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公开(公告)号：US11500298B2
公开(公告)日：2022-11-15
申请号：US17415715
申请日：2019-12-12
Applicant: ASML Holding N.V.
IPC: G03F7/20
Abstract: An apparatus for reticle sub-field thermal control in a lithography system is disclosed. The apparatus includes a clamp configured to fix an object. The clamp includes a plurality of gas distribution features that are spatially arranged in a pattern. The apparatus further includes a gas pressure controller configured to individually control a gas flow rate through each of the plurality of gas distribution features to spatially modulate a gas pressure distribution in a space between the clamp and the object. The gas distribution features include a plurality of trenches or holes arranged in an array form.
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公开(公告)号：US11927889B2
公开(公告)日：2024-03-12
申请号：US17430275
申请日：2020-01-27
Applicant: ASML Holding N.V.
Inventor： Kushal Sandeep Doshi , Eric Justin Monkman , John Robert Burroughs , Sudhanshu Nahata , Stefan Luka Colton
IPC: G03F7/00
CPC classification number: G03F7/70716 , G03F7/70741 , G03F7/70808 , G03F7/7085 , G03F7/7095
Abstract: An apparatus includes a first substrate, a second substrate, and an intermediate layer disposed between the first and second substrates. The intermediate layer is configured to be a first point of failure or breakage of the apparatus under an applied force. The apparatus can further include a bonding layer disposed between the first and second substrates. The bonding layer is configured to bond the intermediate layer to the first and second substrates. The apparatus can further include a fastener coupled to the first and second substrates. The fastener is configured to secure the intermediate layer to the first and second substrates. The intermediate layer can include a coating applied to the first substrate or the second substrate. The apparatus can further include a second intermediate layer disposed between the first substrate and the fastener or the second substrate and the fastener.
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