公开(公告)号：US20190280367A1

公开(公告)日：2019-09-12

申请号：US15913856

申请日：2018-03-06

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Shao-En Hsu ,  Huei-Shyong Cho ,  Shih-Wen Lu

IPC分类号： H01Q1/22 ,  H01L23/367 ,  H01L23/498 ,  H01L23/66 ,  H01Q1/02 ,  H01Q1/24 ,  H01Q21/06

摘要： A semiconductor package device includes a substrate, an antenna and a conductor. The substrate has an upper surface. The antenna is disposed on the upper surface of the substrate. The conductor is disposed on the upper surface of the substrate and surrounds the antenna. The conductor has a first surface facing toward the antenna and a second surface opposite to the first surface. The second surface of the conductor is spaced apart from the upper surface of the substrate

公开(公告)号：US11997783B2

公开(公告)日：2024-05-28

申请号：US17827546

申请日：2022-05-27

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Po-An Lin ,  Huei-Shyong Cho ,  Shih-Wen Lu

IPC分类号： H05K1/16 ,  H05K1/02

CPC分类号： H05K1/024 ,  H05K1/16 ,  H05K2201/10098

摘要： The present disclosure provides an electronic device. The electronic device includes a first insulating layer, a first antenna pattern, a second insulating layer, and a second antenna pattern. The first antenna pattern is configured to operate at a first frequency and at least partially disposed over the first insulating layer. The second insulating layer is disposed over the first insulating layer. The second antenna pattern is configured to operate at a second frequency different from the first frequency and at least partially disposed over the second insulating layer. A dielectric constant of the first insulating layer is different from a dielectric constant of the second insulating layer.

公开(公告)号：US11018422B2

公开(公告)日：2021-05-25

申请号：US16448990

申请日：2019-06-21

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Shao-En Hsu ,  Huei-Shyong Cho ,  Shih-Wen Lu

IPC分类号： H01Q1/48 ,  H01Q1/52 ,  H01Q1/24 ,  H01Q21/06 ,  H01Q1/22 ,  H01Q5/378

摘要： A semiconductor device package includes a substrate, a first antenna pattern and a second antenna pattern. The substrate has a first surface and a second surface opposite to the first surface. The first antenna pattern is disposed over the first surface of the substrate. The first antenna pattern has a first bandwidth. The second antenna pattern is disposed over the first antenna pattern. The second antenna pattern has a second bandwidth different from the first bandwidth. The first antenna pattern and the second antenna pattern are at least partially overlapping in a direction perpendicular to the first surface of the substrate.

公开(公告)号：US12119312B2

公开(公告)日：2024-10-15

申请号：US18223525

申请日：2023-07-18

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Cheng-Nan Lin ,  Wei-Tung Chang ,  Jen-Chieh Kao ,  Huei-Shyong Cho

IPC分类号： H01L23/66 ,  H01L21/48 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01Q1/22 ,  H01Q1/24

CPC分类号： H01L23/66 ,  H01L21/4853 ,  H01L21/4857 ,  H01L23/3128 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/49838 ,  H01L24/16 ,  H01Q1/2283 ,  H01L2223/6677 ,  H01L2224/16227 ,  H01L2924/1421 ,  H01Q1/243

摘要： An electronic device package includes a first substrate, a second substrate and a conductive layer. The first substrate includes a first bonding pad, and a cavity exposing the first bonding pad. The second substrate is laminated on the first substrate. The second substrate includes a second bonding pad at least partially inserting into the cavity of the first substrate. The conductive layer is disposed in the cavity and at least between the first bonding pad and the second bonding pad to connect the first bonding pad and the second bonding pad.

公开(公告)号：US11705412B2

公开(公告)日：2023-07-18

申请号：US17347220

申请日：2021-06-14

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Cheng-Nan Lin ,  Wei-Tung Chang ,  Jen-Chieh Kao ,  Huei-Shyong Cho

IPC分类号： H01L23/66 ,  H01L23/31 ,  H01L23/498 ,  H01L21/48 ,  H01Q1/22 ,  H01L23/00 ,  H01Q1/24

CPC分类号： H01L23/66 ,  H01L21/4853 ,  H01L21/4857 ,  H01L23/3128 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/49838 ,  H01L24/16 ,  H01Q1/2283 ,  H01L2223/6677 ,  H01L2224/16227 ,  H01L2924/1421 ,  H01Q1/243

摘要： An electronic device package includes a first substrate, a second substrate and a conductive layer. The first substrate includes a first bonding pad, and a cavity exposing the first bonding pad. The second substrate is laminated on the first substrate. The second substrate includes a second bonding pad at least partially inserting into the cavity of the first substrate. The conductive layer is disposed in the cavity and at least between the first bonding pad and the second bonding pad to connect the first bonding pad and the second bonding pad.

