公开(公告)号：US12037521B2

公开(公告)日：2024-07-16

申请号：US17309563

申请日：2019-12-06

申请人： Eastman Chemical (China) Co., Ltd.

发明人： Liu Deng ,  Emmett Dudley Crawford ,  Wentao Li ,  John Thorton Maddox ,  Christopher Harlan Burk ,  Cheng Wei Zhu ,  Kujtim Bizati ,  Bing Yuan ,  Dayu Zhang ,  Tara Renee Cary ,  Thauming Kuo

IPC分类号： C09J7/35 ,  B32B7/12 ,  C08G18/12 ,  C08G18/30 ,  C08G18/42 ,  C08G18/73 ,  C08G18/75 ,  C08G18/76 ,  C08G63/181 ,  C08G63/199 ,  C08G63/672 ,  C09J175/06 ,  C09J175/08

CPC分类号： C09J175/06 ,  B32B7/12 ,  C08G18/12 ,  C08G18/307 ,  C08G18/4216 ,  C08G18/423 ,  C08G18/425 ,  C08G18/73 ,  C08G18/755 ,  C08G18/7657 ,  C08G63/181 ,  C08G63/199 ,  C08G63/672 ,  C09J7/35 ,  C09J175/08 ,  B32B2439/70 ,  C08G2170/00 ,  C08G2170/20 ,  C08G2390/00 ,  C09J2203/326 ,  C09J2203/354 ,  C09J2301/122 ,  C09J2301/304 ,  C09J2301/306 ,  C09J2400/163 ,  C09J2423/106 ,  C09J2467/006 ,  C09J2475/00

摘要： Adhesive compositions comprising a polyester polyol that includes residues of at least one 2,2,4,4-tetraalkylcyclobutane-1,3-diol, including, for example, 2,2,4,4-tetramethylcyclobutane-1,3-diol (TMCD). Adhesive compositions may exhibit enhanced properties as compared to conventional adhesive compositions, and may be suitable for a wide variety of end use applications, including, flexible packaging, woodworking, automotive uses, and electronics.

公开(公告)号：US11999883B2

公开(公告)日：2024-06-04

申请号：US16503824

申请日：2019-07-05

申请人： SWIFT TEXTILE METALIZING LLC

发明人： Bryan T. Wyrebek ,  Alexander T. Smith ,  Jared D G Butlin

IPC分类号： C09J9/02 ,  B32B5/02 ,  C09J7/29 ,  C09J7/38 ,  C09J11/04 ,  H05K9/00

CPC分类号： C09J9/02 ,  B32B5/024 ,  C09J7/29 ,  C09J7/38 ,  C09J11/04 ,  H05K9/0081 ,  B32B2274/00 ,  B32B2307/202 ,  B32B2307/212 ,  B32B2405/00 ,  B32B2605/18 ,  C09J2203/326 ,  C09J2400/123 ,  C09J2400/163 ,  C09J2423/046 ,  C09J2423/106 ,  C09J2433/006 ,  C09J2463/006 ,  C09J2475/006 ,  C09J2477/006 ,  C09J2483/006

摘要： A lightweight electromagnetic wave shielding tape is disclosed. The tape includes a first polymer protective layer, a calendered conductive material layer coupled to a bottom side of the first polymer protective layer, and a second polymer protective layer coupled to a bottom side of the conductive material layer so that the conductive material layer is encapsulated within the protective layers. An adhesive layer can also be applied to one of the protective layers.

公开(公告)号：US20240166862A1

公开(公告)日：2024-05-23

申请号：US18551972

申请日：2022-03-23

申请人： THREEBOND CO., LTD.

发明人： Tetsunori SOGA ,  Eiji SHIMOKAWA

IPC分类号： C08L63/00 ,  C08L101/10 ,  C09J163/00

CPC分类号： C08L63/00 ,  C08L101/10 ,  C09J163/00 ,  C08L2205/02 ,  C08L2312/00 ,  C09J2400/163

摘要： A two-component curable resin composition forms a cured product having high elongation and high strength while maintaining adhesive force to metal. A two-component curable resin composition includes the following agent A and agent B. Agent A is a composition containing component (a) and component (b). Component (a) is (a-1) a hydrogenated epoxy resin and (a-2) a bisphenol type epoxy resin. Component (b) is a curing catalyst of component (c). Agent B is a composition containing component (c) and component (d). Component (c) is an organic polymer having two or more hydrolyzable silyl groups. Component (d) is a curing agent for component (a).

公开(公告)号：US20240063047A1

公开(公告)日：2024-02-22

申请号：US17820428

申请日：2022-08-17

申请人： Micron Technology, Inc.

