公开(公告)号：US20230288817A1

公开(公告)日：2023-09-14

申请号：US18196432

申请日：2023-05-12

Applicant: ASML NETHERLANDS B.V.

Inventor： Rowin MEIJERINK ,  Putra SAPUTRA ,  Pieter Gerardus Jacobus SMORENBERG ,  Theo Wilhelmus Maria THIJSSEN ,  Khalid ELBATTAY ,  Ma Su Su HLAING ,  Paul DERWIN ,  Bo ZHONG ,  Masaya KOMATSU

IPC: G03F7/20

CPC classification number: G03F7/70633 ,  G03F7/70258 ,  G03F7/70725

Abstract: A method for controlling a lithographic apparatus configured to pattern an exposure field on a substrate including at least a sub-field, the method including: obtaining an initial spatial profile associated with a spatial variation of a performance parameter associated with a layer on the substrate across at least the sub-field of the exposure field; and decomposing the initial spatial profile into at least a first component spatial profile for controlling a lithographic apparatus at a first spatial scale and a second component spatial profile for controlling the lithographic apparatus at a second spatial scale associated with a size of the sub-field, wherein the decomposing includes co-optimizing the first and second component spatial profiles based on correcting the spatial variation of the performance parameter across the sub-field.