公开(公告)号：US20230420395A1

公开(公告)日：2023-12-28

申请号：US17846649

申请日：2022-06-22

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wei-Cheng LIN ,  Hung-Yi LIN ,  Cheng-Yuan KUNG ,  Hsu-Chiang SHIH ,  Cheng-Yu HO

IPC: H01L23/66 ,  H01L23/367 ,  H01L23/48 ,  H01L23/538 ,  H01L21/48

CPC classification number: H01L23/66 ,  H01L23/367 ,  H01L23/481 ,  H01L23/5383 ,  H01L23/5386 ,  H01L23/5389 ,  H01L21/4853 ,  H01L21/4857 ,  H01L2223/6677

Abstract: The present disclosure provides an electronic device. The electronic device includes a first electronic component and a second electronic component. The first electronic component is configured to receive a radio frequency (RF) signal and amplify a power of the RF signal. The second electronic component is disposed under the first electronic component. The second electronic component includes an interconnection structure passing through the second electronic component. The interconnection structure is configured to provide a path for a transmission of the RF signal.