公开(公告)号：US11329007B2

公开(公告)日：2022-05-10

申请号：US16996872

申请日：2020-08-18

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Wen Hung Huang ,  Yan Wen Chung ,  Huei-Shyong Cho

IPC分类号： H05K1/11 ,  H05K3/42 ,  H01L23/00 ,  H01L23/498 ,  H01L23/552 ,  H01L21/48 ,  H01L21/66 ,  H01L21/683 ,  H01L23/66 ,  H01L25/16

摘要： A wiring structure includes a conductive structure, a surface structure and at least one through via. The conductive structure includes at least one dielectric layer and at least one circuit layer in contact with the dielectric layer. The surface structure is disposed adjacent to a top surface of the conductive structure. The through via extends through the surface structure and extending into at least a portion of the conductive structure.

公开(公告)号：US11108131B2

公开(公告)日：2021-08-31

申请号：US16538592

申请日：2019-08-12

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Shao-En Hsu ,  Huei-Shyong Cho ,  Shih-Wen Lu

IPC分类号： H01Q1/22 ,  H01Q9/04 ,  H01Q1/38 ,  H01L23/66 ,  H01L23/31

摘要： A semiconductor device package includes a substrate, a first antenna and a second antenna. The substrate has a first surface and a second surface opposite to the first surface. The first antenna pattern is disposed over the first surface of the substrate. The first antenna pattern has a first bandwidth. The first antenna pattern has a first port configured to generate a magnetic field. The second antenna pattern is disposed over the first surface of the substrate. The second antenna pattern has a second bandwidth different from the first bandwidth. A prolonged line of an edge of the first antenna pattern parallel to the magnetic field generated by the first port of the first antenna pattern is spaced apart from the second antenna pattern.

公开(公告)号：US10546825B2

公开(公告)日：2020-01-28

申请号：US16262768

申请日：2019-01-30

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Shao-En Hsu ,  Huei-Shyong Cho ,  Shih-Wen Lu

IPC分类号： H01L23/66 ,  H01L23/31 ,  H01L23/498 ,  H01Q1/22 ,  H01P3/12 ,  H01Q13/02 ,  H01Q19/08 ,  H01Q19/28 ,  H01P3/08 ,  H01Q13/08

摘要： An antenna semiconductor package device includes: (1) a waveguide cavity having a radiation opening; and (2) a first directing element outside of the waveguide cavity and separated from the waveguide cavity by a first gap.

公开(公告)号：US11670846B2

公开(公告)日：2023-06-06

申请号：US17327644

申请日：2021-05-21

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Shao-En Hsu ,  Huei-Shyong Cho ,  Shih-Wen Lu

IPC分类号： H01Q1/52 ,  H01Q1/24 ,  H01Q21/06 ,  H01Q1/22 ,  H01Q1/48 ,  H01Q5/378

CPC分类号： H01Q1/523 ,  H01Q1/2283 ,  H01Q1/243 ,  H01Q1/48 ,  H01Q5/378 ,  H01Q21/061

摘要： A semiconductor device package includes a substrate, a first antenna pattern and a second antenna pattern. The substrate has a first surface and a second surface opposite to the first surface. The first antenna pattern is disposed over the first surface of the substrate. The first antenna pattern has a first bandwidth. The second antenna pattern is disposed over the first antenna pattern. The second antenna pattern has a second bandwidth different from the first bandwidth. The first antenna pattern and the second antenna pattern are at least partially overlapping in a direction perpendicular to the first surface of the substrate.

公开(公告)号：US11037891B2

公开(公告)日：2021-06-15

申请号：US16453780

申请日：2019-06-26

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Cheng-Nan Lin ,  Wei-Tung Chang ,  Jen-Chieh Kao ,  Huei-Shyong Cho

IPC分类号： H01L23/66 ,  H01L23/31 ,  H01L23/498 ,  H01L21/48 ,  H01Q1/22 ,  H01L23/00 ,  H01Q1/24

摘要： An electronic device package includes a first substrate, a second substrate and a conductive layer. The first substrate includes a first bonding pad, and a cavity exposing the first bonding pad. The second substrate is laminated on the first substrate. The second substrate includes a second bonding pad at least partially inserting into the cavity of the first substrate. The conductive layer is disposed in the cavity and at least between the first bonding pad and the second bonding pad to connect the first bonding pad and the second bonding pad.