公开(公告)号：US20190267417A1

公开(公告)日：2019-08-29

申请号：US16287970

申请日：2019-02-27

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yu-Min PENG

IPC: H01L27/146

Abstract: A semiconductor device package includes a semiconductor device, an optical conductive pillar, a first encapsulant and a second encapsulant. The semiconductor device includes a pixel. The optical conductive pillar is disposed on the pixel. The first encapsulant has a first thickness and encapsulates the optical conductive pillar. The second encapsulant has a second thickness different from the first thickness.

公开(公告)号：US20210358823A1

公开(公告)日：2021-11-18

申请号：US16877197

申请日：2020-05-18

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chi Sheng TSENG ,  Lu-Ming LAI ,  Yu-Che HUANG ,  Shih-Chieh TANG ,  Yu-Min PENG ,  Hui-Chung LIU

IPC: H01L23/31 ,  H01L21/56

Abstract: A semiconductor package structure and a method for manufacturing a semiconductor package structure are provided. The semiconductor package structure includes a semiconductor package structure includes a semiconductor die and a light absorbing layer. The semiconductor die has a first surface, a second surface and a third surface. An active layer of the semiconductor die is adjacent to the first surface. The second surface is opposite to the first surface. The third surface extends from the first surface to the second surface. The light absorbing layer covers the second surface and the third surface of the semiconductor die. The semiconductor die has a thickness defined from the first surface to the second surface, and the thickness of the semiconductor die is less than or equal to about 300 micrometers (μm).

公开(公告)号：US20180066982A1

公开(公告)日：2018-03-08

申请号：US15687090

申请日：2017-08-25

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yu-Min PENG ,  Ching-Han HUANG ,  Lu-Ming LAI

IPC: G01J1/04

CPC classification number: G01J1/0407 ,  G01J1/0422

Abstract: The present disclosure relates to an optical device. The optical device comprises an electronic component, a plurality of light conducting pillars and an opaque layer. The electronic component includes a plurality of pixels. Each of the light conducting pillars is disposed over a corresponding pixel of the plurality of pixels of the electronic component. The opaque layer covers a lateral surface of each of the light conducting pillars.