公开(公告)号：US11738412B2

公开(公告)日：2023-08-29

申请号：US17835153

申请日：2022-06-08

Applicant: Aptiv Technologies Limited

Inventor： Stephen C. Antaya ,  William Falk ,  Justin Amalfitano ,  Amit Datta

IPC: C22C13/00 ,  C22C30/04 ,  C22C30/06 ,  B23K35/26 ,  B23K103/12 ,  B23K103/00 ,  B23K103/02

CPC classification number: B23K35/262 ,  C22C13/00 ,  C22C30/04 ,  C22C30/06 ,  B23K2103/02 ,  B23K2103/12 ,  B23K2103/54 ,  Y10T428/12597 ,  Y10T428/12715 ,  Y10T428/12722

Abstract: An electrical assembly includes an electrical connector soldered to a conductive pad disposed on a glass surface by a solder alloy consisting essentially of 17% to 28% indium by weight, 12% to 20% zinc by weight, 1% to 6% silver by weight, 1% to 3% copper by weight, and a remaining weight of the solder alloy being tin.

公开(公告)号：US20200295475A1

公开(公告)日：2020-09-17

申请号：US16862136

申请日：2020-04-29

Applicant: Aptiv Technologies Limited

Inventor： Stephen C. Antaya

IPC: H01R4/62 ,  H01R43/02 ,  H01R43/20 ,  H01R4/02

Abstract: An illustrative example method of making an electrically conductive connector comprising a first material and a second material, includes situating a layer comprising the second material at least partially within at least one layer comprising the first material and bonding the layers together. The first material has a first coefficient of thermal expansion and the second material has a second coefficient of thermal expansion that is different than the first coefficient of thermal expansion.

公开(公告)号：US11383330B2

公开(公告)日：2022-07-12

申请号：US17027036

申请日：2020-09-21

Applicant: Aptiv Technologies Limited

Inventor： Stephen C. Antaya ,  William Falk ,  Justin Amalfitano ,  Amit Datta

IPC: B23K35/26 ,  C22C30/06 ,  C22C30/04 ,  C22C13/00

Abstract: An electrical connector includes a first layer having a first coefficient of thermal expansion and a second layer overlaying the first layer having a second coefficient of thermal expansion. A first difference between the first coefficient of thermal expansion and a coefficient of thermal expansion of glass is greater than a second difference between the second coefficient of thermal expansion and the coefficient of thermal expansion of glass. The electrical connector further includes a layer of a solder alloy having about 15% to 28% indium by weight, about 5% to 20% zinc by weight, about 1% to 6% silver by weight, and at least 36% tin by weight. The solder layer is disposed on at least a portion of the second layer.

公开(公告)号：US20220112999A1

公开(公告)日：2022-04-14

申请号：US17557333

申请日：2021-12-21

Applicant: APTIV TECHNOLOGIES LIMITED

Inventor： Tyler Folger ,  Stefanie Merry ,  M. Jarod Scherer ,  Stephen C. Antaya

IPC: F21S45/60 ,  B60S1/02 ,  F21V21/002 ,  H01R13/11 ,  H01R13/631 ,  H05B3/06 ,  H01R11/12 ,  H05B3/84

Abstract: A lighting assembly is presented herein. The lighting assembly includes a receptacle terminal having a connection portion defining an aperture configured to receive a corresponding plug terminal along a longitudinal axis and a terminal housing defining an opening and a cavity in which the connection portion is disposed. The connection portion is sized, shaped, and arranged within the cavity to be movable along a lateral axis perpendicular to the longitudinal axis.

公开(公告)号：US20220324064A1

公开(公告)日：2022-10-13

申请号：US17835153

申请日：2022-06-08

Applicant: Aptiv Technologies Limited

Inventor： Stephen C. Antaya ,  William Falk ,  Justin Amalfitano ,  Amit Datta

IPC: B23K35/26 ,  C22C13/00 ,  C22C30/04 ,  C22C30/06

Abstract: An electrical assembly includes an electrical connector soldered to a conductive pad disposed on a glass surface by a solder alloy consisting essentially of 17% to 28% indium by weight, 12% to 20% zinc by weight, 1% to 6% silver by weight, 1% to 3% copper by weight, and a remaining weight of the solder alloy being tin.

公开(公告)号：US20220088720A1

公开(公告)日：2022-03-24

申请号：US17027036

申请日：2020-09-21

Applicant: Aptiv Technologies Limited

Inventor： Stephen C. Antaya ,  William Falk ,  Justin Amalfitano ,  Amit Datta

IPC: B23K35/26 ,  C22C30/04 ,  C22C30/06

Abstract: An electrical connector includes a first layer having a first coefficient of thermal expansion and a second layer overlaying the first layer having a second coefficient of thermal expansion. A first difference between the first coefficient of thermal expansion and a coefficient of thermal expansion of glass is greater than a second difference between the second coefficient of thermal expansion and the coefficient of thermal expansion of glass. The electrical connector further includes a layer of a solder alloy having about 15% to 28% indium by weight, about 5% to 20% zinc by weight, about 1% to 6% silver by weight, and at least 36% tin by weight. The solder layer is disposed on at least a portion of the second layer.