公开(公告)号：US11973039B2

公开(公告)日：2024-04-30

申请号：US17336078

申请日：2021-06-01

Applicant: ADVANCED SEMICONDUCTOR ENGINEERING, INC.

Inventor： Chia-Hao Sung ,  Hsuan-Yu Chen ,  Yu-Kai Lin

IPC: H01L23/00 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H01L23/538

CPC classification number: H01L23/562 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/565 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/5383 ,  H01L23/5386 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L2224/214 ,  H01L2924/3511

Abstract: A semiconductor device package includes a semiconductor die, a first conductive element, a second conductive element, a metal layer, and a first redistribution layer (RDL). The semiconductor die includes a first surface and a second surface opposite to the first surface. The first conductive element is disposed on the second surface of the semiconductor die. The second conductive element is disposed next to the semiconductor die. The metal layer is disposed on the second conductive element and electrically connected to the second conductive element. The first RDL is disposed on the metal layer and electrically connected to the metal layer.

公开(公告)号：US11024586B2

公开(公告)日：2021-06-01

申请号：US16254382

申请日：2019-01-22

Applicant: ADVANCED SEMICONDUCTOR ENGINEERING, INC.

Inventor： Chia-Hao Sung ,  Hsuan-Yu Chen ,  Yu-Kai Lin

IPC: H01L23/31 ,  H01L21/48 ,  H01L23/00 ,  H01L23/538 ,  H01L21/56

Abstract: A semiconductor device package includes a semiconductor die, a first conductive element, a second conductive element, a metal layer, and a first redistribution layer (RDL). The semiconductor die includes a first surface and a second surface opposite to the first surface. The first conductive element is disposed on the second surface of the semiconductor die. The second conductive element is disposed next to the semiconductor die. The metal layer is disposed on the second conductive element and electrically connected to the second conductive element. The first RDL is disposed on the metal layer and electrically connected to the metal layer.

公开(公告)号：US10269771B2

公开(公告)日：2019-04-23

申请号：US15675612

申请日：2017-08-11

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Li-Hao Lyu ,  Chieh-Ju Tsai ,  Yu-Kai Lin ,  Wei-Ming Hsieh ,  Yu-Pin Tsai ,  Man-Wen Tseng ,  Yu-Ting Lu

IPC: H01L23/48 ,  H01L25/065 ,  H01L23/28 ,  H01L23/31 ,  H01L23/427 ,  H01L23/498 ,  H01L23/00 ,  H01L21/56 ,  H01L23/538

Abstract: A semiconductor device package comprises an adhesive layer, a die on the adhesive layer, a first encapsulation layer encapsulating the die and the adhesive layer, and a second encapsulation layer adjacent to the first encapsulation layer and the adhesive layer. The second encapsulation layer has a first surface and a second surface different from the first surface. A contact angle of the first surface of the second encapsulation layer is different from a contact angle of the second surface of the second encapsulation layer.