公开(公告)号：US12068259B2

公开(公告)日：2024-08-20

申请号：US18121568

申请日：2023-03-14

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wei Da Lin ,  Meng-Jen Wang ,  Hung Chen Kuo ,  Wen Jin Huang

IPC: H01L23/552 ,  H01L21/3213 ,  H01L21/56 ,  H01L23/04 ,  H01L23/31

CPC classification number: H01L23/552 ,  H01L21/32131 ,  H01L21/561 ,  H01L21/563 ,  H01L21/565 ,  H01L23/04 ,  H01L23/3114

Abstract: A semiconductor device package includes a substrate having a surface, a conductive element disposed on the surface of the substrate, and an encapsulant disposed on the surface of the substrate and covering the conductive element. The conductive element has an upper surface facing away from the substrate and exposed from the encapsulant. Further, a roughness of the upper surface of the conductive element is greater than a roughness of a side surface of the conductive element.

公开(公告)号：US12009313B2

公开(公告)日：2024-06-11

申请号：US17492493

申请日：2021-10-01

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Meng-Jen Wang ,  Chien-Yuan Tseng ,  Hung Chen Kuo ,  Ying-Hao Wei ,  Chia-Feng Hsu ,  Yuan-Long Chiao

IPC: H01L23/552 ,  H01L21/56 ,  H01L23/31 ,  H01L23/538

CPC classification number: H01L23/552 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/5389

Abstract: A selective EMI shielding structure for a semiconductor package and a method of fabrication thereof is disclosed. The semiconductor package, comprising: a substrate having a first face; at least one first electronic component mounted adjacent to a first region of the first face; a least one second electronic component mounted adjacent to a second region of the first face; and an encapsulant disposed over the first and the second electronic components, wherein the encapsulant covers directly over the first electronic component, and wherein the encapsulant covers the second electronic component through a layer of conductive material.

公开(公告)号：US11605598B2

公开(公告)日：2023-03-14

申请号：US16852256

申请日：2020-04-17

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wei Da Lin ,  Meng-Jen Wang ,  Hung Chen Kuo ,  Wen Jin Huang

IPC: H01L23/552 ,  H01L21/56 ,  H01L23/31 ,  H01L23/04 ,  H01L21/3213

Abstract: A semiconductor device package includes a substrate having a surface, a conductive element disposed on the surface of the substrate, and an encapsulant disposed on the surface of the substrate and covering the conductive element. The conductive element has an upper surface facing away from the substrate and exposed from the encapsulant. Further, a roughness of the upper surface of the conductive element is greater than a roughness of a side surface of the conductive element.