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    Force Sensing Using Dual-Layer Cover Glass with Gel Adhesive and Capacitive Sensing
    6.
    发明申请
    Force Sensing Using Dual-Layer Cover Glass with Gel Adhesive and Capacitive Sensing 审中-公开

    公开(公告)号：US20140085247A1

    公开(公告)日：2014-03-27

    申请号：US13624855

    申请日：2012-09-21

    Applicant: APPLE INC.

    Inventor： Omar Sze Leung ,  Jonah A. Harley ,  James E. Wright ,  Craig Christopher Leong ,  Kristina A. Babiarz

    IPC: G06F3/044

    CPC classification number: G06F3/044 ,  G06F3/0414 ,  G06F2203/04105

    Abstract: A touch device including a force sensor disposed between capacitive sensing structures, so both touch and force sensing occur capacitively using device drivers in rows and columns. A dual-layer cover glass, with gel adhesive separating first and second CG layers, so capacitive sensing between the first and second CG layers can determine both touch locations and applied force. The first and second CG layers include a compressible material having a Poisson's ratio of less than approximately 0.48, the force sensor being embedded therein, or disposed between the first and second CG layers. Applied force is detected using capacitive detection of depression of the first CG layer. Depression is responsive to compressible features smaller than optical wavelengths, so those features are substantially invisible to users. Alternatively, the compressible features may be large enough to be seen by a user, but made substantially invisible through the use of a fluid or other element filling spaces between the features. Such a fluid may have an index of refraction equal to, or nearly equal to, the index of refraction of the compressible features.

    Head mountable display
    7.
    发明授权
    Head mountable display 有权

    公开(公告)号：US12196974B2

    公开(公告)日：2025-01-14

    申请号：US18478463

    申请日：2023-09-29

    Applicant: Apple Inc.

    Inventor： Aidan N. Zimmerman ,  Jessica L. Ong ,  Matin Seadat Beheshti ,  Kristina A. Babiarz

    IPC: G02B27/01

    Abstract: A head-mountable display device can include a structural frame, where a first mounting bracket can be coupled to a first side of the structural frame. In some examples, the first mounting structure can include a cantilever arm. A second mounting bracket can be coupled to a second side of the structural frame opposite the first side, where the second mounting bracket can include a mounting arm, a sensor coupled to the cantilever arm, and a display assemble slidably coupled to the mounting arm.

    Force Sensing of Inputs Through Strain Analysis
    8.
    发明申请
    Force Sensing of Inputs Through Strain Analysis 审中-公开

    公开(公告)号：US20180217708A1

    公开(公告)日：2018-08-02

    申请号：US15933113

    申请日：2018-03-22

    Applicant: Apple Inc.

    Inventor： Storrs T. Hoen ,  Kristina A. Babiarz ,  Miguel C. Christophy ,  Romain A. Teil ,  Sinan Filiz ,  Vivek Katiyar

    IPC: G06F3/041 ,  G06F3/0488

    CPC classification number: G06F3/0414 ,  G06F3/041 ,  G06F3/0412 ,  G06F3/0416 ,  G06F3/0488 ,  G06F2203/04103

    Abstract: An electronic device has a force sensor that determines a measure of applied force from a user contacting a cover glass of the device. In one embodiment, a frame at least partially encloses an interior of the electronic device and has an open end. A cover glass covers the open end of the frame and is movably connected to the frame to allow movement of the cover glass in response to one or more forces applied to an external surface of the cover glass. A plurality of strain probes is positioned under the cover glass, between the cover glass and the frame, and is arranged to output a plurality of strain signals response to the one or more forces applied to the cover glass. A force processing module is configured to at least calculate an amount of force applied to the cover glass based on the plurality of strain signals.

    FORMING FEATURES IN A CERAMIC COMPONENT FOR AN ELECTRONIC DEVICE
    9.
    发明申请
    FORMING FEATURES IN A CERAMIC COMPONENT FOR AN ELECTRONIC DEVICE 审中-公开
    用于电子设备的陶瓷组件的形成特征

    公开(公告)号：US20170060193A1

    公开(公告)日：2017-03-02

    申请号：US14843004

    申请日：2015-09-02

    Applicant: Apple Inc.

