公开(公告)号：US20180265347A1

公开(公告)日：2018-09-20

申请号：US15921265

申请日：2018-03-14

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ming Yen LEE ,  Chia Hao SUNG ,  Ching-Han HUANG ,  Yu-Hsuan TSAI

IPC: B81B3/00 ,  B81C1/00

Abstract: The present disclosure relates to a semiconductor device package. The semiconductor device package includes a substrate, a support structure, an electronic component and an adhesive. The support structure is disposed on the substrate. The electronic component is disposed on the support structure. The adhesive is disposed between the substrate and the electronic component and covers the support structure. A hardness of the support structure is less than a hardness of the electronic component.

公开(公告)号：US20200283288A1

公开(公告)日：2020-09-10

申请号：US16885150

申请日：2020-05-27

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ming Yen LEE ,  Chia-Hao SUNG ,  Ching-Han HUANG ,  Yu-Hsuan TSAI

IPC: B81B7/00 ,  B81B3/00 ,  B81C1/00 ,  H01L23/538 ,  H01L23/48 ,  H01L23/522 ,  H01L23/52 ,  H01L23/525 ,  H01L21/66 ,  B81C3/00 ,  H01L23/31 ,  H01L23/13 ,  H01L23/12 ,  H01L23/28

Abstract: The present disclosure relates to a semiconductor device package. The semiconductor device package includes a substrate, a support structure, an electronic component and an adhesive. The support structure is disposed on the substrate. The electronic component is disposed on the support structure. The adhesive is disposed between the substrate and the electronic component and covers the support structure. A hardness of the support structure is less than a hardness of the electronic component.