公开(公告)号：US11018422B2

公开(公告)日：2021-05-25

申请号：US16448990

申请日：2019-06-21

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Shao-En Hsu ,  Huei-Shyong Cho ,  Shih-Wen Lu

IPC: H01Q1/48 ,  H01Q1/52 ,  H01Q1/24 ,  H01Q21/06 ,  H01Q1/22 ,  H01Q5/378

Abstract: A semiconductor device package includes a substrate, a first antenna pattern and a second antenna pattern. The substrate has a first surface and a second surface opposite to the first surface. The first antenna pattern is disposed over the first surface of the substrate. The first antenna pattern has a first bandwidth. The second antenna pattern is disposed over the first antenna pattern. The second antenna pattern has a second bandwidth different from the first bandwidth. The first antenna pattern and the second antenna pattern are at least partially overlapping in a direction perpendicular to the first surface of the substrate.

公开(公告)号：US12206165B2

公开(公告)日：2025-01-21

申请号：US18206580

申请日：2023-06-06

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Shao-En Hsu ,  Huei-Shyong Cho ,  Shih-Wen Lu

IPC: H01Q1/52 ,  H01Q1/22 ,  H01Q1/24 ,  H01Q1/48 ,  H01Q5/378 ,  H01Q21/06

Abstract: A semiconductor device package includes a substrate, a first antenna pattern and a second antenna pattern. The substrate has a first surface and a second surface opposite to the first surface. The first antenna pattern is disposed over the first surface of the substrate. The first antenna pattern has a first bandwidth. The second antenna pattern is disposed over the first antenna pattern. The second antenna pattern has a second bandwidth different from the first bandwidth. The first antenna pattern and the second antenna pattern are at least partially overlapping in a direction perpendicular to the first surface of the substrate.

公开(公告)号：US20190280367A1

公开(公告)日：2019-09-12

申请号：US15913856

申请日：2018-03-06

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Shao-En Hsu ,  Huei-Shyong Cho ,  Shih-Wen Lu

IPC: H01Q1/22 ,  H01L23/367 ,  H01L23/498 ,  H01L23/66 ,  H01Q1/02 ,  H01Q1/24 ,  H01Q21/06

Abstract: A semiconductor package device includes a substrate, an antenna and a conductor. The substrate has an upper surface. The antenna is disposed on the upper surface of the substrate. The conductor is disposed on the upper surface of the substrate and surrounds the antenna. The conductor has a first surface facing toward the antenna and a second surface opposite to the first surface. The second surface of the conductor is spaced apart from the upper surface of the substrate

公开(公告)号：US11108131B2

公开(公告)日：2021-08-31

申请号：US16538592

申请日：2019-08-12

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Shao-En Hsu ,  Huei-Shyong Cho ,  Shih-Wen Lu

IPC: H01Q1/22 ,  H01Q9/04 ,  H01Q1/38 ,  H01L23/66 ,  H01L23/31

Abstract: A semiconductor device package includes a substrate, a first antenna and a second antenna. The substrate has a first surface and a second surface opposite to the first surface. The first antenna pattern is disposed over the first surface of the substrate. The first antenna pattern has a first bandwidth. The first antenna pattern has a first port configured to generate a magnetic field. The second antenna pattern is disposed over the first surface of the substrate. The second antenna pattern has a second bandwidth different from the first bandwidth. A prolonged line of an edge of the first antenna pattern parallel to the magnetic field generated by the first port of the first antenna pattern is spaced apart from the second antenna pattern.

公开(公告)号：US10546825B2

公开(公告)日：2020-01-28

申请号：US16262768

申请日：2019-01-30

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Shao-En Hsu ,  Huei-Shyong Cho ,  Shih-Wen Lu

IPC: H01L23/66 ,  H01L23/31 ,  H01L23/498 ,  H01Q1/22 ,  H01P3/12 ,  H01Q13/02 ,  H01Q19/08 ,  H01Q19/28 ,  H01P3/08 ,  H01Q13/08

Abstract: An antenna semiconductor package device includes: (1) a waveguide cavity having a radiation opening; and (2) a first directing element outside of the waveguide cavity and separated from the waveguide cavity by a first gap.

公开(公告)号：US11670846B2

公开(公告)日：2023-06-06

申请号：US17327644

申请日：2021-05-21

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Shao-En Hsu ,  Huei-Shyong Cho ,  Shih-Wen Lu

IPC: H01Q1/52 ,  H01Q1/24 ,  H01Q21/06 ,  H01Q1/22 ,  H01Q1/48 ,  H01Q5/378

CPC classification number: H01Q1/523 ,  H01Q1/2283 ,  H01Q1/243 ,  H01Q1/48 ,  H01Q5/378 ,  H01Q21/061

Abstract: A semiconductor device package includes a substrate, a first antenna pattern and a second antenna pattern. The substrate has a first surface and a second surface opposite to the first surface. The first antenna pattern is disposed over the first surface of the substrate. The first antenna pattern has a first bandwidth. The second antenna pattern is disposed over the first antenna pattern. The second antenna pattern has a second bandwidth different from the first bandwidth. The first antenna pattern and the second antenna pattern are at least partially overlapping in a direction perpendicular to the first surface of the substrate.

公开(公告)号：US10530038B2

公开(公告)日：2020-01-07

申请号：US15913856

申请日：2018-03-06

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Shao-En Hsu ,  Huei-Shyong Cho ,  Shih-Wen Lu

IPC: H01Q1/22 ,  H01L23/367 ,  H01L23/498 ,  H01Q1/02 ,  H01Q1/24 ,  H01Q21/06 ,  H01L23/66

Abstract: A semiconductor package device includes a substrate, an antenna and a conductor. The substrate has an upper surface. The antenna is disposed on the upper surface of the substrate. The conductor is disposed on the upper surface of the substrate and surrounds the antenna. The conductor has a first surface facing toward the antenna and a second surface opposite to the first surface. The second surface of the conductor is spaced apart from the upper surface of the substrate.

公开(公告)号：US10199336B2

公开(公告)日：2019-02-05

申请号：US15604545

申请日：2017-05-24

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Shao-En Hsu ,  Huei-Shyong Cho ,  Shih-Wen Lu

IPC: H01L23/66 ,  H01L23/498 ,  H01L23/31 ,  H01P3/08 ,  H01Q1/22 ,  H01Q13/08

Abstract: An antenna semiconductor package device includes a first conductive layer, a second conductive layer, a first conductive element and a first directing element. The second conductive layer is over the first conductive layer and separated from the first conductive layer. The first conductive element connects the first conductive layer to the second conductive layer. The first directing element is adjacent to the first conductive layer and separated from the first conductive layer by a first gap. The first conductive element, the first conductive layer and the second conductive layer define a waveguide cavity and a radiation opening.