ,  H04R31/006 ,  H04R2499/11 ,  H05K1/05 ,  H05K3/202 ,  H05K3/205 ,  H05K3/28 ,  H05K2201/10083 ,  H05K2203/1327

Abstract: A method of forming an overmolded plastic structure on a metallic plate includes first bonding a component to the metallic plate. The component is bonded with an adhesive that adheres it to the metallic plate. A plastic structure is formed over at least a portion of the component and the metallic plate and the plastic structure primarily adheres to the component. The component can be a set of metallic signal conductors that are used to route electrical signals across the metallic plate and the adhesive can be used to electrically insulate the signal conductors from the metallic plate.