公开(公告)号：US06591689B2

公开(公告)日：2003-07-15

申请号：US09894907

申请日：2001-06-29

申请人： Akira Nidan ,  Takafumi Taki ,  Hideaki Hara ,  Michihiro Masuda ,  Kaname Ban ,  Kazuo Tanaka ,  Yoshifumi Murakami

发明人： Akira Nidan ,  Takafumi Taki ,  Hideaki Hara ,  Michihiro Masuda ,  Kaname Ban ,  Kazuo Tanaka ,  Yoshifumi Murakami

IPC分类号： G01L916

CPC分类号： G01L19/0084 ,  G01L9/0054 ,  G01L19/147 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： A pressure sensor has a sensor chip with a diaphragm formed therein and bumps formed thereon, and a stem with leads extending from a surface thereof to the sensor chip. The bumps and the leads are electrically connected by face down bonding so that a surface of the sensor chip faces the surface of the stem. In this manner, bonding wires are unnecessary. Therefore, an area for disposing the bonding wires in the stem can be cut down, so that the pressure sensor can be miniaturized.

公开(公告)号：US06300155B1

公开(公告)日：2001-10-09

申请号：US09538491

申请日：2000-03-30

申请人： Takafumi Taki ,  Ryoichi Handa

发明人： Takafumi Taki ,  Ryoichi Handa

IPC分类号： H01L2100

CPC分类号： G01L19/0627 ,  H01L21/56 ,  H01L21/565 ,  H01L2224/48091 ,  H01L2924/01078 ,  H01L2924/00014

摘要： An electronic part is disposed in a space defined by upper and lower frames joined together. The upper frame has an opening portion, and a hollow packing member is disposed in the opening portion to expose a specific region of the electronic part. The upper and lower frames are further covered with a cover having a window portion at a position corresponding to the hollow portion of the packing member. In this state, a thin film is formed through the hollow portion to coat the specific region of the electronic part. The thin film is not adhered to the upper and lower frames. Accordingly, the upper and lower frames can be reused to form the thin film onto another electronic part successively.

摘要翻译： 电子部件设置在由连接在一起的上框架和下框架限定的空间中。 上框架具有开口部分，并且中空包装件设置在开口部分中以暴露电子部件的特定区域。 上框架和下框架进一步用盖子覆盖，该盖子在与包装件的中空部分对应的位置处具有窗口部分。 在这种状态下，通过中空部分形成薄膜以涂覆电子部件的特定区域。 薄膜不粘附在上框架和下框架上。 因此，可以重新使用上框架和下框架，以将薄膜依次形成到另一电子部件上。

公开(公告)号：US5867388A

公开(公告)日：1999-02-02

申请号：US617168

申请日：1996-03-18

申请人： Toshihiro Okumura ,  Takafumi Taki ,  Masaaki Kuroyanagi

发明人： Toshihiro Okumura ,  Takafumi Taki ,  Masaaki Kuroyanagi

IPC分类号： B65G1/00 ,  G06F19/00

CPC分类号： B65G1/00 ,  G06F19/00

摘要： A controller of a conveyance system efficiently conveys parts. The controller includes an input/output interface receiving data related to the position and loading state of data of each vehicle; receiving carry-in/out requests from each job shop; and outputting carry-in/out instructions to each vehicle. The controller also includes a ROM storing a control program; a RAM storing job shop positional data, carry-in/out requests, vehicle loading state data; and a processing section computing values of a carriage instruction (e.g., origin, destination, carrier to be carried, carrying route) given to each vehicle using the carry-in/out request data from each job shop and the data stored in the RAM based on the program stored in the ROM.

摘要翻译： 输送系统的控制器有效地传送零件。 控制器包括接收与每个车辆的数据的位置和装载状态有关的数据的输入/输出接口; 接收每个工作车间的进/出请求; 并向每个车辆输出进/出指令。 控制器还包括存储控制程序的ROM; 存储作业车间位置数据的RAM，进/出请求，车辆装载状态数据; 以及处理部分，使用来自每个作业车间的进/出请求数据和存储在RAM中的数据来计算给予每个车辆的运送指令（例如，要运送的原点，目的地，运营商，运送路线）的值 在存储在ROM中的程序。