发明人： Brandon P. WIRZ ,  Sui Chi HUANG ,  Youngrae KIM

IPC分类号： H01L21/683 ,  H01L21/78 ,  C09J7/30 ,  C09J7/25 ,  C09J7/28 ,  C09J7/20

CPC分类号： H01L21/6836 ,  H01L21/78 ,  C09J7/30 ,  C09J7/25 ,  C09J7/28 ,  C09J7/20 ,  C09J2203/366 ,  C09J2203/326 ,  C09J2301/1242 ,  C09J2400/143 ,  C09J2400/163 ,  C09J2400/10 ,  C09J2479/086

摘要： Implementations described herein relate to a mount tape and methods of using the mount tape for semiconductor device manufacturing. The mount tape may include a first adhesive layer configured for release at a first stage of a semiconductor device manufacturing process, a second adhesive layer configured for release at a second stage of the semiconductor device manufacturing process, and an inner support layer positioned between the first adhesive layer and the second adhesive layer and configured for removal during the semiconductor device manufacturing process.

公开(公告)号：US20240010889A1

公开(公告)日：2024-01-11

申请号：US18035672

申请日：2020-12-24

申请人： SIKA TECHNOLOGY AG

发明人： Kiki WEI ,  Weiming ZHANG ,  Elyes JENDOUBI ,  Jessica LIN

IPC分类号： C09J163/04 ,  C08G59/24 ,  C08G59/32 ,  C08G59/40

CPC分类号： C09J163/04 ,  C08G59/245 ,  C08G59/3227 ,  C08G59/4021 ,  C09J2463/00 ,  C09J2301/304 ,  C09J2400/163

摘要： A one-component thermosetting epoxy resin adhesive, includes: a) at least one epoxy resin A of the formula (II):






wherein the substituents R′ and R″ independently of one another are either H or CH3 and the index s has a value of 0-12, at least one epoxy novolac EN of the formula:










where R2=










or CH2, R1=H or methyl and z=0-7, at least one trifunctional or higher functional glycidyl amine type epoxy resin GA, least one latent hardener B for epoxy resins and at least at least one toughness improver D. The epoxy resin adhesive is notable in particular for providing a one-component thermosetting epoxy resin adhesive which shows good adhesion on metal substrates at temperatures around 80° C., even when cured at relatively low temperatures.

公开(公告)号：US20230312984A1

公开(公告)日：2023-10-05

申请号：US16759639

申请日：2018-11-02

申请人： Fraunhofer-Gesellschaft Zur Förderung der Angewandten Forschung E.V.

发明人： Ralph Wilken ,  Matthias Popp ,  Jost Degenhardt

IPC分类号： C09J7/29 ,  C09J5/02 ,  C09J7/38 ,  B32B7/12 ,  B32B38/00 ,  B32B38/04 ,  B32B37/12 ,  B32B37/02 ,  B32B37/24 ,  H01F1/18 ,  C21D8/12

CPC分类号： C09J7/29 ,  C09J5/02 ,  C09J7/385 ,  B32B7/12 ,  B32B38/0012 ,  B32B38/04 ,  B32B37/1284 ,  B32B37/02 ,  B32B37/24 ,  H01F1/18 ,  C21D8/1283 ,  C09J2400/163 ,  C09J2400/166 ,  C09J2433/00 ,  B32B2457/00 ,  B32B2037/243 ,  B32B2307/206 ,  B32B2307/536 ,  B32B2310/14 ,  B32B2037/1253

摘要： The invention relates to a method for producing an electrical sheet pack using an anaerobically curing adhesive, to an electrical sheet pack produced or producible by such a method, and to a device for creating an electrical sheet pack of the invention.

公开(公告)号：US11692113B2

公开(公告)日：2023-07-04

申请号：US17903331

申请日：2022-09-06

申请人： THE BOEING COMPANY

发明人： James A. Moore ,  Daniel W. Huff ,  Dennis K. Kennedy

IPC分类号： C09D5/08 ,  C09D185/00 ,  B64D45/00 ,  C09D5/00 ,  C23C18/12 ,  C09J9/00 ,  C09J11/06 ,  B01J13/00 ,  C09J5/02 ,  C09D1/00 ,  C23C22/73

CPC分类号： C09J9/00 ,  B01J13/003 ,  B01J13/0065 ,  C09D1/00 ,  C09D5/08 ,  C09J5/02 ,  C09J11/06 ,  C23C18/122 ,  C23C18/1216 ,  C23C18/1241 ,  C23C18/1254 ,  C23C22/73 ,  C09J2400/163 ,  C09J2400/166

摘要： The present disclosure provides methods for forming sol-gels, sol-gel films and substrates, such as vehicle components, having a sol-gel film disposed thereon. At least one method of forming a sol-gel includes mixing a metal alkoxide, an acid stabilizer, and an organic solvent to form a first mixture having about 10 wt % or less water content based on the total weight of the first mixture. The method includes mixing an organosilane with the first mixture to form a second mixture having about 10 wt % or less water content based on the total weight of the second mixture.