    Inventor： Jeremy C. Franklin ,  Kristina A. Babiarz

    IPC: G06F1/16 ,  B24B29/00 ,  A45C11/00

    CPC classification number: G06F1/1684 ,  A45C3/001 ,  A45C11/00 ,  A45C2011/002 ,  A45C2011/003 ,  B24B19/03 ,  B24B29/005 ,  B24B29/04 ,  G06F1/1656 ,  G06F1/1662 ,  G06F1/1686

    Abstract: A three-dimensional feature is formed in a surface of a component. Material is removed from the component by rotating an abrading tool about a first axis. While the abrading tool is rotated, the component (and/or a shaft coupled to the abrading tool) is rotated on a second axis. The second axis may be transverse to the first axis and may run through a center of the three-dimensional feature. The abrading tool may correspond to the three-dimensional feature. For example, the abrading tool may be configured to contact an entirety of an exterior of the three-dimensional feature during the removal operation, fill the three-dimensional feature during the removal operation, and/or have a shape that corresponds to the shape of the three-dimensional feature in two planes that are normal to each other.

    Abstract translation: 在部件的表面中形成三维特征。 通过围绕第一轴旋转研磨工具将材料从组件中移除。 当研磨工具旋转时，组件（和/或联接到研磨工具的轴）在第二轴线上旋转。 第二轴线可以横向于第一轴线并且可以穿过三维特征的中心。 研磨工具可以对应于三维特征。 例如，研磨工具可以被构造成在拆卸操作期间与三维特征的整体接触，在去除操作期间填充三维特征，和/或具有与形状相对应的形状 两个平面相互正交的三维特征。

    Methods for assembling devices using pressure indicator adhesives
    10.
    发明授权
    Methods for assembling devices using pressure indicator adhesives 有权
    使用压力指示器粘合剂组装设备的方法

    公开(公告)号：US09335187B2

    公开(公告)日：2016-05-10

    申请号：US13679699

    申请日：2012-11-16

    Applicant: Apple Inc.

    Inventor： Stephen R. McClure ,  Derek W. Wright ,  Carl R. Peterson ,  Kristina A. Babiarz

    IPC: G01D11/00 ,  C09J5/00 ,  C09J7/02 ,  C09J11/02 ,  C08K9/10

    CPC classification number: G01D11/00 ,  C08K9/10 ,  C09J5/00 ,  C09J7/38 ,  C09J11/02 ,  C09J2205/11 ,  C09J2400/143 ,  C09J2400/163

    Abstract: Pressure indicator pressure sensitive adhesive may contain microspheres that burst and release indicator when subjected to pressure and thereby produce a detectable indication of how much pressure has been applied when forming an adhesive joint between opposing structures. Electronic device structures can be assembled using the pressure indicator pressure sensitive adhesive. A camera or other sensor may monitor joint formation. The camera can gather infrared image data, visible light image data, or ultraviolet light image data. Sensor data such as magnetic or ultrasonic sensor data can also be collected on an adhesive joint. Joint inspection can be performed on test structures and production structures and corresponding adjustments made to the joint formation process. Positioners and other equipment that compresses the pressure indicator pressure sensitive adhesive can be adjusted in real time or calibrated using information about the condition of the pressure indicator pressure sensitive adhesive.

    Abstract translation: 压力指示器压敏粘合剂可能含有微球，当经受压力时，其突发和释放指示器，从而产生在形成相对结构之间的粘合剂接头时施加了多少压力的可检测指示。 可以使用压力指示器压敏粘合剂组装电子装置结构。 照相机或其他传感器可能会监视关节的形成。 相机可以收集红外图像数据，可见光图像数据或紫外光图像数据。 诸如磁性或超声波传感器数据的传感器数据也可以在粘合剂接头上收集。 可以对试验结构和生产结构进行联合检查，并对联合形成过程进行相应的调整。 压缩压力指示器压敏粘合剂的定位器和其他设备可以实时调整或使用关于压力指示器压敏粘合剂状况的信息进行校准。

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