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公开(公告)号:US20220260920A1
公开(公告)日:2022-08-18
申请号:US17612601
申请日:2020-05-11
Applicant: ASML NETHERLANDS B.V.
Inventor: Pieter Gerardus Jacobus SMORENBERG , Putra SAPUTRA , Khalid ELBATTAY , Paul DERWIN , Roy WERKMAN , Erik JENSEN , Hyunwoo YU , Gautam SARMA
IPC: G03F7/20
Abstract: A method for determining a sampling scheme, the method including: obtaining a first fingerprint model relating to a first spatial distribution of a performance parameter over a first portion of a semiconductor substrate and a second fingerprint model relating to a second spatial distribution of the performance parameter over a second portion of the semiconductor substrate; and determining a sampling point corresponding to a measuring location on the semiconductor substrate for generating measurement data based on an expected reduction of a first uncertainty metric associated with evaluation of the first fingerprint model over the first portion and an expected reduction of a second uncertainty metric associated with evaluation of the second fingerprint model over the second portion.
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公开(公告)号:US20220011683A1
公开(公告)日:2022-01-13
申请号:US17294503
申请日:2019-10-21
Applicant: ASML NETHERLANDS B.V.
Inventor: Pavel SMAL , Inez Marlena SOCHAL , Gautam SARMA
Abstract: A method for determining a layout of mark positions across a patterning device or substrate, the method including: obtaining a model configured to model data associated with measurements performed on the patterning device or substrate at one or more mark positions; obtaining an initial mark layout including initial mark positions; reducing the initial mark layout by removal of one or more mark positions to obtain a plurality of reduced mark layouts, each reduced mark layout obtained by removal of a different mark position from the initial mark layout; determining a model uncertainty metric associated with usage of the model for each reduced mark layout out of the plurality of reduced mark layouts; and selecting one or more reduced mark layouts based on its associated model uncertainty metric.
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