METHOD FOR ELECTROLESS PLATING
    9.
    发明申请
    METHOD FOR ELECTROLESS PLATING 有权
    电镀镀层的方法

    公开(公告)号:US20140113158A1

    公开(公告)日:2014-04-24

    申请号:US14116810

    申请日:2012-04-17

    Abstract: The present invention discloses a method for electroless plating of a metal or metal alloy onto a metal or a metal alloy structure comprising a metal such as molybdenum or titanium and alloys containing such metals. The method comprises the steps of activation, treatment in an aqueous solution comprising at least one nitrogen-containing compound or a hydroxy carboxylic acid and electroless plating of a metal or metal alloy.

    Abstract translation: 本发明公开了一种将金属或金属合金化学镀在金属或金属合金结构上的方法,所述金属或金属合金结构包括诸如钼或钛的金属和含有这些金属的合金。 该方法包括在包含至少一种含氮化合物或羟基羧酸的水溶液中进行活化,处理金属或金属合金的化学镀的步骤。

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