公开(公告)号：US20220068747A1

公开(公告)日：2022-03-03

申请号：US17006664

申请日：2020-08-28

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yu-Che HUANG ,  Lu-Ming LAI ,  Ying-Chung CHEN

IPC: H01L23/32 ,  H01L23/498 ,  H01L21/48

Abstract: A semiconductor package structure and a method for manufacturing a semiconductor package structure are provided. The semiconductor package structure includes a semiconductor package device, a first constraint structure and a second constraint structure. The first constraint structure is connected to the semiconductor package device. The second constraint structure is connected to the semiconductor package device and under a projection of the semiconductor package device.

公开(公告)号：US20200035851A1

公开(公告)日：2020-01-30

申请号：US16518792

申请日：2019-07-22

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang Chin TSAI ,  Yu-Che HUANG ,  Hsun-Wei CHAN

IPC: H01L31/12

Abstract: An optical device includes a substrate, an electronic component and a lid. The electronic component is disposed on the substrate. The lid is disposed on the substrate. The lid has a first cavity over the electronic component and a second cavity over the first cavity. The sidewall of the second cavity is inclined.

公开(公告)号：US20230063405A1

公开(公告)日：2023-03-02

申请号：US17465713

申请日：2021-09-02

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Shih-Chieh TANG ,  Lu-Ming LAI ,  Yu-Che HUANG ,  Ying-Chung CHEN

IPC: G02B6/42

Abstract: The present disclosure provides an optical module. The optical module includes an optical component disposed in or on a carrier and configured to receive a first light. The optical component is further configured to transmit a second light to a first portion of the carrier and transmit a third light to a second portion of the carrier.

公开(公告)号：US20210082835A1

公开(公告)日：2021-03-18

申请号：US16569228

申请日：2019-09-12

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yu-Che HUANG ,  Lu-Ming LAI

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/495 ,  H01L21/48 ,  H01L21/56

Abstract: A semiconductor device package and a method for packaging the same are provided. A semiconductor device package includes a carrier, an electronic component, a buffer layer, a reinforced structure, and an encapsulant. The electronic component is disposed over the carrier and has an active area. The buffer layer is disposed on the active area of the electronic component. The reinforced structure is disposed on the buffer layer. The encapsulant encapsulates the carrier, the electronic component and the reinforced structure.

公开(公告)号：US20240427092A1

公开(公告)日：2024-12-26

申请号：US18830534

申请日：2024-09-10

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Shih-Chieh TANG ,  Lu-Ming LAI ,  Yu-Che HUANG ,  Ying-Chung CHEN

IPC: G02B6/42

Abstract: The present disclosure provides an optical module. The optical module includes an optical component disposed in or on a carrier and configured to receive a first light. The optical component is further configured to transmit a second light to a first portion of the carrier and transmit a third light to a second portion of the carrier.

公开(公告)号：US20220416111A1

公开(公告)日：2022-12-29

申请号：US17899552

申请日：2022-08-30

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang Chin TSAI ,  Yu-Che HUANG ,  Hsun-Wei CHAN

IPC: H01L31/12

Abstract: An optical device includes a substrate, an electronic component and a lid. The electronic component is disposed on the substrate. The lid is disposed on the substrate. The lid has a first cavity over the electronic component and a second cavity over the first cavity. The sidewall of the second cavity is inclined.

公开(公告)号：US20220199550A1

公开(公告)日：2022-06-23

申请号：US17129641

申请日：2020-12-21

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chi Sheng TSENG ,  Lu-Ming LAI ,  Hui-Chung LIU ,  Yu-Che HUANG

IPC: H01L23/00 ,  H01L23/538 ,  H01R12/61 ,  H01L21/50 ,  G01L1/26

Abstract: A semiconductor device package and a method for manufacturing a semiconductor device package are provided. The semiconductor device package includes a carrier, a sensor module, a connector, and a stress buffer structure. The sensor module is disposed on the carrier. The connector is connected to the carrier. The stress buffer structure connects the connector to the sensor module.

公开(公告)号：US20220139812A1

公开(公告)日：2022-05-05

申请号：US17088449

申请日：2020-11-03

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yu-Che HUANG ,  Chang Chin TSAI

IPC: H01L23/495 ,  H01L23/31 ,  H01L21/48 ,  H01L23/00 ,  H01L21/56

Abstract: A semiconductor package structure and a method for manufacturing a semiconductor package structure are provided. The semiconductor package structure includes a carrier, a first encapsulant, and an interposer. The first encapsulant is on the carrier and defines a cavity. The interposer is disposed between the first encapsulant and the cavity. The first encapsulant covers a portion of the interposer.

公开(公告)号：US20210358823A1

公开(公告)日：2021-11-18

申请号：US16877197

申请日：2020-05-18

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chi Sheng TSENG ,  Lu-Ming LAI ,  Yu-Che HUANG ,  Shih-Chieh TANG ,  Yu-Min PENG ,  Hui-Chung LIU

IPC: H01L23/31 ,  H01L21/56

Abstract: A semiconductor package structure and a method for manufacturing a semiconductor package structure are provided. The semiconductor package structure includes a semiconductor package structure includes a semiconductor die and a light absorbing layer. The semiconductor die has a first surface, a second surface and a third surface. An active layer of the semiconductor die is adjacent to the first surface. The second surface is opposite to the first surface. The third surface extends from the first surface to the second surface. The light absorbing layer covers the second surface and the third surface of the semiconductor die. The semiconductor die has a thickness defined from the first surface to the second surface, and the thickness of the semiconductor die is less than or equal to about 300 micrometers (μm).