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公开(公告)号：US20230317502A1
公开(公告)日：2023-10-05
申请号：US17711762
申请日：2022-04-01
Applicant: Advanced Semiconductor Engineering, Inc.
Inventor： Chun Hung TSAI , Chenghan SHE , Kuo-Chih HUANG , Kuan-Lin YEH
IPC: H01L21/683 , H01L21/67
CPC classification number: H01L21/6838 , H01L21/67144 , H01L24/14
Abstract: A method for manufacturing an electronic package and a suction device are provided. The method includes: providing an electronic component having a first surface and including at least one conductive stud on the first surface; providing a suction device having at least one recess; and moving the electronic component with the suction device, wherein an edge of the at least one recess does not overlap the at least one conductive stud from a top view while moving the electronic component with the suction device.
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公开(公告)号：US20220139726A1
公开(公告)日：2022-05-05
申请号：US17086189
申请日：2020-10-30
Applicant: Advanced Semiconductor Engineering, Inc.
Inventor： Chenghan SHE
Abstract: A method and a system for manufacturing a semiconductor package structure are provided. The method includes: (a) measuring an amount of a molding powder; (b) controlling the amount of a molding powder; and (c) dispensing the molding powder on an assembly structure including a carrier and at least one semiconductor device disposed on the carrier.
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公开(公告)号：US20240170302A1
公开(公告)日：2024-05-23
申请号：US18427769
申请日：2024-01-30
Applicant: Advanced Semiconductor Engineering, Inc.
Inventor： Chenghan SHE
CPC classification number: H01L21/565 , B29C43/18 , B29C43/34 , H01L21/568 , H01L21/67126 , B29C2043/3438 , B29K2105/251 , B29L2031/3406
Abstract: A method and a system for manufacturing a semiconductor package structure are provided. The method includes: (a) measuring an amount of a molding powder; (b) controlling the amount of a molding powder; and (c) dispensing the molding powder on an assembly structure including a carrier and at least one semiconductor device disposed on the carrier.
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