公开(公告)号：US20220367304A1

公开(公告)日：2022-11-17

申请号：US17317770

申请日：2021-05-11

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Kuoching CHENG ,  Yuan-Feng CHIANG ,  Ya Fang CHAN ,  Wen-Long LU ,  Shih-Yu WANG

IPC: H01L23/31 ,  H01L25/065 ,  H01L23/16 ,  H01L23/538 ,  H01L21/56

Abstract: An electronic device package and a method for manufacturing an electronic device package are provided. The electronic device package includes electronic device structure which includes a first electronic device and a first encapsulant, a second electronic device, and a second encapsulant. The first encapsulant encapsulates the first electronic device. The second electronic device is adjacent to the electronic device structure. The second encapsulant encapsulates the electronic device structure and the second electronic device. A first extension line along a lateral surface of the first electronic device and a second extension line along a lateral surface of the first encapsulant define a first angle, the second extension line along the lateral surface of the first encapsulant and a third extension line along a lateral surface of the second electronic device define a second angle, and the first angle is different from the second angle.

公开(公告)号：US20240249958A1

公开(公告)日：2024-07-25

申请号：US18099867

申请日：2023-01-20

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ya Fang CHAN ,  Cong-Wei CHEN ,  Kuoching CHENG ,  Shih-Yu WANG

IPC: H01L21/67 ,  H01L21/683

CPC classification number: H01L21/67092 ,  H01L21/6838

Abstract: A method for manufacturing a semiconductor package and an apparatus for flattening a workpiece are provided. The method includes providing a panel over a stage, wherein the panel includes a lower surface facing the stage and an upper surface opposite to the lower surface; applying a first force to a first region of the upper surface of the panel along at least one direction from the panel toward the stage; and transferring the first force from the first region to a second region of the upper surface of the panel different from the first region.