公开(公告)号：US20210036658A1

公开(公告)日：2021-02-04

申请号：US17074618

申请日：2020-10-19

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chi Sheng TSENG ,  Lu-Ming LAI ,  Ching-Han HUANG ,  Hui-Chung LIU ,  Kuo-Hua LAI ,  Cheng-Ling HUANG

IPC: H03B5/04 ,  H01L23/13 ,  H01L23/00 ,  H01L23/36 ,  H03B5/30 ,  H01L23/14 ,  B81B7/00 ,  H03B5/36 ,  H03L1/04 ,  H03B1/02

Abstract: A semiconductor package structure includes an organic substrate having a first surface, a first recess depressed from the first surface, a first chip over the first surface and covering the first recess, thereby defining a first cavity enclosed by a back surface of the first chip and the first recess, and a second chip over the first chip. The first cavity is an air cavity or a vacuum cavity.

公开(公告)号：US20210257988A1

公开(公告)日：2021-08-19

申请号：US16794112

申请日：2020-02-18

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chi Sheng TSENG ,  Lu-Ming LAI ,  Ching-Han HUANG ,  Kuo-Hua LAI ,  Hui-Chung LIU

IPC: H03H9/24 ,  H03H3/007 ,  H03H9/05 ,  H03H9/08 ,  H03H9/10

Abstract: The present disclosure provides a semiconductor package structure. The semiconductor package structure includes a substrate, a first electronic component and a support component. The first electronic component is disposed on the substrate. The first electronic component has a backside surface facing a first surface of the substrate. The support component is disposed between the backside surface of the first electronic component and the first surface of the substrate. The backside surface of the first electronic component has a first portion connected to the support component and a second portion exposed from the support component.

公开(公告)号：US20190013346A1

公开(公告)日：2019-01-10

申请号：US15644650

申请日：2017-07-07

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chi Sheng TSENG

IPC: H01L27/146

Abstract: An image sensor comprises a chip, a first redistribution layer (RDL), a second RDL and a third RDL. The chip has a first surface, a second surface opposite to the first surface and a lateral surface extending between the first surface and the second surface. The first RDL is disposed on the first surface of the chip and extends along the first surface of the chip and beyond the lateral surface of the chip. The second RDL is disposed on the second surface of the chip. The third RDL is disposed on the lateral surface of the chip and connects the first RDL to the second RDL.

公开(公告)号：US20220404908A1

公开(公告)日：2022-12-22

申请号：US17352125

申请日：2021-06-18

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chi Sheng TSENG ,  Lu-Ming LAI ,  Hui-Chung LIU ,  I Hung WU ,  Kai-Sheng PAI

IPC: G06F3/01 ,  H01Q1/27 ,  G06K19/077 ,  G01S13/75

Abstract: The present disclosure provides a body-part tracking device and a body-part tracking method. The body-part tracking device includes a first electronic component and a first antenna element. The first antenna element is electrically connected to the first electronic component and configured to receive a first wave. The first electronic component is configured to, in response to the first wave, transmit a second wave.

公开(公告)号：US20210202780A1

公开(公告)日：2021-07-01

申请号：US16732161

申请日：2019-12-31

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chi Sheng TSENG ,  Hui-Chung LIU ,  Ching-Han HUANG

IPC: H01L31/12 ,  H01L31/153 ,  H01L31/18

Abstract: An optical package structure includes a substrate, an emitter, a first detector and a light-absorption material. The substrate has a first surface and a second surface opposite to the first surface, the substrate includes a via defining a third surface extending from the first surface to the second surface. The emitter is disposed on the first surface of the substrate. The first detector is disposed on the first surface and aligned with the via of the substrate. The light-absorption material is disposed on the third surface of the substrate.

