公开(公告)号：US20210057398A1

公开(公告)日：2021-02-25

申请号：US16550111

申请日：2019-08-23

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ming-Hung CHEN ,  Sheng-Yu CHEN ,  Chang-Lin YEH ,  Yung-I YEH

IPC: H01L25/16 ,  H01L27/12 ,  H01L23/00 ,  H01L33/56 ,  H01L23/48 ,  H01L23/528 ,  H01L33/62 ,  H01L23/522

Abstract: A semiconductor device package includes a first substrate, a dielectric layer, a thin film transistor (TFT) and an electronic component. The first substrate has a first surface and a second surface opposite to the first surface. The dielectric layer is disposed on the first surface of the first substrate. The dielectric layer has a first surface facing away from the first substrate and a second surface opposite to the first surface. The TFT layer is disposed on the dielectric layer. The electronic component is disposed on the second surface of the first substrate. A roughness of the first surface of the dielectric layer is less than a roughness of the first surface of the first substrate.

公开(公告)号：US20230307380A1

公开(公告)日：2023-09-28

申请号：US17705216

申请日：2022-03-25

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Cheng-Nan LIN ,  Ming-Chiang LEE ,  Yung-I YEH

IPC: H01L23/00 ,  H01L25/18 ,  H01L23/538

CPC classification number: H01L23/562 ,  H01L25/18 ,  H01L23/5385 ,  H01L24/48 ,  H01L2224/48145

Abstract: A semiconductor device package is disclosed. The semiconductor device package includes a carrier, a first electronic component disposed on the carrier and a support component disposed on the carrier. The semiconductor device package also includes a second electronic component disposed on the first electronic component and supported by the support component.

公开(公告)号：US20220102453A1

公开(公告)日：2022-03-31

申请号：US17549784

申请日：2021-12-13

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ming-Hung CHEN ,  Sheng-Yu CHEN ,  Chang-Lin YEH ,  Yung-I YEH

IPC: H01L27/32 ,  H01L29/786 ,  H01L51/52 ,  H01L27/11 ,  H01L25/16 ,  H01L27/15

Abstract: A semiconductor device package includes a display device, an electronic module and a conductive adhesion layer. The display device includes a first substrate and a TFT layer. The first substrate has a first surface and a second surface opposite to the first surface. The TFT layer is disposed on the first surface of the first substrate. The electronic module includes a second substrate and an electronic component. The second substrate has a first surface facing the second surface of the first substrate and a second surface opposite to the first surface. The electronic component is disposed on the second surface of the second substrate. The conductive adhesion layer is disposed between the first substrate and the second substrate.

公开(公告)号：US20240126327A1

公开(公告)日：2024-04-18

申请号：US17966700

申请日：2022-10-14

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chao Wei LIU ,  Wei-Hao CHANG ,  Yung-I YEH ,  Jen-Chieh KAO ,  Tun-Ching PI ,  Ming-Hung CHEN ,  Hui-Ping JIAN ,  Shang-Lin WU

IPC: G06F1/16

CPC classification number: G06F1/163 ,  G06F1/1632

Abstract: The present disclosure provides an electronic wearable device. The electronic wearable device includes a first module having a first contact and a second module having a second contact. The first contact is configured to keep electrical connection with the second contact in moving with respect to each other during a wearing period.

公开(公告)号：US20210159188A1

公开(公告)日：2021-05-27

申请号：US16693191

申请日：2019-11-22

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsu-Nan FANG ,  Yung-I YEH

IPC: H01L23/00 ,  H01L25/065 ,  H01L23/31 ,  H01L25/00 ,  H01L21/56

Abstract: A package structure includes a wiring structure, a first electronic device, a second electronic device, a protection material and a reinforcement structure. The first electronic device and the second electronic device are electrically connected to the wiring structure. The protection material is disposed between the first electronic device and the wiring structure and between the second electronic device and the wiring structure. The reinforcement structure is disposed on and contacts the first electronic device and the second electronic device. The reinforcement structure contacts the protection material.

公开(公告)号：US20210057572A1

公开(公告)日：2021-02-25

申请号：US16550110

申请日：2019-08-23

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ming-Hung CHEN ,  Sheng-Yu CHEN ,  Chang-Lin YEH ,  Yung-I YEH

IPC: H01L29/786 ,  H01L27/32 ,  H01L27/11 ,  H01L51/52

Abstract: A semiconductor device package includes a display device, an electronic module and a conductive adhesion layer. The display device includes a first substrate and a TFT layer. The first substrate has a first surface and a second surface opposite to the first surface. The TFT layer is disposed on the first surface of the first substrate. The electronic module includes a second substrate and an electronic component. The second substrate has a first surface facing the second surface of the first substrate and a second surface opposite to the first surface. The electronic component is disposed on the second surface of the second substrate. The conductive adhesion layer is disposed between the first substrate and the second substrate.