公开(公告)号：US20210389676A1

公开(公告)日：2021-12-16

申请号：US17279648

申请日：2019-09-11

Applicant: ASML NETHERLANDS B.V.

Inventor： Bearrach MOEST ,  Rowin MEIJERINK ,  Thijs SCHENKELAARS ,  Norbertus Josephus Martinus VAN DEN NIEUWELAAR ,  Laurentius Johannes Adrianus VAN BOKHOVEN

IPC: G03F7/20

Abstract: A method of predicting deflection of a pellicle which will occur during movement of the pellicle in a lithographic apparatus, the method including receiving parameters regarding properties of the pellicle and receiving parameters regarding the expected movement of the pellicle. The parameters are applied to a model which predicts deflection of the pellicle as a function of those parameters. The model includes a plurality of sub-models which relate to different components of deflection of the pellicle. An output of the model may be used to predict.

公开(公告)号：US20230288817A1

公开(公告)日：2023-09-14

申请号：US18196432

申请日：2023-05-12

Applicant: ASML NETHERLANDS B.V.

Inventor： Rowin MEIJERINK ,  Putra SAPUTRA ,  Pieter Gerardus Jacobus SMORENBERG ,  Theo Wilhelmus Maria THIJSSEN ,  Khalid ELBATTAY ,  Ma Su Su HLAING ,  Paul DERWIN ,  Bo ZHONG ,  Masaya KOMATSU

IPC: G03F7/20

CPC classification number: G03F7/70633 ,  G03F7/70258 ,  G03F7/70725

Abstract: A method for controlling a lithographic apparatus configured to pattern an exposure field on a substrate including at least a sub-field, the method including: obtaining an initial spatial profile associated with a spatial variation of a performance parameter associated with a layer on the substrate across at least the sub-field of the exposure field; and decomposing the initial spatial profile into at least a first component spatial profile for controlling a lithographic apparatus at a first spatial scale and a second component spatial profile for controlling the lithographic apparatus at a second spatial scale associated with a size of the sub-field, wherein the decomposing includes co-optimizing the first and second component spatial profiles based on correcting the spatial variation of the performance parameter across the sub-field.

公开(公告)号：US20250021017A1

公开(公告)日：2025-01-16

申请号：US18704532

申请日：2022-10-12

Applicant: ASML Netherlands B.V.

Inventor： Raaja Ganapathy SUBRAMANIAN ,  Bearrach MOEST ,  Alexander Alexandrovich DANILIN ,  Rowin MEIJERINK ,  Tim Izaak Johannes GOOSSEN ,  Stanislav Markovich SHUMIACHER

IPC: G03F7/00

Abstract: A method of reducing effects of heating and/or cooling a reticle in a lithographic process includes conditioning the reticle to adjust an initial temperature of the reticle to a predetermined temperature, reducing stress in the reticle to reduce parasitic thermal effects, calibrating a reticle heating model by exposing the reticle and a non-production substrate to a dose of radiation, and processing a production substrate by exposing the reticle and a production substrate to a dose of radiation based on the reticle heating model. The method can increase calibration accuracy and speed of the reticle heating model, reduce conditioning times of the reticle, reduce stress in the reticle, avoid rework of production substrates, and increase throughput, yield, and accuracy.

公开(公告)号：US20220171295A1

公开(公告)日：2022-06-02

申请号：US17441353

申请日：2020-03-05

Applicant: ASML NETHERLANDS B.V.

Inventor： Rowin MEIJERINK ,  Putra SAPUTRA ,  Pieter Gerardus Jacobus SMORENBERG ,  Theo Wilhelmus Maria THIJSSEN ,  Khalid ELBATTAY ,  Ma Su Su HLAING ,  Paul DERWIN ,  BO ZHONG ,  Masaya KOMATSU

IPC: G03F7/20

Abstract: A method for controlling a lithographic apparatus configured to pattern an exposure field on a substrate including at least a sub-field, the method including: obtaining an initial spatial profile associated with a spatial variation of a performance parameter associated with a layer on the substrate across at least the sub-field of the exposure field; and decomposing the initial spatial profile into at least a first component spatial profile for controlling a lithographic apparatus at a first spatial scale and a second component spatial profile for controlling the lithographic apparatus at a second spatial scale associated with a size of the sub-field, wherein the decomposing includes co-optimizing the first and second component spatial profiles based on correcting the spatial variation of the performance parameter across the sub-field.