公开(公告)号：US20230208394A1

公开(公告)日：2023-06-29

申请号：US18112464

申请日：2023-02-21

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chi Sheng TSENG ,  Lu-Ming LAI ,  Ching-Han HUANG ,  Kuo-Hua LAI ,  Hui-Chung LIU

IPC: H03H9/24 ,  H03H3/007 ,  H03H9/10 ,  H03H9/08 ,  H03H9/05 ,  H03L1/02 ,  H03L1/04

CPC classification number: H03H9/2426 ,  H03H3/0073 ,  H03H9/1057 ,  H03H9/08 ,  H03H9/0547 ,  H03L1/028 ,  H03L1/04

Abstract: The present disclosure provides a semiconductor package structure. The semiconductor package structure includes a substrate, a first electronic component and a support component. The first electronic component is disposed on the substrate. The first electronic component has a backside surface facing a first surface of the substrate. The support component is disposed between the backside surface of the first electronic component and the first surface of the substrate. The backside surface of the first electronic component has a first portion connected to the support component and a second portion exposed from the support component.

公开(公告)号：US20210082791A1

公开(公告)日：2021-03-18

申请号：US16570841

申请日：2019-09-13

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chi Sheng TSENG ,  Lu-Ming LAI ,  Ying-Chung CHEN ,  Hui-Chung LIU

IPC: H01L23/495 ,  H01L21/48

Abstract: A lead frame includes a die pad having a pad top surface and a pad bottom surface opposite to the top pad surface, a plurality of leads, each having a top lead surface and a bottom lead surface opposite to the top lead surface and disposed around the die pad, and a first molding compound disposed between the die pad and each of the leads. The first molding compound exposes the top pad surface of the die pad by covering a portion of the periphery of the top pad surface of the die pad. A method for manufacturing the lead frame is also disclosed.

公开(公告)号：US20200002162A1

公开(公告)日：2020-01-02

申请号：US16452370

申请日：2019-06-25

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chi Sheng TSENG ,  Lu-Ming LAI ,  Yu-Hsuan TSAI ,  Yin-Hao CHEN ,  Hsin Lin WU ,  San-Kuei YU

IPC: B81C1/00 ,  H01L23/498 ,  H01L23/00 ,  B81B7/00

Abstract: A semiconductor device package includes a semiconductor device, a non-semiconductor substrate over the semiconductor device, and a first connection element extending from the semiconductor device to the non-semiconductor substrate and electrically connecting the semiconductor device to the non-semiconductor substrate.

公开(公告)号：US20250096774A1

公开(公告)日：2025-03-20

申请号：US18967532

申请日：2024-12-03

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chi Sheng TSENG ,  Lu-Ming LAI ,  Ching-Han HUANG ,  Kuo-Hua LAI ,  Hui-Chung LIU

IPC: H03H9/24 ,  H03H3/007 ,  H03H9/05 ,  H03H9/08 ,  H03H9/10 ,  H03L1/02 ,  H03L1/04

Abstract: The present disclosure provides a semiconductor package structure. The semiconductor package structure includes a substrate, a first electronic component and a support component. The first electronic component is disposed on the substrate. The first electronic component has a backside surface facing a first surface of the substrate. The support component is disposed between the backside surface of the first electronic component and the first surface of the substrate. The backside surface of the first electronic component has a first portion connected to the support component and a second portion exposed from the support component.

公开(公告)号：US20220199550A1

公开(公告)日：2022-06-23

申请号：US17129641

申请日：2020-12-21

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chi Sheng TSENG ,  Lu-Ming LAI ,  Hui-Chung LIU ,  Yu-Che HUANG

IPC: H01L23/00 ,  H01L23/538 ,  H01R12/61 ,  H01L21/50 ,  G01L1/26

Abstract: A semiconductor device package and a method for manufacturing a semiconductor device package are provided. The semiconductor device package includes a carrier, a sensor module, a connector, and a stress buffer structure. The sensor module is disposed on the carrier. The connector is connected to the carrier. The stress buffer structure connects the connector to the sensor module.