公开(公告)号：US11887967B2

公开(公告)日：2024-01-30

申请号：US17493709

申请日：2021-10-04

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Shang-Ruei Wu ,  Chien-Yuan Tseng ,  Meng-Jen Wang ,  Chen-Tsung Chang ,  Chih-Fang Wang ,  Cheng-Han Li ,  Chien-Hao Chen ,  An-Chi Tsao ,  Per-Ju Chao

IPC: H01L25/065 ,  H01L21/02 ,  H01L21/768 ,  H01L23/31

CPC classification number: H01L25/0657 ,  H01L21/02631 ,  H01L21/76838 ,  H01L23/3121

Abstract: A semiconductor device package includes a substrate, a connection structure, a first package body and a first electronic component. The substrate has a first surface and a second surface opposite to the first surface. The connection structure is disposed on the firs surface of the substrate. The first package body is disposed on the first surface of the substrate. The first package body covers the connection structure and exposes a portion of the connection structure. The first electronic component is disposed on the first package body and in contact with the portion of the connection structure exposed by the first package body.

公开(公告)号：US11139274B2

公开(公告)日：2021-10-05

申请号：US16779249

申请日：2020-01-31

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Shang-Ruei Wu ,  Chien-Yuan Tseng ,  Meng-Jen Wang ,  Chen-Tsung Chang ,  Chih-Fang Wang ,  Cheng-Han Li ,  Chien-Hao Chen ,  An-Chi Tsao ,  Per-Ju Chao

IPC: H01L25/065 ,  H01L21/02 ,  H01L21/768 ,  H01L23/31

Abstract: A semiconductor device package includes a substrate, a connection structure, a first package body and a first electronic component. The substrate has a first surface and a second surface opposite to the first surface. The connection structure is disposed on the first surface of the substrate. The first package body is disposed on the first surface of the substrate. The first package body covers the connection structure and exposes a portion of the connection structure. The first electronic component is disposed on the first package body and in contact with the portion of the connection structure exposed from the first package body.

公开(公告)号：US12009313B2

公开(公告)日：2024-06-11

申请号：US17492493

申请日：2021-10-01

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Meng-Jen Wang ,  Chien-Yuan Tseng ,  Hung Chen Kuo ,  Ying-Hao Wei ,  Chia-Feng Hsu ,  Yuan-Long Chiao

IPC: H01L23/552 ,  H01L21/56 ,  H01L23/31 ,  H01L23/538

CPC classification number: H01L23/552 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/5389

Abstract: A selective EMI shielding structure for a semiconductor package and a method of fabrication thereof is disclosed. The semiconductor package, comprising: a substrate having a first face; at least one first electronic component mounted adjacent to a first region of the first face; a least one second electronic component mounted adjacent to a second region of the first face; and an encapsulant disposed over the first and the second electronic components, wherein the encapsulant covers directly over the first electronic component, and wherein the encapsulant covers the second electronic component through a layer of conductive material.

公开(公告)号：US20200251449A1

公开(公告)日：2020-08-06

申请号：US16779249

申请日：2020-01-31

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Shang-Ruei Wu ,  Chien-Yuan Tseng ,  Meng-Jen Wang ,  Chen-Tsung Chang ,  Chih-Fang Wang ,  Cheng-Han Li ,  Chien-Hao Chen ,  An-Chi Tsao ,  Per-Ju Chao

IPC: H01L25/065 ,  H01L23/31 ,  H01L21/768 ,  H01L21/02

Abstract: A semiconductor device package includes a substrate, a connection structure, a first package body and a first electronic component. The substrate has a first surface and a second surface opposite to the first surface. The connection structure is disposed on the firs surface of the substrate. The first package body is disposed on the first surface of the substrate. The first package body covers the connection structure and exposes a portion of the connection structure. The first electronic component is disposed on the first package body and in contact with the portion of the connection structure exposed from the first package body.