公开(公告)号：US11685843B2

公开(公告)日：2023-06-27

申请号：US16488432

申请日：2018-03-01

申请人： MITSUI CHEMICALS, INC.

发明人： Takahiro Maeda ,  Yoshiyuki Ogawa

IPC分类号： C09J7/38 ,  H01M8/0221 ,  H01M8/0228 ,  H01M8/0284 ,  H01M10/0525 ,  C09J7/28 ,  C09J123/16 ,  H01M50/121 ,  H01M50/119 ,  H01M50/131 ,  H01M50/124 ,  H01G9/20 ,  H01L31/048 ,  H01M50/489 ,  H01M50/193 ,  H01M50/417

CPC分类号： C09J7/381 ,  C09J7/28 ,  C09J123/16 ,  H01M8/0221 ,  H01M8/0228 ,  H01M8/0284 ,  H01M10/0525 ,  H01M50/119 ,  H01M50/121 ,  H01M50/124 ,  H01M50/131 ,  C09J2203/33 ,  C09J2301/312 ,  C09J2301/414 ,  C09J2400/163 ,  C09J2423/10 ,  H01G9/20 ,  H01L31/0481 ,  H01M50/193 ,  H01M50/417 ,  H01M50/489 ,  C09J123/16 ,  C08L23/16 ,  C08L23/14 ,  C08L23/16 ,  C08L23/12 ,  C09J123/16 ,  C08L23/16 ,  C08L23/14 ,  C08L23/0815 ,  C08L23/12

摘要： A laminate for a battery with a polypropylene adhesive layer and a metal substrate layer: (1) the adhesive includes 40-94 wt % of a propylene copolymer (A), 3-30 wt % of a butene-containing copolymer (B), 3-30 wt % of an ethylene-α-olefin copolymer (C) ((A), (B), and (C) is 100 wt %), (2) the copolymer (A) has a melting point of 130° C. or more measured with a differential scanning calorimeter, and a total proportion of a structural unit derived from ethylene is 4-25 mol % relative to 100 mol % of a total structural units forming all the copolymers (A) contained in the adhesive, (3) the copolymer (B) includes less than 1 mol % of a structural unit derived from ethylene, and has a melting point of 100° C. or less measured with a differential scanning calorimeter, and (4) the copolymer (C) includes 50-99 mol % of a structural unit derived from ethylene.

公开(公告)号：US11667813B2

公开(公告)日：2023-06-06

申请号：US17564661

申请日：2021-12-29

申请人： Zephyros, Inc.

发明人： Michael Czaplicki

IPC分类号： C09J5/06 ,  C08G59/18 ,  C09J163/00 ,  C09J171/00 ,  C08L71/00 ,  C09J11/04 ,  C09J11/08 ,  C08L71/12 ,  C08L63/00 ,  C08K3/26 ,  C08K3/36

CPC分类号： C09J5/06 ,  C08G59/186 ,  C09J163/00 ,  C09J171/00 ,  C08G2650/56 ,  C08L71/00 ,  C08L2666/02 ,  C08L2666/22 ,  C09J2400/163 ,  C09J163/00 ,  C08L2666/02 ,  C09J171/00 ,  C08L2666/22

摘要： An adhesive formulation having an adduct of an epoxy resin and an elastomer, a phenoxy epoxy hybrid resin supplied as a solution formed by dissolving a phenoxy resin in a liquid epoxy resin to form a pre-formed dissolution product, a core/shell polymer, and one or more additional epoxy resins. The adhesive formulation may include a curing agent, blowing agent, filler, accelerator, or a combination.

公开(公告)号：US20230151258A1

公开(公告)日：2023-05-18

申请号：US17565329

申请日：2021-12-29

申请人： AAC Technologies (Nanjing) Co., Ltd. ,  AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD.

发明人： Keqiang Xia ,  Bo Zhang

IPC分类号： C09K5/06 ,  C09J7/29

CPC分类号： C09K5/063 ,  C09J7/29 ,  C09J2301/162 ,  C09J2301/314 ,  C09J2400/123 ,  C09J2400/163 ,  C09J2409/006 ,  C09J2467/006

摘要： The present disclosure discloses a thermally conductive composite including a thermally conductive film, having a thickness in a range from 10 um to 50 um, and a thermal phase-change layer disposed on the thermally conductive film, being composed of 6-13 wt% binder, 6-13 wt% thermal phase-change material, and 74-88 wt% coated microcapsule. The thermally conductive composite has dual functions of heat storage and thermal conduction.